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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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52892-3033
Molex
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1 | MOLEX - 52892-3033 - CONNECTOR, FFC/FPC, 30POS, 1ROW, 0.5MM | Other | 52892-3033 |
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88SE9230A1-NAA2C000
Marvell
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1 | ic | Quad Flat No-Lead | 88SE9230A1-NAA2C000 |
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PIC16C923-04/PT
Microchip
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1 | IC, Processor, Controller, 8 Bit, 4MHz, OTP, SMT, PIC16C92 | Quad Flat Packages | PIC16C923-04/PT |
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SMS3923-081LF
Skyworks
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1 | Schottky Diodes & Rectifiers Ls=1.8nH SC-88 Dual Series Pair | SOT23 (6-Pin) | SMS3923-081LF |
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1-2199230-6
TE Connectivity
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1 | PCI Express / PCI Connectors M.2 0.5PITCH 4.2H KEY M 30U AU | Other | 1-2199230-6 |
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74279230
Würth Elektronik
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1 | SMD EMI Suppression Ferrite Beads WE-CBF | Inductor Moulded | 74279230 |
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292303-4
TE Connectivity
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1 | Body Features: Connector Profile Standard | Shell Plating Finish Bright | Shell Plating Material Tin | Configuration Features: Number of Ports 1 | Number of Positions 4 | Number of Mounting Legs 2 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thick | Other | 292303-4 |
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SLY12SMD09230G
Fischer Elektronik GmbH & Co. KG
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1 | Dual Row, SMD, Male, Suitable for female headers BLY, Pitch 2 x 2mm, 30 Position | Other | SLY12SMD09230G |
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AD9230BCPZ11-200
Analog Devices
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1 | 11-Bit, 200 MSPS, 1.8 V Analog-to-Digital Converter 1.0 V to 1.5 V, 1.25 V −40°C to +85°C | Quad Flat No-Lead | AD9230BCPZ11-200 |
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XC9276D9230R-G
Torex
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1 | Ultra-Low Quiescent Current, Synchronous Step-Down PFM DC/DC Converter with Output voltage selectable function, WLP-6-03 | Other | XC9276D9230R-G |
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1053092307
Molex
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1 | Nano-Fit Vertical Header, Through Hole, 2.50mm Pitch, Single Row, 7 Circuits, with Kinked Pins, 0.76µm Gold (Au) Plating, Natural, Glow-Wire Capable, Tray | Other | 1053092307 |
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1-5499923-0
TE Connectivity
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1 | A/L UNIV HDR 50P VERT LG LAT | Other | 1-5499923-0 |
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AD9230BCPZ-210
Analog Devices
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1 | Analog Devices AD9230BCPZ-210, 12 bit Serial ADC, Differential Input, 56-Pin LFCSP | Quad Flat No-Lead | AD9230BCPZ-210 |
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SMSA3923-011LF
Skyworks
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1 | Ls 1.5nH SOD-323 Single Surface-Mount Mixer/Detector Schottky Diode | Small Outline Diode | SMSA3923-011LF |
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SMS3923-079LF
Skyworks
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1 | Schottky Diodes & Rectifiers Ls=.7nH SC-79 Single SMS392x Series: Surface-Mount General-Purpose Schottky Diode | Small Outline Diode Flat Lead | SMS3923-079LF |
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5749230-1
TE Connectivity
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1 | Body Features: Shield Plating Finish Bright | Shield Material Copper Alloy | Panel Ground Feature Type None | Shield Plating Material Tin over Nickel | Primary Product Color Black | Configuration Features: Connector Contact Load Condition Fully Loaded | Number of Positions 4 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 170 MICIN | Contact Underplating Material Thickness 50 MICIN | Contact U | Other | 5749230-1 |
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09195247923001
HARTING
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1 | Connectors, Male connector, Reflow soldering termination (THR), Rated current: 1 A, Angled, Copper alloy, Sn over Ni, Termination side, Au over Pd/Ni, Mating side, Performance level: 2, Thermoplastic resin (PCT) | Other | 09195247923001 |
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SLY11SMD09230GECO
Fischer Elektronik GmbH & Co. KG
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1 | male header | Other | SLY11SMD09230GECO |
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SLY12SMD09230Z
Fischer Elektronik GmbH & Co. KG
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1 | Dual Row, SMD, Male, Suitable for female headers BLY, Pitch 2 x 2mm, 30 Position | Other | SLY12SMD09230Z |
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1053092308
Molex
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1 | Nano-Fit Vertical Header, Through Hole, 2.50mm Pitch, Single Row, 8 Circuits, with Kinked Pins, 0.76µm Gold (Au) Plating, Natural, Glow-Wire Capable, Tray | Other | 1053092308 |
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2199230-2
TE Connectivity
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1 | M.2 Connectors, Height .165 in [4.2 mm], Connector & Keying Code E, Gold, Power, -40 – 176 °F [-40 – 80 °C], M.2 NGFF | Other | 2199230-2 |
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DA9230-08VZ2
Renesas Electronics
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1 | The DA9230 is an ultra-low quiescent current, high-efficiency buck regulator in a compact I2C configurable WLCSP package targeting battery-powered applications needing highly efficient power supplies. The battery life of these devices is significantly improved due to the low quiescent current delivered by DA9230 during operation and shutdown.The buck regulator extends high light-load efficiency down to 10µA further extending battery life. Dynamic Voltage Control (DVC) in the buck regulator facilitates optim | BGA | DA9230-08VZ2 |
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292303-3
TE Connectivity
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1 | Body Features: Connector Profile Standard | Shell Plating Material Tin | Shell Plating Finish Bright | Configuration Features: Number of Mounting Legs 2 | Number of Positions 4 | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thick | Other | 292303-3 |
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292303-5
TE Connectivity
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1 | Body Features: Connector Profile Standard | Shell Plating Material Tin | Shell Plating Finish Bright | Configuration Features: Number of Ports 1 | Number of Positions 4 | Number of Mounting Legs 2 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thick | Other | 292303-5 |
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292303-6
TE Connectivity
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1 | Body Features: Shell Plating Finish Bright | Connector Profile Standard | Shell Plating Material Tin | Configuration Features: Number of Mounting Legs 2 | Number of Positions 4 | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Current Rating (Max) 1 AMP | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thi | Other | 292303-6 |
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