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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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YR1B14KCC
TE Connectivity
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1 | 14K ohm, Through-Hole Precision Resistor, Thin Film, .25 W, .1 %, ±15 ppm/°C, Axial-Leaded, Copper Termination, 6.3 x 2.3 mm, Ammo Packed, Neohm R | Resistors, Axial Diameter Horizontal Mounting | YR1B14KCC |
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86093968813H45V1LF
Amphenol Communications Solutions
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1 | Din Headers and Receptacles, Backplane connectors, Right Angle Receptacle Solder-to-Board Style R 96 ways, Class III, Tail Length: 3mm, with Harpoon | Other | 86093968813H45V1LF |
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PIC16F1459-I/SS
Microchip
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1 | 8-bit Microcontrollers - MCU 14KB Fl 1kB R 48MHz Int. Oc 18 I0 | Small Outline Packages | PIC16F1459-I/SS |
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ATSAM4C32EA-AU
Microchip
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1 | ARM Microcontrollers - MCU LQFP, Green, IND TEMP, CRYPTO, 1ph SOC, MRLB, 2048K, R | Quad Flat Packages | ATSAM4C32EA-AU |
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YR1B60R4CC
TE Connectivity
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1 | TE Connectivity R Series Axial Through Hole Fixed Resistor 60.4Ω ±0.1% 0.25W ±15ppm/°C | Resistors, Axial Diameter Horizontal Mounting | YR1B60R4CC |
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38-00-6293
Molex
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1 | Headers & Wire Housings 2.54mm KK Hdr Vt VrC r Vt VrC FL 5Sn 3Ckt | Header, Vertical | 38-00-6293 |
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T95R337K016LSAL
Vishay
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1 | Tantalum Capacitors - Solid SMD 330uF 16volts 10% R cs Conf HiRel COTS | Other | T95R337K016LSAL |
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53259-0529
Molex
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1 | Headers & Wire Housings 3.5 WtB Wafer Assy R B Wafer Assy RA 5Ckt | Other | 53259-0529 |
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YR1B143RCC
TE Connectivity
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1 | TE Connectivity R Series Axial Through Hole Fixed Resistor 143Ω ±0.1% 0.25W ±15ppm/°C | Resistors, Axial Diameter Horizontal Mounting | YR1B143RCC |
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PIC16HV753-E/ML
Microchip
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1 | 8-bit Microcontrollers - MCU 35KB Flsh 128 R 8MHz Int Osc 9-bit DAC | Quad Flat No-Lead | PIC16HV753-E/ML |
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MCP96RL01T-E/MX
Microchip
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1 | Board Mount Temperature Sensors +/- 8.0C Thermocouple to I2C converter in 5mmx5mm QFN. This device has Opens/Shorts pin detection. This device supports K, J, T, N, S, E, B, and R type thermocouples. | Quad Flat No-Lead | MCP96RL01T-E/MX |
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RNL1E102MDSASQ
Nichicon
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1 | Low ESR, High Capacitance, High ripple current.Large Sized.Load life of 2000 / 5000 hours at 105°C.Radial lead type : Lead free flow soldering conditioncorrespondence.Compliant to the RoHS directive (2011/65/EU,(EU)2015/863). R | Capacitor, Polarized Radial Diameter | RNL1E102MDSASQ |
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2SA1036KT146R
ROHM Semiconductor
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1 | • Fast switching MOSFET for SMPS• Optimized technology for DC/DC converters• Qualified according to JEDEC¹) for target applications• N-channel, normal level• Excellent gate charge x RDS(on) product (FOM)• Very low on-resistance R DS(on)• 100% Avalanche tested• Pb-free plating; RoHS compliant | SOT23 (3-Pin) | 2SA1036KT146R |
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ERBRD0R63X
Panasonic
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1 | Micro Chip Fuse, Size [L×W] (EIA) (mm): 1.0×0.5 (EIA:0402), Rated Current (A): 0.63, Internal R [at 25℃ max.] (mΩ): 220, Rated Voltage (Open Circuit Voltage) [DC] (V): 32, Interrupting Rating (A): 35, Category Temp. Range (°C): -40 to +125 | Other | ERBRD0R63X |
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ERB-RE2R50V
Panasonic
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1 | Micro Chip Fuse, Size [L×W] (EIA) (mm): 1.6×0.8 (EIA:0603), Rated Current (A): 2.5, Internal R [at 25℃ max.] (mΩ): 40, Rated Voltage (Open Circuit Voltage) [DC] (V): 32, Interrupting Rating (A): 50, Category Temp. Range (°C): -40 to +125 | Other | ERB-RE2R50V |
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ERBRD1R25X
Panasonic
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1 | Micro Chip Fuse, Size [L×W] (EIA) (mm): 1.0×0.5 (EIA:0402), Rated Current (A): 1.25, Internal R [at 25℃ max.] (mΩ): 82, Rated Voltage (Open Circuit Voltage) [DC] (V): 32, Interrupting Rating (A): 35, Category Temp. Range (°C): -40 to +125 | Other | ERBRD1R25X |
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ERB-RD5R00X
Panasonic
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1 | Micro Chip Fuse, Size [L×W] (EIA) (mm): 1.0×0.5 (EIA:0402), Rated Current (A): 5, Internal R [at 25℃ max.] (mΩ): 19, Rated Voltage (Open Circuit Voltage) [DC] (V): 32, Interrupting Rating (A): 35, Category Temp. Range (°C): -40 to +125 | Other | ERB-RD5R00X |
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1721012
Phoenix Contact
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1 | PC 5/ 2-GFU-7,62 - PCB headers, nominal cross section: 6 mm2, color: green, nominal current: 32 A, rated voltage (III/2): 630 V, contact surface: Sn, contact connection type: Pin, number of potentials: 2, number of rows: 1, number of positions: 2, number of connections: 2, product range: PC 5/..-GFU, pitch: 7.62 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 4.2 mm, number of solder pins per potential: 3, plug-in system: COMBICON PC 5, Pin connector pattern alignment: r | Other | 1721012 |
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ISL3177EIBZ-T
Renesas Electronics
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1 | The Renesas ISL317xE are ±15kV IEC61000 ESD protected, 3. 3V powered single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. These devices have very low bus currents (+125µA/-100µA), so they present a true “1/8 unit load” to the RS-485 bus. This allows up to 256 transceivers on the network without violating the RS-485 specification's 32 unit load maximum, and without using repeaters. For example, in a remote utility meter reading system, individual meter readings are r | Small Outline Packages | ISL3177EIBZ-T |
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R7FS124773A01CFL#HA1
Renesas Electronics
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1 | Uniquely suited for simple battery-operated sensing applications that require low power operation modes and fast wake-up times, the S124 MCU Group has 128 KB of flash memory and 16 KB of SRAM. It includes a 14-bit A/D Converter, 12-bit D/A Converter, and a Capacitive Touch Sensing Unit, in addition to safety and security features.Synergy Software Package (SSP)Commercial software worth over $100K which is available to developers using the Synergy Platform for no charge and with unlimited production license r | Quad Flat Packages | R7FS124773A01CFL#HA1 |
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ADM3068EARZ-R7
Analog Devices
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1 | TIA/EIA RS-485 compliant over full supply range► 3.0 V to 5.5 V operating voltage range on VCC► 1.62 V to 5.5 V VIO logic supply option available► ESD protection on the bus pins► IEC 61000-4-2 ≥ ±12 kV contact discharge► IEC 61000-4-2 ≥ ±12 kV air discharge► HBM ≥ ±30 kV► Full hot swap support (glitch free power-up/power-down)► High speed 50 Mbps data rate (ADM3065E/ADM3066E/ADM3067E/ADM3068E)► Low speed 500 kbps data rate for long cables (ADM3061E/ADM3062E/ADM3063E/ADM3064E)► Full r | Small Outline Packages | ADM3068EARZ-R7 |
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R7FS124763A01CFL#BA1
Renesas Electronics
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1 | Uniquely suited for simple battery-operated sensing applications that require low power operation modes and fast wake-up times, the S124 MCU Group has 128 KB of flash memory and 16 KB of SRAM. It includes a 14-bit A/D Converter, 12-bit D/A Converter, and a Capacitive Touch Sensing Unit, in addition to safety and security features.Synergy Software Package (SSP)Commercial software worth over $100K which is available to developers using the Synergy Platform for no charge and with unlimited production license r | Quad Flat Packages | R7FS124763A01CFL#BA1 |
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796864-2
TE Connectivity
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1 | Body Features: Primary Product Color Green | Product Orientation Right Angle | Configuration Features: Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 15 AMP | Electrical Characteristics: Operating Voltage 300 VAC | Housing Features: Centerline (Pitch) 5 MM | Housing Material PA 66 | Centerline (Pitch) .197 INCH | Mechanical Attachment: Connector Mounting Type Board Mount | Mounting R | Other | 796864-2 |
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AT25QL128A-MHE-T
Renesas Electronics
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1 | The AT25QL128A is a member of our standard class code and data storage solutions designed for low voltage systems in which program code is shadowed from Flash memory into embedded or external RAM for execution.The architecture includes standard erase block sizes and a security register for unique device serialization, system-level Electronic Serial Number (ESN) storage, locked key storage, etc.tQuad enabled at the factorytUniversally compatible pinout and command settStandard block architecturetContinuous r | Small Outline No-lead | AT25QL128A-MHE-T |
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3-338313-2
TE Connectivity
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1 | Body Features: Shell Plating Material Tin | Assembly Process Feature Material Phosphor Bronze | Primary Product Color Black | Connector Profile Standard | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 9 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Shape & Form Round | Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact Current R | Other | 3-338313-2 |
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