9230- Model Download Search Results
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N3429-2302RB
3M
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1 | Conn Ejector Header HDR 26 POS 2.54mm Solder ST Thru-Hole | Other | N3429-2302RB |
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74279230
Würth Elektronik
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1 | SMD EMI Suppression Ferrite Beads WE-CBF | Inductor Moulded | 74279230 |
3
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PIC16C923-04/PT
Microchip
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1 | IC, Processor, Controller, 8 Bit, 4MHz, OTP, SMT, PIC16C92 | Quad Flat Packages | PIC16C923-04/PT |
3
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SMS3923-081LF
Skyworks
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1 | Schottky Diodes & Rectifiers Ls=1.8nH SC-88 Dual Series Pair | SOT23 (6-Pin) | SMS3923-081LF |
3
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1-292303-7
TE Connectivity
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1 | RECEPTACLE ASSEMBLY RIGHT ANGLE POSITION T/H SMT USB VERSION | Other | 1-292303-7 |
3
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1792300
Phoenix Contact
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1 | PCB terminal block, nominal current: 41 A, rated voltage (III/2): 1000 V, nominal cross section: 6 mm?, Number of potentials: 10, Number of rows: 1, Number of positions per row: 10, product range: PLA 5/, pitch: 7.5 mm, connection method: Push-lock spring connection, mounting: Wave soldering, conductor/PCB connection direction: 30 ?, color: green, Pin layout: Linear double pinning, Solder pin [P]: 3.6 mm, type of packaging: packed in cardboard | Other | 1792300 |
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09292306804791
HARTING
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1 | DIN 3R female angled, 30pin, PL2, SMC/THR, (comes on reel of 150pieces) | Other | 09292306804791 |
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292304-3
TE Connectivity
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1 | Body Features: Connector Profile Standard | Shell Plating Finish Bright | Shell Plating Material Tin | Offset 0 MM | Configuration Features: Number of Positions 4 | Number of Ports 1 | Contact Features: Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickness (Recomm | Other | 292304-3 |
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1-2199230-3
TE Connectivity
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1 | 67 Position Female Connector M.2 (NGFF) Mini Card Gold 0.020" (0.50mm) Black | Other | 1-2199230-3 |
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1054292306
Molex
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1 | Nano-Fit Vertical Header, Surface Mount, 2.50mm Pitch, Dual Row, 6 Circuits, Glow-Wire Capable | Other | 1054292306 |
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1054292304
Molex
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1 | Nano-Fit Vertical Header, Surface Mount, 2.50mm Pitch, Dual Row, 4 Circuits, Glow-Wire Capable | Other | 1054292304 |
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1054292308
Molex
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1 | Nano-Fit Vertical Header, Surface Mount, 2.50mm Pitch, Dual Row, 8 Circuits, Glow-Wire Capable | Other | 1054292308 |
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292303-3
TE Connectivity
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1 | Body Features: Connector Profile Standard | Shell Plating Material Tin | Shell Plating Finish Bright | Configuration Features: Number of Mounting Legs 2 | Number of Positions 4 | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thick | Other | 292303-3 |
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DA9230-08VZ2
Renesas Electronics
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1 | The DA9230 is an ultra-low quiescent current, high-efficiency buck regulator in a compact I2C configurable WLCSP package targeting battery-powered applications needing highly efficient power supplies. The battery life of these devices is significantly improved due to the low quiescent current delivered by DA9230 during operation and shutdown.The buck regulator extends high light-load efficiency down to 10µA further extending battery life. Dynamic Voltage Control (DVC) in the buck regulator facilitates optim | BGA | DA9230-08VZ2 |
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292303-6
TE Connectivity
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1 | Body Features: Shell Plating Finish Bright | Connector Profile Standard | Shell Plating Material Tin | Configuration Features: Number of Mounting Legs 2 | Number of Positions 4 | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Current Rating (Max) 1 AMP | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thi | Other | 292303-6 |
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292303-5
TE Connectivity
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1 | Body Features: Connector Profile Standard | Shell Plating Material Tin | Shell Plating Finish Bright | Configuration Features: Number of Ports 1 | Number of Positions 4 | Number of Mounting Legs 2 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thick | Other | 292303-5 |
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292303-1
TE Connectivity
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1 | Body Features: Connector Profile Standard | Shell Plating Finish Bright | Shell Plating Material Tin | Configuration Features: Number of Positions 4 | Number of Ports 1 | Number of Mounting Legs 2 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Current Rating (Max) 1 AMP | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thi | Other | 292303-1 |
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2199230-2
TE Connectivity
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1 | M.2 Connectors, Height .165 in [4.2 mm], Connector & Keying Code E, Gold, Power, -40 – 176 °F [-40 – 80 °C], M.2 NGFFn | Other | 2199230-2 |
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09195246923001
HARTING
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1 | Connectors, Male connector, Reflow soldering termination (THR), Rated current: 1 A, Angled, Copper alloy, Sn over Ni, Termination side, Au over Pd/Ni, Mating side, Performance level: 2, Thermoplastic resin (PCT) | Other | 09195246923001 |
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292304-1
TE Connectivity
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1 | Body Features: Shell Plating Material Tin | Offset 0 MM | Connector Profile Standard | Shell Plating Finish Bright | Configuration Features: Number of Ports 1 | Number of Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness (Recommen | Other | 292304-1 |
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1053092305
Molex
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1 | Nano-Fit Vertical Header, Through Hole, 2.50mm Pitch, Single Row, with Kinked Pins, Tin (Sn) Plating, Black, Glow-Wire Capable, Tray | Other | 1053092305 |
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1053092306
Molex
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1 | Nano-Fit Vertical Header, Through Hole, 2.50mm Pitch, Single Row, with Kinked Pins, Tin (Sn) Plating, Black, Glow-Wire Capable, Tray | Other | 1053092306 |
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1769230
Phoenix Contact
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1 | PCB header, nominal cross section: 2.5 mm?, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 2, Number of rows: 1, Number of positions per row: 2, number of connections: 2, product range: SMSTB 2,5/..-G, pitch: 5 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.5 mm, Stecksystem: CLASSIC COMBICON, Locking: without, type of packaging: packed in cardboard | Other | 1769230 |
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09195247923001
HARTING
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1 | Connectors, Male connector, Reflow soldering termination (THR), Rated current: 1 A, Angled, Copper alloy, Sn over Ni, Termination side, Au over Pd/Ni, Mating side, Performance level: 2, Thermoplastic resin (PCT) | Other | 09195247923001 |
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5749230-1
TE Connectivity
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1 | Body Features: Shield Plating Finish Bright | Shield Material Copper Alloy | Panel Ground Feature Type None | Shield Plating Material Tin over Nickel | Primary Product Color Black | Configuration Features: Connector Contact Load Condition Fully Loaded | Number of Positions 4 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 170 MICIN | Contact Underplating Material Thickness 50 MICIN | Contact U | Other | 5749230-1 |
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