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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	TPS325M5177I-FSDR 3Peak Incorporated	1	• MCU Core:– 32-bit STAR-MC1 core with FPU based on Arm®v8-M architecture, frequency up to 156 MHz– Compatible with Cortex®-M33 instruction set• Operating conditions:– VDD, VDDA power supply voltage: 1.71 V to 3.6 V• Memories– 2048 KB of Flash memory with dual bank– SRAM memory• 192 KB SRAM0• 128 KB SRAM1• 16 KB SRAM2 for retention– Quad-SPI memory interface• Reset and supply management– Power-on/Power-down/Brown-out Reset(POR/PDR/BOR)– Supply Voltage Supervisor (SVS)– Lo	Quad Flat No-Lead	TPS325M5177I-FSDR	3D model available Symbol and footprint available 3	1 Download Model
	C2225C225M5RACTM Yageo Group	1	SMD Comm X7R, Ceramic, 2.2 uF, 20%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Class II, 2.5 % , 454.5 MOhms, 350 mg, 2225, 5.6mm, 6.4mm, 1.3mm, 0.6mm, 1000, 78 Weeks, 80	Other	C2225C225M5RACTM	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWEIQ Winbond	1	 New Family of SpiFlash® Memories– W25M512JW-IQ: 2 x 256M-bit (2 x 32MByte)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software Die Select (C2h)– Software & Hardware Reset(1) High Performance Serial Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 52MB/s continuous data transfer rate– More than 100,000 Program/Erase cycles– More than 20-year data retention	Small Outline No-lead	W25M512JWEIQ	3D model available Symbol and footprint available 3	1 Download Model
	C2220C225M5RACTU Yageo Group	1	SMD, MLCC, Temperature Stable, Class II	Other	C2220C225M5RACTU	3D model available Symbol and footprint available 3	1 Download Model

	CKG45NX7R2A225M500JJ TDK	1	Multilayer Ceramic Chip Capacitors, Capacitance=2.2μF, LxWxT:5x3.5x5mm	Capacitor Chip Non-polarised	CKG45NX7R2A225M500JJ	3D model available Symbol and footprint available 3	1 Download Model
	TPS325M5166Q-QP5T 3Peak Incorporated	1	ARM® Cortex®M33 w/FPU TPS325M Microcontroller IC 32-Bit 156MHz 1028KB FLASH LQFP-64(10x10)	Quad Flat Packages	TPS325M5166Q-QP5T	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWESQ Winbond	1	FLASH - NOR Memory IC 512Mbit SPI 104 MHz 8-WSON (8x6)	Small Outline No-lead	W25M512JWESQ	3D model available Symbol and footprint available 3	1 Download Model
	C1206C225M5RAC7210 Yageo Group	1	SMD, MLCC, Temperature Stable, Class II	Other	C1206C225M5RAC7210	3D model available Symbol and footprint available 3	1 Download Model
	TPS325M5166I-FSDR 3Peak Incorporated	1	• MCU Core:– 32-bit STAR-MC1 core with FPU based on Arm®v8-M architecture, frequency up to 156 MHz– Compatible with Cortex®-M33 instruction set• Operating conditions:– VDD, VDDA power supply voltage: 1.71 V to 3.6 V• Memories– 2048 KB of Flash memory with dual bank– SRAM memory• 192 KB SRAM0• 128 KB SRAM1• 16 KB SRAM2 for retention– Quad-SPI memory interface• Reset and supply management– Power-on/Power-down/Brown-out Reset(POR/PDR/BOR)– Supply Voltage Supervisor (SVS)– Lo	Quad Flat No-Lead	TPS325M5166I-FSDR	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWEAQ Winbond	1	512Mb SpiStack Flash 104MHz SON8	Small Outline No-lead	W25M512JWEAQ	3D model available Symbol and footprint available 3	1 Download Model
	AVEZ225M50B12T-F Cornell Dubilier	1	Aluminum Electrolytic Capacitors - SMD 2.2uF 50V 105C Case 4 x 5.3	Capacitor Al Electrolytic	AVEZ225M50B12T-F	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JWEAM Winbond	1	 New Family of SpiFlash® Memories– W25M512JV: 2 x 256M-bit (2 x 32M-Byte)– Standard SPI: CLK, /CS, DI, DO– Dual SPI: CLK, /CS, IO0, IO1– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3– 3 or 4-Byte Addressing Mode– Software Die Select (C2h)– Software & Hardware Reset(1) High Performance Serial Flash– 104MHz Standard/Dual/Quad SPI clocks– 208/416MHz equivalent Dual/Quad SPI– 50MB/s continuous data transfer rate– Min. 100K Program-Erase cycles persector– More than 20-year data retention	Small Outline No-lead	W25M512JWEAM	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVBAM Winbond	1	512Mb Serial NOR Flash 104MHz TFBGA (5X5)24	BGA	W25M512JVBAM	3D model available Symbol and footprint available 3	1 Download Model
	C1210C225M5R1CAUTO Yageo Group	1	SMD, MLCC, Stacked, Single Chip, Class II, Automotive Grade	Capacitor Chip Non-polarised	C1210C225M5R1CAUTO	3D model available Symbol and footprint available 3	1 Download Model
	CKG45NX7R2A225M500JH TDK	1	TDK - CKG45NX7R2A225M500JH - Multilayer Ceramic Capacitor, 2.2 µF, 100 V, 1812 [4532 Metric], MEGACAP CKG Series, ± 20%, X7R	Capacitor Chip Non-polarised	CKG45NX7R2A225M500JH	3D model available Symbol and footprint available 3	1 Download Model

	C1825C125M5RACTU Yageo Group	1	SMD Comm X7R, Ceramic, 1.2 uF, 20%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Class II, 2.5 % , 833.3 MOhms, 170 mg, 1825, 4.5mm, 6.4mm, 1.1mm, 0.6mm, 1000, 78 Weeks, 80	Other	C1825C125M5RACTU	3D model available Symbol and footprint available 3	1 Download Model
	C1206C225M5RALTU Yageo Group	1	SMD Comm X7R SnPb, Ceramic, 2.2 uF, 20%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, SnPb Termination, 10 % , 45.5 MOhms, 41 mg, 1206, 3.2mm, 1.6mm, 1.6mm, 0.5mm, 2000, 78 Weeks, 80	Other	C1206C225M5RALTU	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVBSM Winbond	1	512Mb Serial NOR Flash 104MHz TFBGA (5X5)24	BGA	W25M512JVBSM	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVFAQ Winbond	1	512Mb Serial NOR Flash 104MHz SOP16 2.7V - 3.6V	Small Outline Packages	W25M512JVFAQ	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVBSQ Winbond	1	512Mb Serial NOR Flash 104MHz TFBGA (5X5)24	BGA	W25M512JVBSQ	3D model available Symbol and footprint available 3	1 Download Model
	TPS325M5166Q-QP6T 3Peak Incorporated	1	Mixed-Signal Microcontrollers 156 MHz, based on ARM Core, TPSensor, rich analog, 1024KB, Flash, 208KB RAM	Quad Flat Packages	TPS325M5166Q-QP6T	3D model available Symbol and footprint available 3	1 Download Model
	TPS325M5156Q-QP7T 3Peak Incorporated	1	ARM® Cortex®M33 w/FPU TPS325M Microcontroller IC 32-Bit 156MHz 512KB FLASH LQFP-100(14x14)	Quad Flat Packages	TPS325M5156Q-QP7T	3D model available Symbol and footprint available 3	1 Download Model
	C2225C225M5RAC7210 Yageo Group	1	SMD Comm X7R, Ceramic, 2.2 uF, 20%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, Class II, 2.5 % , 454.5 MOhms, 350 mg, 2225, 5.6mm, 6.4mm, 1.3mm, 0.6mm, 4000, 78 Weeks, 80	Other	C2225C225M5RAC7210	3D model available Symbol and footprint available 3	1 Download Model
	W25M512JVEAM Winbond	1	512Mb Serial NOR Flash 104MHz SON8	Small Outline No-lead	W25M512JVEAM	3D model available Symbol and footprint available 3	1 Download Model
	SND25M5R200G Positronic	1	D-Sub Standard Connectors D-Sub Male Connector 25P Solder Tail Right Angle Gold Shell	Other	SND25M5R200G	3D model not available Symbol and footprint available 2	1 Download Model
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