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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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3-794618-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | Number of Rows 2 | Number of Power Positions 6 | PCB Mount Orientation Right Angle | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Other | 3-794618-6 |
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2-1445088-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Contact Features: Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Retention Within Housing Without | Contact Type Pin | Contact Layout Inline | PCB Contact Terminati | Other | 2-1445088-4 |
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4-794618-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Power Positions 10 | Number of Positions 10 | Contact Features: Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plat | Other | 4-794618-0 |
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2-1445093-2
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Pla | Other | 2-1445093-2 |
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2-1445093-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 4 | Number of Power Positions 4 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact | Other | 2-1445093-4 |
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2-1445093-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 4 | Number of Power Positions 4 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact | Other | 2-1445093-4 |
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2-1445093-8
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 8 | PCB Mount Orientation Vertical | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Layout Inline | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Ter | Other | 2-1445093-8 |
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5-147279-4
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Board-to-Board Configuration Parallel | Number of Positions 4 | Connector Contact Load Condition Fully Loaded | Number of Rows 2 | Contact Features: Contact Current Rating (Max) 3 AMP | Contact Shape & Form Square | Contact Mating Area Plating Material Thickness .762 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Mating Square Post Dimension .025 INCH | Contact Mating Area Plating Material | Other | 5-147279-4 |
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2-1445098-8
TE Connectivity
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1 | Connector Header Through Hole, Right Angle 8 position 0.118" (3.00mm) | Other | 2-1445098-8 |
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2-1445098-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 2 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Retenti | Other | 2-1445098-2 |
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2-1445089-4
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Contact Features: Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Layout Inline | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Platin | Other | 2-1445089-4 |
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2-1445087-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Rows 1 | Number of Positions 6 | PCB Mount Orientation Vertical | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Mater | Other | 2-1445087-6 |
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2-1445088-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 3 | Number of Power Positions 3 | Number of Rows 1 | Contact Features: Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | Contact Ma | Other | 2-1445088-3 |
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2-1445091-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 4 | Number of Power Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating | Other | 2-1445091-4 |
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4-641208-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 10 | Number of Positions 10 | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 7 AMP | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Tin | Mating Post Length .4 INCH | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material | Other | 4-641208-0 |
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3-641216-2
TE Connectivity
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1 | TE Connectivity MTA-100 Series, 3.56mm Pitch 2 Way 1 Row Right Angle PCB Header, Solder Termination | Header, Shrouded - Straight PTH Box | 3-641216-2 |
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7-146252-5
TE Connectivity
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1 | TE Connectivity AMPMODU Series, 2.54mm Pitch 50 Way 2 Row Straight PCB Header, Through Hole Termination, 3A | Header, Vertical | 7-146252-5 |
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5-146281-2
TE Connectivity
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1 | Headers & Wire Housings 2 P HEADER GOLD 30u single row | Other | 5-146281-2 |
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AD8342ACPZ-REEL7
Analog Devices
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1 | Up/Down Conv Mixer 5V 3.8GHz 16-Pin LFCSP EP T/R | Quad Flat No-Lead | AD8342ACPZ-REEL7 |
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5-103635-5
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 6 | Contact Features: Contact Mating Area Plating Material Thickness .381 MICM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | Mating Square Post Dimension .64 MM | Contact Shape & Form Square | Contact Base Material Brass | Contact Mating Area Length .23 INCH | Contact Mating Area Plati | Header, Shrouded - Right Angle PTH Box | 5-103635-5 |
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3-794631-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 2 | PCB Mount Orientation Vertical | Number of Power Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating | Other | 3-794631-2 |
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5-794637-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 22 | Number of Positions 22 | PCB Mount Orientation Vertical | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material G | Other | 5-794637-2 |
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2-1445053-5
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 5 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Tin, Surface Mount, Power, Black, Micro MATE-N-LOK | Other | 2-1445053-5 |
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3-794631-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Rows 2 | Number of Positions 6 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Th | Header, Shrouded - Straight PTH Box | 3-794631-6 |
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3-794680-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 4 | Number of Rows 2 | Number of Positions 4 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Thickne | Other | 3-794680-4 |
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