2029- Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	TSW-120-29-G-Q SAMTEC	1	POST HEADER , THROUGH-HOLE	Other	TSW-120-29-G-Q	3D model not available Symbol and footprint available 2	1 Download Model
	TSW-120-29-T-S SAMTEC	1	20 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-120-29-T-S	3D model available Symbol and footprint available 3	1 Download Model
	MH2029-102T Bourns	1	CB,2x0.85x1.25mm,1000Ω,±25%,non-shdSMD	Ferrite Bead Chip	MH2029-102T	3D model available Symbol and footprint available 3	1 Download Model
	2029150-4 TE Connectivity	1	Configuration Features: Number of Signal Positions 0 \| Number of Power Positions 4 \| Number of Positions 4 \| PCB Mount Orientation Right Angle \| Number of Rows 1 \| Contact Features: Contact Type Pin \| Contact Mating Area Plating Material Tin \| PCB Contact Termination Area Plating Material Tin \| Contact Retention Within Housing Without \| Contact Current Rating (Max) 9 AMP \| Contact Layout Inline \| Dimensions: Product Length 18 MM \| Compatible Insulation Diameter (Max) 2.39 INCH \| PCB Thickness (Recommended)	Other	2029150-4	3D model available Symbol and footprint available 3	1 Download Model

	MH2029-471T Bourns	1	CB,2x0.85x1.25mm,470Ω,±25%,non-shdSMD	Ferrite Bead Chip	MH2029-471T	3D model available Symbol and footprint available 3	1 Download Model
	MH2029-601T Bourns	1	CB,2x0.85x1.25mm,600Ω,±25%,non-shdSMD	Ferrite Bead Chip	MH2029-601T	3D model available Symbol and footprint available 3	1 Download Model
	TSW-120-29-SM-S SAMTEC	1	20 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-120-29-SM-S	3D model available Symbol and footprint available 3	1 Download Model
	TSW-120-29-H-S SAMTEC	1	20 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-120-29-H-S	3D model available Symbol and footprint available 3	1 Download Model
	TPA2029D1YZFR Texas Instruments	1	3-W Mono Class-D Amplifier With Smart Gain AGC/DRC	BGA	TPA2029D1YZFR	3D model available Symbol and footprint available 3	1 Download Model
	TLIN2029DRQ1 Texas Instruments	1	Fault Protected Local Interconnect Network (LIN) Transceiver With Dominant State Timeout	Small Outline Packages	TLIN2029DRQ1	3D model available Symbol and footprint available 3	1 Download Model
	2SA2029T2LQ ROHM Semiconductor	1	Bipolar Transistors - BJT PNP 50V 0.15A	SOT23 (3-Pin)	2SA2029T2LQ	3D model not available Symbol and footprint available 2	1 Download Model
	TLIN2029ADRBRQ1 Texas Instruments	1	Fault protected local interconnect network (LIN) transceiver with dominant state timeout	Small Outline No-lead	TLIN2029ADRBRQ1	3D model available Symbol and footprint available 3	1 Download Model
	MPQ2029GN-AEC1 Monolithic Power Systems (MPS)	1	IC REG LIN POS ADJ 450MA 8SOIC	Small Outline Packages	MPQ2029GN-AEC1	3D model available Symbol and footprint available 3	1 Download Model
	2029054-5 TE Connectivity	1	Configuration Features: Number of Rows 1 \| Number of Positions 5 \| Number of Signal Positions 0 \| Number of Power Positions 5 \| PCB Mount Orientation Vertical \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Contact Mating Area Plating Material Tin \| Contact Retention Within Housing Without \| Contact Mating Area Plating Material Thickness 2.03 MICM \| Contact Type Pin \| Contact Mating Area Plating Material Thickness 80 MICIN \| Contact Current Rating (Max) 9 AMP \| Contact Layout Inline	Other	2029054-5	3D model available Symbol and footprint available 3	1 Download Model
	LX2080XE72029B NXP	1	LX2080XE72029B	BGA	LX2080XE72029B	3D model available Symbol and footprint available 3	1 Download Model

	2029030-2 TE Connectivity	1	Configuration Features: Number of Power Positions 2 \| PCB Mount Orientation Right Angle \| Number of Rows 1 \| Number of Signal Positions 0 \| Number of Positions 2 \| Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN \| Contact Retention Within Housing Without \| Contact Mating Area Plating Material Thickness 2.54 MICM \| Contact Mating Area Plating Material Tin \| Contact Mating Area Plating Material Thickness 100 MICIN \| Multiple Contact Types Without \| PCB Contact Termination A	Other	2029030-2	3D model available Symbol and footprint available 3	1 Download Model
	2029030-4 TE Connectivity	1	Configuration Features: PCB Mount Orientation Right Angle \| Number of Power Positions 4 \| Number of Positions 4 \| Number of Rows 1 \| Number of Signal Positions 0 \| Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM \| PCB Contact Termination Area Plating Material Thickness 100 MICIN \| Contact Mating Area Plating Material Tin \| Contact Retention Within Housing Without \| Multiple Contact Types Without \| Contact Current Rating (Max) 5 AMP \| Contact Mating Area Plating Material Thickness	Other	2029030-4	3D model available Symbol and footprint available 3	1 Download Model
	430452029 Molex	1	Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Dual Row, 20 Circuits, with PCB Polarizing Peg, Glow-Wire Capable, Black	Other	430452029	3D model available Symbol and footprint available 3	1 Download Model
	MH2029-331T Bourns	1	CB,2x0.85x1.25mm,330Ω,±25%,non-shdSMD	Ferrite Bead Chip	MH2029-331T	3D model available Symbol and footprint available 3	1 Download Model
	2086-1202/997-604 Wago	1	THR PCB terminal block; push-button; 1.5 mm²; Pin spacing 3.5 mm; 2-pole; Push-in CAGE CLAMP®; in tape-and-reel packaging	Other	2086-1202/997-604	3D model available Symbol and footprint available 3	1 Download Model
	2029000-1 TE Connectivity	1	Configuration Features: Number of Rows 1 \| Number of Power Positions 2 \| Number of Positions 2 \| PCB Mount Orientation Vertical \| Contact Features: Multiple Contact Types Without \| Contact Mating Area Plating Material Tin \| Contact Current Rating (Max) 12 AMP \| PCB Contact Termination Area Plating Material Pre-Tin \| Contact Type Socket \| Contact Retention Within Housing Without \| Contact Layout Inline \| Contact Mating Area Plating Material Thickness 3.81 â€“ 5.08 MICM \| Contact Mating Area Plating Material	Other	2029000-1	3D model available Symbol and footprint available 3	1 Download Model
	TSW-120-29-LM-S SAMTEC	1	20 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-120-29-LM-S	3D model available Symbol and footprint available 3	1 Download Model
	DMN2029UVT-7 Diodes Incorporated	1	MOSFET MOSFET BVDSS: 8V-24V	SOT23 (6-Pin)	DMN2029UVT-7	3D model available Symbol and footprint available 3	1 Download Model
	2029054-5 TE Connectivity	1	Configuration Features: Number of Rows 1 \| Number of Positions 5 \| Number of Signal Positions 0 \| Number of Power Positions 5 \| PCB Mount Orientation Vertical \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Contact Mating Area Plating Material Tin \| Contact Retention Within Housing Without \| Contact Mating Area Plating Material Thickness 2.03 MICM \| Contact Type Pin \| Contact Mating Area Plating Material Thickness 80 MICIN \| Contact Current Rating (Max) 9 AMP \| Contact Layout Inline	Other	2029054-5	3D model available Symbol and footprint available 3	1 Download Model
	ZXTP2029FTA Diodes Incorporated This part was updated within the past 30 days. Set alerts for model updates on the part download page.	1	Diodes Inc ZXTP2029FTA PNP Transistor, 3 A, 100 V, 3-Pin SOT-23	SOT23 (3-Pin)	ZXTP2029FTA	3D model available Symbol and footprint available 3	1 Download Model
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