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R5F21321MNSP#30
Renesas Electronics
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1 | The R8C/32M Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32M Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21321MNSP#30 |
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2132271031
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Vertical, 0.38µm Gold (Au) Plating, 10 Circuits, Black | Other | 2132271031 |
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20021321-00006T4LF
Amphenol Communications Solutions
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1 | Minitek127®, Board to Board connectors, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, 6 Positions, 1.27mm (0.05inch) pitch | Other | 20021321-00006T4LF |
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2132251331
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Surface Mount, Vertical, 0.38µm Gold (Au) Plating, 13 Circuits, Black | Other | 2132251331 |
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UPTF1206-8W-N-2132BT-1K
Venkel
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1 | Ultra Precision Thin Film CR,1206,1/8W,10PPM,21.3K,?0.1% | Other | UPTF1206-8W-N-2132BT-1K |
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09221326918
HARTING
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1 | DIN-Signal 2B032MR-3,0C1-2-V2 DIN 2B MALE ANGLED 32PIN PL2 T | Other | 09221326918 |
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TFCR2512-2W-K-2132DT
Venkel
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1 | Thin Film CR,2512,1/2W,?100PPM,21.3K,?0.5% | Other | TFCR2512-2W-K-2132DT |
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2132273471
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Vertical, 0.76µm Gold (Au) Plating, 34 Circuits, Black | Other | 2132273471 |
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TFCR2512-2W-K-2132BT-1K
Venkel
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1 | Thin Film CR,2512,1/2W,?100PPM,21.3K,?0.1% | Other | TFCR2512-2W-K-2132BT-1K |
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2132281630
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Right-Angle, 0.38µm Gold (Au) Plating, 16 Circuits, Natural | Other | 2132281630 |
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UPTF1206-8W-P-2132UT
Venkel
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1 | Ultra Precision Thin Film CR,1206,1/8W,5PPM,21.3K,?0.01% | Other | UPTF1206-8W-P-2132UT |
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2132281071
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Dual Row, Surface Mount, Right-Angle, 0.76µm Gold (Au) Plating, 10 Circuits, Black | Other | 2132281071 |
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2132250231
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Surface Mount, Vertical, 0.38µm Gold (Au) Plating, 2 Circuits, Black | Other | 2132250231 |
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2132251031
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Surface Mount, Vertical, 0.38µm Gold (Au) Plating, 10 Circuits, Black | Other | 2132251031 |
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TFCR0603-16W-C-2132DT
Venkel
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1 | Thin Film CR,0603,1/16W,?50PPM,21.3K,?0.5% | Other | TFCR0603-16W-C-2132DT |
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R5F21322DNSP#54
Renesas Electronics
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1 | The R8C/32D Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21322DNSP#54 |
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2132261211
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Surface Mount, Right-Angle, 0.10µm Gold (Au) Plating, 12 Circuits, Black | Other | 2132261211 |
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R5F21324CNSP#W4
Renesas Electronics
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1 | The R8C/32C Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324CNSP#W4 |
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B82477G2132M000
TDK
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1 | SMD / SMT Inductors (Coils), L=1.3μH, 12.3mm x 12.3mm | Inductors Precision Moulded | B82477G2132M000 |
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B82731H2132A030
TDK
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1 | Epcos 6.8 mH -30 → +50% Ferrite Common Mode Choke, Max SRF:10kHz, 1.3A Idc, 280mΩ Rdc B82731H., | Other | B82731H2132A030 |
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TFCR2512-2W-K-2132BT
Venkel
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1 | Thin Film CR,2512,1/2W,?100PPM,21.3K,?0.1% | Other | TFCR2512-2W-K-2132BT |
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09021327922
HARTING
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1 | DIN B male straight 32pin, PL3 (even columns loaded) | Other | 09021327922 |
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2132260511
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Surface Mount, Right-Angle, 0.10µm Gold (Au) Plating, 5 Circuits, Black | Other | 2132260511 |
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TFCR0805-8W-C-2132FT
Venkel
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1 | Thin Film CR,0805,1/8W,?50PPM,21.3K,?1% | Other | TFCR0805-8W-C-2132FT |
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PIC32CX2051BZ62132-I/3WW
Microchip
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1 | IC RF TxRx + MCU 802.15.4, Bluetooth Bluetooth v6.0, Thread, Zigbee® 132-VFQFN Dual Rows, Exposed Pad | Other | PIC32CX2051BZ62132-I/3WW |
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