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R5F2122CJFP#U0
Renesas Electronics
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1 | The R8C/22 Group is supported only for customers who have already adopted these products. The RL78/F12, F13, F14, F15 Groups are recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This Furthermore, the data fl | Quad Flat Packages | R5F2122CJFP#U0 |
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R5F21254SNFP#V2
Renesas Electronics
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1 | The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu | Quad Flat Packages | R5F21254SNFP#V2 |
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R5F21274SDFP#V2
Renesas Electronics
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1 | The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data | Quad Flat Packages | R5F21274SDFP#V2 |
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R5F21336DNFP#V2
Renesas Electronics
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1 | The R8C/33D Group is supported only for customers who have already adopted these products.The R8C/33D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed | Quad Flat Packages | R5F21336DNFP#V2 |
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R5F21336CDFP#30
Renesas Electronics
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1 | The R8C/33C Group is supported only for customers who have already adopted these products.The R8C/33C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed | Quad Flat Packages | R5F21336CDFP#30 |
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R5F21236DFP#U0
Renesas Electronics
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1 | The R8C/23 Group is supported only for customers who have already adopted these products.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and suited to in-vehicle or FA networking. Furthermore, | Quad Flat Packages | R5F21236DFP#U0 |
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R5F212K2SNFP#X6
Renesas Electronics
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1 | The R8C/2K Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/2H Group and R8C/2J Group of single-chip MCUs incorporate the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the suppo | Quad Flat Packages | R5F212K2SNFP#X6 |
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R5F21357CNFP#V0
Renesas Electronics
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1 | The R8C/35C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/35C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating | Quad Flat Packages | R5F21357CNFP#V0 |
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R5F21355CNFP#V2
Renesas Electronics
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1 | The R8C/35C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/35C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating | Quad Flat Packages | R5F21355CNFP#V2 |
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R5F21357CNFP#X4
Renesas Electronics
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1 | The R8C/35C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/35C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating | Quad Flat Packages | R5F21357CNFP#X4 |
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R5F21292SNSP#W4
Renesas Electronics
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1 | The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat | Small Outline Packages | R5F21292SNSP#W4 |
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R5F21284SDSP#U0
Renesas Electronics
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1 | The R8C/28 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data | Small Outline Packages | R5F21284SDSP#U0 |
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R5F212DCSNFP#V2
Renesas Electronics
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1 | The R8C/2D Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/2C Group and R8C/2D Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp | Quad Flat Packages | R5F212DCSNFP#V2 |
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R5F21344CDFP#U0
Renesas Electronics
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1 | The R8C/34C Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/34C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Quad Flat Packages | R5F21344CDFP#U0 |
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R5F21334TDFP
Renesas Electronics
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1 | Renesas Electronics R5F21334TDFP, 32bit R8C Microcontroller, 20MHz, 16 kB Flash, 32-Pin LQFP | Quad Flat Packages | R5F21334TDFP |
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R5F213G6DDSP
Renesas Electronics
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1 | Renesas Technology R5F213G6DDSP, 16/32bit R8C Microcontroller, 20MHz, 32 kB ROM, 24-Pin LSSOP | Small Outline Packages | R5F213G6DDSP |
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R5F21144SP#U0
Renesas Electronics
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1 | 16-bit Microcontrollers - MCU MCU 3/5V 16K PbFree 20-SSOP | Small Outline Packages | R5F21144SP#U0 |
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R5F21133FP#U0
Renesas Electronics
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1 | 16-bit Microcontrollers - MCU MCU 3/5V 12K Pb-Free 32-LQFP | Quad Flat Packages | R5F21133FP#U0 |
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R5F21103FP#U0
Renesas Electronics
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1 | 16-bit Microcontrollers - MCU MCU 3/5V 12K Pb-Free 32-LQFP | Quad Flat Packages | R5F21103FP#U0 |
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R5F21114FP
Renesas Electronics
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1 | 16bit R8C/11 Microcontroller, 20MHz, 16 kB Flash, 32-Pin LQFP | Quad Flat Packages | R5F21114FP |
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R5F2138CCDFP
Renesas Electronics
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1 | Renesas Technology R5F2138CCDFP, 16/32bit R8C Microcontroller, 20MHz, 128 kB ROM, 80-Pin LQFP | Quad Flat Packages | R5F2138CCDFP |
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R5F212DCSNFP
Renesas Electronics
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1 | Single-chip MCU Flash Memory 128Kbytes ROM | Quad Flat Packages | R5F212DCSNFP |
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R5F212BCSDFA#U0
Renesas Electronics
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1 | RENESAS - R5F212BCSDFA#U0 - MCU, 16BIT, R8C, 20MHZ, LQFP-64 | Quad Flat Packages | R5F212BCSDFA#U0 |
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R5F21194SP
Renesas Electronics
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1 | Microcontroller | Small Outline Packages | R5F21194SP |
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R5F212BCSNFA#U0
Renesas Electronics
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1 | IC MCU 16BIT 128KB FLASH 64LQFP | Quad Flat Packages | R5F212BCSNFA#U0 |
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