2.5M5 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	W25M512JWBAM Winbond	1	512Mb Serial NOR Flash 104MHz TFBGA (5X5)24	BGA	W25M512JWBAM	3D model available Symbol and footprint available 3	1 Download Model
	C1210F225M5RAC7210 Yageo Group	1	SMD, MLCC, Open Mode, Temperature Stable	Other	C1210F225M5RAC7210	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWFSQ Winbond	1	Serial NOR Flash 104MHz	Small Outline Packages	W25M512JWFSQ	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVCAM Winbond	1	Serial NOR Flash 104MHz	BGA	W25M512JVCAM	3D model available Symbol and footprint available 3	1 Download Model

	C1825C125M5UACTM Yageo Group	1	SMD Comm Z5U, Ceramic, 1.2 uF, 20%, 50 VDC, 125 VDC, 85°C, 10°C, Z5U, SMD, MLCC, General Purpose, Class III, 4 % , 83.3 MOhms, 170 mg, 1825, 4.5mm, 6.4mm, 1.1mm, 0.6mm, 1000, 78 Weeks, 20	Other	C1825C125M5UACTM	3D model available Symbol and footprint available 3	1 Download Model
	C1825C125M5RAC7210 Yageo Group	1	SMD Comm X7R, Ceramic, 1.2 uF, 20%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Class II, 2.5 % , 833.3 MOhms, 170 mg, 1825, 4.5mm, 6.4mm, 1.1mm, 0.6mm, 4000, 78 Weeks, 80	Other	C1825C125M5RAC7210	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWFSM Winbond	1	Serial NOR Flash 104MHz	Small Outline Packages	W25M512JWFSM	3D model available Symbol and footprint available 3	1 Download Model
	C2220C125M5RACTU Yageo Group	1	SMD Comm X7R, Ceramic, 1.2 uF, 20%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Class II, 2.5 % , 833.3 MOhms, 170 mg, 2220, 5.7mm, 5mm, 1.1mm, 0.6mm, 1000, 78 Weeks, 80	Other	C2220C125M5RACTU	3D model available Symbol and footprint available 3	1 Download Model
	C1206C225M5RACAUTO Yageo Group	1	SMD, MLCC, Temperature Stable, Automotive Grade	Other	C1206C225M5RACAUTO	3D model available Symbol and footprint available 3	1 Download Model
	C1825C225M5RAC7210 Yageo Group	1	SMD Comm X7R, Ceramic, 2.2 uF, 20%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Class II, 2.5 % , 454.5 MOhms, 240 mg, 1825, 4.5mm, 6.4mm, 1.5mm, 0.6mm, 4000, 78 Weeks, 80	Other	C1825C225M5RAC7210	3D model available Symbol and footprint available 3	1 Download Model
	C1206C225M5RECTU Yageo Group	1	SMD, MLCC, Temperature Stable, Electro Static Discharge, Class II	Other	C1206C225M5RECTU	3D model available Symbol and footprint available 3	1 Download Model
	1206B225M500CT Walsin Technology Corporation	1	Multilayer Ceramic Capacitors MLCC - SMD/SMT 1206 MLCC X7R 2.2 uF 1% 50 V GP	Capacitor Chip Non-polarised	1206B225M500CT	3D model available Symbol and footprint available 3	1 Download Model
	MCNP35V225M5X11 Multicomp Pro	1	MULTICOMP - MCNP35V225M5X11 - CAP, 2.2µF, 35V, 20%	Capacitor, Polarized Radial Diameter	MCNP35V225M5X11	3D model available Symbol and footprint available 3	1 Download Model
	HDC25M5R7000/AA Amphenol	1	D-Sub High Density Connectors D-Sub Male Connector 25P Solder Tail Right Angle Zinc Shell RoHS	Other	HDC25M5R7000/AA	3D model not available Symbol and footprint available 2	1 Download Model
	NC7SZ125M5 onsemi	1	NC7SZ125M5, 1-Bit Buffer, TinyLogic, 3-State Non-Inverting 1.65 → 5.5 V 5-Pin SOT-23	SOT23 (5-Pin)	NC7SZ125M5	3D model available Symbol and footprint available 3	1 Download Model

	CKG57NX7T2W225M500JJ TDK	1	TDK - CKG57NX7T2W225M500JJ - Multilayer Ceramic Capacitor, 2.2 µF, 450 V, 2220 [5750 Metric], MEGACAP CKG Series, ± 20%, X7T	Capacitor Chip Non-polarised	CKG57NX7T2W225M500JJ	3D model available Symbol and footprint available 3	1 Download Model
	C1812C225M5RACTU Yageo Group	1	SMD Comm X7R, Ceramic, 2.2 uF, 20%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Class II, 2.5 % , 227.3 MOhms, 185 mg, 1812, 4.5mm, 3.2mm, 2.5mm, 0.6mm, 500, 78 Weeks, 80	Other	C1812C225M5RACTU	3D model available Symbol and footprint available 3	1 Download Model
	C2225C125M5RAC7210 Yageo Group	1	SMD Comm X7R, Ceramic, 1.2 uF, 20%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Class II, 2.5 % , 833.3 MOhms, 210 mg, 2225, 5.6mm, 6.4mm, 1mm, 0.6mm, 4000, 78 Weeks, 80	Other	C2225C125M5RAC7210	3D model available Symbol and footprint available 3	1 Download Model
	CKG57NX7R2E225M500JJ TDK	1	Multilayer Ceramic Capacitors MLCC - SMD/SMT CKG 2220 250V 2.2uF 20% T:5mm AEC-Q200	Capacitor Chip Non-polarised	CKG57NX7R2E225M500JJ	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVESQ Winbond	1	512Mb Serial NOR Flash 104MHz SON8	Small Outline No-lead	W25M512JVESQ	3D model available Symbol and footprint available 3	1 Download Model
	TPS325M5155Q-QP7T 3Peak Incorporated	1	Mixed-Signal Microcontrollers 156 MHz, based on ARM Core, TPSensor, rich analog, 512KB, Flash, 144KB RAM	Quad Flat Packages	TPS325M5155Q-QP7T	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVCSM Winbond	1	Serial NOR Flash 104MHz	BGA	W25M512JVCSM	3D model available Symbol and footprint available 3	1 Download Model
	NC7SZ125M5X-L22090 onsemi	1	Proprietary Noise/EMI Reduction Circuitry ; Broad VCC Operating Range: 1.65V to 5.5V ; High Output Drive: ±24mA at 3V VCC ; Power Down High-Impedance Inputs/Outputs ; Space-Saving SOT23 and SC70 Packages; Matches Performance of LCX Operated at 3.3V VCC ; Over-Voltage Tolerance Inputs Facilitate 5V to 3V Translation ; Ultra-High Speed: tPD 2.6ns (Typical) into 50pF at 5V VCC ; Ultra-Small MicroPak™ Packages	SOT23 (5-Pin)	NC7SZ125M5X-L22090	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVBIQ Winbond	1	Winbond Electronics IC FLASH 512MBIT SPI 24TFBGA	BGA	W25M512JVBIQ	3D model available Symbol and footprint available 3	1 Download Model
	CKG45NX7T2E225M500JH TDK	1	Multilayer Ceramic Chip Capacitors, Capacitance=2.2μF, LxWxT:5x3.5x5mm	Capacitor Chip Non-polarised	CKG45NX7T2E225M500JH	3D model available Symbol and footprint available 3	1 Download Model
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