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0479480001
Molex
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1 | 2.4GHz SMT MID Chip Antenna | Other | 0479480001 |
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1724479402
Molex
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1 | Mini-Fit Versa Color Header, Dual Row, Vertical, 2 Circuits, Nylon 6/6, UL 94V-0, Tin (Sn) Plating, Glow-Wire Capable, Red | Other | 1724479402 |
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4-794632-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | Number of Rows 2 | Number of Positions 10 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Ma | Header, Shrouded - Straight PTH Box | 4-794632-0 |
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4-794632-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 12 | Number of Power Positions 12 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 3.81 | Header, Shrouded - Straight PTH Box | 4-794632-2 |
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4-794677-0
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 10 | PCB Mount Orientation Right Angle | Number of Power Positions 10 | Number of Signal Positions 0 | Contact Features: PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Type Pin | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Mater | Other | 4-794677-0 |
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4-794627-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 14 | Number of Rows 2 | Number of Positions 14 | PCB Mount Orientation Right Angle | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact C | Other | 4-794627-4 |
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1724479406
Molex
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1 | Mini-Fit Versa Color Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 6 Circuits, Nylon 6/6, UL 94V-0 Glow-Wire Capable, Red | Other | 1724479406 |
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4-794677-8
TE Connectivity
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1 | Configuration Features: Number of Power Positions 18 | Number of Positions 18 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Te | Other | 4-794677-8 |
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1724479408
Molex
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1 | Mini-Fit Versa Color Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 8 Circuits, Nylon 6/6, UL 94V-0 Glow-Wire Capable, Red | Other | 1724479408 |
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4-794637-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Power Positions 12 | Number of Positions 12 | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness 15 MICI | Other | 4-794637-2 |
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C0402C479_4GAC
Yageo Group
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1 | Multilayer Ceramic Capacitors MLCC - SMD/SMT | Other | C0402C479_4GAC |
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4-794627-6
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 16 | Number of Power Positions 16 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Ma | Other | 4-794627-6 |
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1734479-4
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Inverted - Latch Up | Connector Profile Low | Configuration Features: Port Matrix Configuration 1 x 2 | Number of Positions 6 | PCB Mount Orientation Right Angle | Port Configuration Multiple Ports | Number of Loaded Positions 4 | Connector Contact Density Standard | Contact Features: Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Gold Flash | Contact Underplating Material Nickel | Contact Current Rating (Max) 1 AMP | Conta | Other | 1734479-4 |
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1747944
Phoenix Contact
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1 | ZFKDSA 1-W-3,81- 9 - Printed circuit board terminal, nominal current: 12 A, rated voltage (III/2): 200 V, nominal cross section: 1 mm2, number of potentials: 9, number of rows: 1, number of positions per row: 9, product range: ZFKDS(A) 1-W, pitch: 3.81 mm, connection method: Spring-cage connection, mounting: Wave soldering, conductor/PCB connection direction: 45 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 2, type of packaging: packed i | Other | 1747944 |
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4-794632-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Power Positions 14 | Number of Positions 14 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | PC | Header, Receptacle - Straight PTH Box | 4-794632-4 |
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4-794679-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | Number of Positions 10 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Retention Within Housing Without | Multiple Contact Types Without | Contact | Other | 4-794679-0 |
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4-794638-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 12 | PCB Mount Orientation Vertical | Number of Power Positions 12 | Contact Features: Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | PC | Other | 4-794638-2 |
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4-794627-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | Number of Rows 2 | Number of Positions 10 | PCB Mount Orientation Right Angle | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Type Pin | Contact Retention Within Housing Withou | Other | 4-794627-0 |
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1724479416
Molex
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1 | Mini-Fit Versa Color Header, Dual Row, Vertical, with Snap-in Plastic Peg PCB Lock, 16 Circuits, Nylon 6/6, UL 94V-0 Glow-Wire Capable, Red | Other | 1724479416 |
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4-794636-0
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 10 Position, 3 mm [.118 in] Centerline , Fully Shrouded, Tin, Surface Mount, Power, Black, Micro MATE-N-LOK | Other | 4-794636-0 |
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4-794636-8
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 18 | Number of Power Positions 18 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Current Rating (Max) 5 AMP | | Other | 4-794636-8 |
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C0805C479_4GAC
Yageo Group
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1 | Multilayer Ceramic Capacitors MLCC - SMD/SMT | Capacitor Chip Non-polarised | C0805C479_4GAC |
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4-794678-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 16 | Number of Positions 16 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .3 | Other | 4-794678-6 |
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4-794631-6
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 16 | Number of Positions 16 | Number of Rows 2 | Contact Features: Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickne | Other | 4-794631-6 |
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4-794620-8
TE Connectivity
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1 | 18P MICRO MNL ASSY,R/A,HDR,LF | Other | 4-794620-8 |
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![Part Image](["https://www.molex.com/content/dam/molex/molex-dot-com/products/manual/en-us/images/479/47948/479480001_hires.jpg","https://www.molex.com/content/dam/molex/molex-dot-com/products/manual/en-us/images/479/47948/479480001_hires.jpg",null])
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