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2086-1212/997-607
Wago
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1 | THR PCB terminal block; push-button; 1.5 mm²; Pin spacing 3.5 mm; 12-pole; Push-in CAGE CLAMP®; in tape-and-reel packaging | Other | 2086-1212/997-607 |
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TSW-121-29-F-S
SAMTEC
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1 | 21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-121-29-F-S |
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TSW-121-29-G-S
SAMTEC
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1 | 21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-121-29-G-S |
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08621295
Sato Parts
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0 | Horizontal connection type fuse holder | Other | 08621295 |
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ALD212900ASAL
Advanced Linear Devices Inc.
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1 | MOSFET Dual N-Ch EPAD FET Array VGS=0.0V | Small Outline Packages | ALD212900ASAL |
3
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1 | 3M 2321291 1.78mm Pitch Straight 32 Way, Through Hole ZIF IC Dip Socket, 1A | Other | 232-1291-00-0602J |
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2129261-1
TE Connectivity
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1 | Body Features: Shell Base Material Stainless Steel | Configuration Features: Number of Power Positions 0 | Number of Positions 40 | Number of Rows 3 | Number of Signal Positions 40 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 1 AMP | Number of Utility Contacts 0 | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness .38 MICM | Housing Features: Centerline (Pit | Other | 2129261-1 |
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ABMM2-12.9000MHZ-E2-T
ABRACON
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1 | Crystals / Oscillators / Resonators +/- 20PPM 12.9 MHZ | Other | ABMM2-12.9000MHZ-E2-T |
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R5F21296KSP#W4
Renesas Electronics
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1 | The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat | Small Outline Packages | R5F21296KSP#W4 |
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R5F21292SDSP#W4
Renesas Electronics
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1 | The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat | Small Outline Packages | R5F21292SDSP#W4 |
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252129
Amphenol
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1 | RF Connectors / Coaxial Connectors MCX R/A RECEPTACLE PCB .155 LEGS | Other | 252129 |
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ALD212900SAL
Advanced Linear Devices Inc.
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1 | MOSFET Dual N-Ch EPAD FET Array VGS=0.0V | Small Outline Packages | ALD212900SAL |
3
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RM332-059-121-2900
AirBorn
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1 | RM33, Rugged Rectangular Connector, 0.075"/1.91mm Pitch, Plastic Body, Vertical Board Mount Plug, Plated Thru Hole (PTH), without Mounting Ears. 3-Row, Size: 11-206 | Other | RM332-059-121-2900 |
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7112129
RS Pro
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1 | RS Pro 10μF 450 V dc Aluminium Electrolytic Capacitor 2000h 13 Dia. x 21mm | Capacitor, Polarized Radial Diameter | 7112129 |
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R5F21294JSP#U0
Renesas Electronics
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1 | 16-bit Microcontrollers - MCU R8C/29 16KB+2KB/1KB 20LSSOP J Temp | Small Outline Packages | R5F21294JSP#U0 |
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R5F21294SNSP#U0
Renesas Electronics
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1 | The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat | Small Outline Packages | R5F21294SNSP#U0 |
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SI2129DW-TP
MCC
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1 | DUAL P-CHANNEL MOSFET,SOT-363 | SOT23 (6-Pin) | SI2129DW-TP |
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TSW-121-29-L-S
SAMTEC
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1 | 21 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-121-29-L-S |
2
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1 | NXP LPC2129FBD64/01,15, 16/32bit ARM7TDMI-S Microcontroller, 60MHz, 256 kB Flash, 64-Pin LQFP | Quad Flat Packages | LPC2129FBD64/01,15 |
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212-92-30GB01
Pinrex Technology Corp
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1 | Board Connector, 60 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal | 212-92-30GB01 |
0
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212-91-19GB11
Pinrex Technology Corp
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1 | Board Connector, 19 Contact(s), 1 Row(s), Male, Straight, Surface Mount Terminal | 212-91-19GB11 |
0
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212-92-03GB01
Pinrex Technology Corp
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1 | Board Connector, 6 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal | 212-92-03GB01 |
0
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212-92-16GB01
Pinrex Technology Corp
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1 | Board Connector, 32 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal | 212-92-16GB01 |
0
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212-91-40GB12
Pinrex Technology Corp
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1 | Board Connector, 40 Contact(s), 1 Row(s), Male, Straight, Surface Mount Terminal | 212-91-40GB12 |
0
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212-91-33GB12
Pinrex Technology Corp
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1 | Board Connector, 33 Contact(s), 1 Row(s), Male, Straight, Surface Mount Terminal | 212-91-33GB12 |
0
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