580R3 Footprint, Symbol and 3D Model search results

Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
No results were found for 580R3 Request this part

Showing 25 of 14067 results

Price & Stock Powered by

Filter by Manufacturer

Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	53258-0329 Molex	1	Molex 53258, 3.5mm Pitch, 3 Way, 1 Row, Straight PCB Header, Through Hole	Header, Shrouded - Straight PTH Box	53258-0329	3D model available Symbol and footprint available 3	1 Download Model
	34958-0384 Molex	1	Automotive Connectors MINI50 VHDR 38CKT GRY POL B	Other	34958-0384	3D model available Symbol and footprint available 3	1 Download Model
	449145803 Molex	1	Micro-Fit CPI Header, Compliant Pin Interface, Dual Row, Vertical, Tin (Sn) Plating, Glow-Wire Capable	Other	449145803	3D model available Symbol and footprint available 3	1 Download Model
	TSSP58038 Vishay	1	IR Receiver Module 38KHz 25m EMI 3-Pin	Other	TSSP58038	3D model available Symbol and footprint available 3	1 Download Model

	71V65803S150BQ Renesas Electronics	1	The 71V65803 3.3V CMOS SRAM organized as 512K X 18. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, it has been given the name ZBTTM, or Zero Bus Turnaround. The 71V65803 contains data I/O, address and control signal registers. In the burst mode, it can provide four cycles of data for a single address presented to the SRAM.	BGA	71V65803S150BQ	3D model available Symbol and footprint available 3	1 Download Model
	71V65803S133PFG8 Renesas Electronics	1	The 71V65803 3.3V CMOS SRAM organized as 512K X 18. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, it has been given the name ZBTTM, or Zero Bus Turnaround. The 71V65803 contains data I/O, address and control signal registers. In the burst mode, it can provide four cycles of data for a single address presented to the SRAM.	Quad Flat Packages	71V65803S133PFG8	3D model available Symbol and footprint available 3	1 Download Model
	1758034 Phoenix Contact	1	MSTBV 2,5/ 4-G-5,08 - PCB headers, nominal cross section: 2.5 mm², color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 4, number of rows: 1, number of positions: 4, number of connections: 4, product range: MSTBV 2,5/..-G, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.9 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern	Other	1758034	3D model available Symbol and footprint available 3	1 Download Model
	71V65803S100BGGI Renesas Electronics	1	The 71V65803 3.3V CMOS SRAM organized as 512K X 18. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, it has been given the name ZBTTM, or Zero Bus Turnaround. The 71V65803 contains data I/O, address and control signal registers. In the burst mode, it can provide four cycles of data for a single address presented to the SRAM.	BGA	71V65803S100BGGI	3D model available Symbol and footprint available 3	1 Download Model
	71V65803S133BGI Renesas Electronics	1	The 71V65803 3.3V CMOS SRAM organized as 512K X 18. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, it has been given the name ZBTTM, or Zero Bus Turnaround. The 71V65803 contains data I/O, address and control signal registers. In the burst mode, it can provide four cycles of data for a single address presented to the SRAM.	BGA	71V65803S133BGI	3D model available Symbol and footprint available 3	1 Download Model
	FTE-158-03-G-DV-A-P SAMTEC	1	116 Position, 0.80 mm Surface Mount Micro Terminal Strip, Vertical Mount	Other	FTE-158-03-G-DV-A-P	3D model not available Symbol and footprint available 2	1 Download Model
	71V65803S150BG8 Renesas Electronics	1	The 71V65803 3.3V CMOS SRAM organized as 512K X 18. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, it has been given the name ZBTTM, or Zero Bus Turnaround. The 71V65803 contains data I/O, address and control signal registers. In the burst mode, it can provide four cycles of data for a single address presented to the SRAM.	BGA	71V65803S150BG8	3D model available Symbol and footprint available 3	1 Download Model
	B58035U9255M001 TDK	1	TDK - B58035U9255M001 - Multilayer Ceramic Capacitor, 2.5 ?F, 900 V, SMD, CeraLink FA Series, ? 20%	Other	B58035U9255M001	3D model available Symbol and footprint available 3	1 Download Model
	B58035U5305M062 TDK	1	Specialty Ceramic Capacitors 500V 3uF Ceralink Flex Assembly 3	Other	B58035U5305M062	3D model available Symbol and footprint available 3	1 Download Model
	B58035U7105M052 TDK	1	CeraLink? Capacitors, 1 ?F, 700 V, LxWxT=7.4x6x9.1 mm	Other	B58035U7105M052	3D model available Symbol and footprint available 3	1 Download Model
	1758030000 Weidmüller	1	PCB terminal, 320 V, 15 A, Pitch in mm: 5.08, 2.5 mm², Number of poles: 30, Tension-clamp connection, THT solder connection, 135°, Box	Other	1758030000	3D model available Symbol and footprint available 3	1 Download Model

	71V65803S150BGI8 Renesas Electronics	1	The 71V65803 3.3V CMOS SRAM organized as 512K X 18. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, it has been given the name ZBTTM, or Zero Bus Turnaround. The 71V65803 contains data I/O, address and control signal registers. In the burst mode, it can provide four cycles of data for a single address presented to the SRAM.	BGA	71V65803S150BGI8	3D model available Symbol and footprint available 3	1 Download Model
	B88069X5803T602 TDK	1	Surge Arresters, 2 electrodes Arresters, Nominal DC sparkover voltage = 350V	Other	B88069X5803T602	3D model available Symbol and footprint available 3	1 Download Model
	71V65803S100PFGI Renesas Electronics	1	The 71V65803 3.3V CMOS SRAM organized as 512K X 18. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, it has been given the name ZBTTM, or Zero Bus Turnaround. The 71V65803 contains data I/O, address and control signal registers. In the burst mode, it can provide four cycles of data for a single address presented to the SRAM.	Quad Flat Packages	71V65803S100PFGI	3D model available Symbol and footprint available 3	1 Download Model
	71V65803S150PFGI8 Renesas Electronics	1	The 71V65803 3.3V CMOS SRAM organized as 512K X 18. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, it has been given the name ZBTTM, or Zero Bus Turnaround. The 71V65803 contains data I/O, address and control signal registers. In the burst mode, it can provide four cycles of data for a single address presented to the SRAM.	Quad Flat Packages	71V65803S150PFGI8	3D model available Symbol and footprint available 3	1 Download Model
	71V65803S100BQI Renesas Electronics	1	The 71V65803 3.3V CMOS SRAM organized as 512K X 18. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, it has been given the name ZBTTM, or Zero Bus Turnaround. The 71V65803 contains data I/O, address and control signal registers. In the burst mode, it can provide four cycles of data for a single address presented to the SRAM.	BGA	71V65803S100BQI	3D model available Symbol and footprint available 3	1 Download Model
	71V65803S150BQI8 Renesas Electronics	1	The 71V65803 3.3V CMOS SRAM organized as 512K X 18. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, it has been given the name ZBTTM, or Zero Bus Turnaround. The 71V65803 contains data I/O, address and control signal registers. In the burst mode, it can provide four cycles of data for a single address presented to the SRAM.	BGA	71V65803S150BQI8	3D model available Symbol and footprint available 3	1 Download Model
	MS580330BA01-00 TE Connectivity	1	Dimensions: Dimensions .24 x .25 INCH \| Dimensions 6.2 x 6.4 MM \| Electrical Characteristics: Board Level Pressure Sensor Supply Voltage 1.8 â€“ 3.6 V \| Operation/Application: Board Level Pressure Sensor Accuracy Â±400mbar \| Resolution .5 \| Output/Span 24 bit ADC \| Pressure 30000 MBAR \| Other: Sensor Options No Option \| Packaging Features: Board Level Pressure Sensor Package Surface Mountable \| Product Type Features: Board Level Pressure Sensor Type Digital Pressure and Altimeter Sensor Modules \| Board Leve	Other	MS580330BA01-00	3D model available Symbol and footprint available 3	1 Download Model
	0558-0-15-80-30-84-10-0 Mill-Max	1	Pin Receptacle Connector 0.015" ~ 0.025" (0.38mm ~ 0.64mm) No Tail Solder	Other	0558-0-15-80-30-84-10-0	3D model available Symbol and footprint available 3	1 Download Model
	34958-0340 Molex	1	Automotive Connectors MINI50 UNSLVHYBD HDR 3RW 34CKT BLK POL A	Other	34958-0340	3D model available Symbol and footprint available 3	1 Download Model
	MS580307BA06-00 TE Connectivity	1	Board Mount Pressure Sensors DUAL-R HE WHITEGEL TUBE	Other	MS580307BA06-00	3D model available Symbol and footprint available 3	1 Download Model
1 2 3 4 5 6 7 8 9

Can't find what you're looking for? Request this part

580R3 Model Download Search Results

Results for similar keyword: 5803

Popular