02-90 Model Download Search Results
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1630290000
Weidmüller
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1 | PCB connector (board connection), 320 V, 17 A, Pitch in mm: 5.00, Number of poles: 6, THT solder connection, Box | Other | 1630290000 |
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WSL1206R0290FTA
Vishay
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1 | RES 0.082 OHM 5% 1/4W 1206 | Resistor Chip | WSL1206R0290FTA |
3
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74402900047
Würth Elektronik
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1 | WE-TPC SMT Shielded Tiny Power Inductor Size 2813; L = 0.47 µH ±35%; IR = 2.8 A; Isat = 2.2 A; RDC = 37 mΩ | Other | 74402900047 |
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1150290000
Weidmüller
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1 | PCB connector (board connection), 320 V, 24 A, Pitch in mm: 5.08, Number of poles: 20, THT solder connection, Box | Other | 1150290000 |
3
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7802901JA
Renesas Electronics
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1 | The Intersil HD-15530 is a high performance CMOS device intended to service the requirements of MlL-STD-1553 and similar Manchester II encoded, time division multiplexed serial data protocols. This LSI chip is divided into two sections, an Encoder and a Decoder. These sections operate completely independent of each other, except for the Master Reset functions. This circuit meets many of the requirements of MIL-STD- 1553. The Encoder produces the sync pulse and the parity bit as well as the encoding of the d | Ceramic Dual-In-Line Packages | 7802901JA |
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340102902B 25SFR136
LITTELFUSE
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1 | D-Sub Micro-D Connectors 25 socket 90° bent PCB, Through Hole (no hardware) | Other | 340102902B 25SFR136 |
2
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1-5179029-0
TE Connectivity
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1 | 0.8FH,P06H.5,200,08/Sn,TU | Other | 1-5179029-0 |
3
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2029054-5
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 5 | Number of Signal Positions 0 | Number of Power Positions 5 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Current Rating (Max) 9 AMP | Contact Layout Inline | Other | 2029054-5 |
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74402900082
Würth Elektronik
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1 | WE-TPC SMT Shielded Tiny Power Inductor Size 2813; L = 0.82 µH ±35%; IR = 2.4 A; Isat = 1.8 A; RDC = 45 mΩ | Other | 74402900082 |
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2029056-4
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 4 Position, 4.2 mm [.165 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, Power, Natural | Other | 2029056-4 |
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09291302904
HARTING
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1 | DIN 3R male straight, 30pin, press-in 5.0mm tails, PL1 | Other | 09291302904 |
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M30290FCHP#U3A
Renesas Electronics
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1 | The M16C/29 Group is supported only for customers who have already adopted these products. The RL78/F12, F13, F14, F15 Groups are recommended for new designs. | Quad Flat Packages | M30290FCHP#U3A |
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2029030-3
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Signal Positions 0 | Number of Power Positions 3 | Number of Positions 3 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termina | Other | 2029030-3 |
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BNX029-01B
Murata Electronics
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1 | BNX029 Series EMI Suppression Filter 15kHz to 1GHz 35dB min. 20A 6.3V | Other | BNX029-01B |
3
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MK20290G
Fischer Elektronik GmbH & Co. KG
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1 | male header | Other | MK20290G |
3
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WSL1206R0290FBA40
Vishay
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1 | Power Metal Strip® Resistors, Very High Power (to 3 W), Low Value (Down to 0.0005 Ω), Surface-Mount | Resistor Chip | WSL1206R0290FBA40 |
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WSLP1206R0290FTA
Vishay
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1 | Current Sense Resistors - SMD Power Metal Strip Resistors, Very High Power (to 3 W), Low Value (down to 0.0005 Ohms), Surface Mount | Resistor Chip | WSLP1206R0290FTA |
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CRCW040290K9FKED
Vishay
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1 | Vishay CRCW Series Thick Film Surface Mount Resistor 0402 Case 90.9kΩ ±1% 0.063W ±100ppm/°C | Other | CRCW040290K9FKED |
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CRCW040290K9FKTD
Vishay
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1 | Thick Film Resistors - SMD 1/16watt 90.9Kohms 1% | Other | CRCW040290K9FKTD |
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744029004
Würth Elektronik
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1 | WE-TPC SMT Shielded Tiny Power Inductor Size 2813; L = 4.7 µH ±30%; IR = 1 A; Isat = 0.8 A; RDC = 200 mΩ | Other | 744029004 |
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BNX029-01L
Murata Electronics
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1 | BNX029 Series EMI Suppression Filter 15kHz to 1GHz 35dB min. 20A 6.3V | Other | BNX029-01L |
3
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2029030-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 4 | Number of Positions 4 | Number of Rows 1 | Number of Signal Positions 0 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness | Other | 2029030-4 |
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WSL1206R0290JEA
Vishay
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1 | Power Metal Strip® Resistors, Very High Power (to 3 W), Low Value (Down to 0.0005 Ω), Surface-Mount | Resistor Chip | WSL1206R0290JEA |
3
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2029056-3
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | Number of Power Positions 3 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Type Pin | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Dimensions: | Other | 2029056-3 |
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2029000-1
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 2 | Number of Positions 2 | PCB Mount Orientation Vertical | Contact Features: Multiple Contact Types Without | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Pre-Tin | Contact Type Socket | Contact Retention Within Housing Without | Contact Layout Inline | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material | Other | 2029000-1 |
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