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8266 Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
1-826646-6 TE Connectivity
1 16w s/r straight pin header gold Mod II Header, Vertical 1-826646-6 1 Download Model
Part Image Part Image
1-826629-0 TE Connectivity
1 10w Single row straight header gold Header, Vertical 1-826629-0 1 Download Model
Part Image Part Image
LE88266TQC Microsemi Corporation
1 Telecom Interface ICs 2CH FXS, 8kHz, 100V ABS VoicePort Quad Flat No-Lead LE88266TQC 1 Download Model
Part Image Part Image
1-826656-0 TE Connectivity
1 2x10 straight pin header gold Mod II Header, Vertical 1-826656-0 1 Download Model
Part Image Part Image
2-826646-0 TE Connectivity
1 Body Features: Primary Product Color Green | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 20 | Connector Contact Load Condition Fully Loaded | Board-to-Board Configuration Parallel | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 31.5 MICIN | Mating Square Post Dimension .63 MM | Contac Header, Vertical 2-826646-0 1 Download Model
Part Image Part Image 1 Crystal 26.69MHz ±10ppm (Tol) ±15ppm (Stability) 18pF FUND 50Ohm 4-Pin Ultra Mini-CSMD T/R Other ABM8-26.690MHZ-D1G-T 1 Download Model
Part Image Part Image 1 CERAMIC SMD CRYSTAL Other ABM826690MHZD1GT 1 Download Model
Part Image Part Image
3-826632-2 TE Connectivity
1 32P AMPMODU II PIN HDR. Header, Vertical 3-826632-2 1 Download Model
Part Image Part Image
3-826646-2 TE Connectivity
1 Body Features: Primary Product Color Green | Configuration Features: Number of Rows 1 | Board-to-Board Configuration Parallel | Number of Positions 32 | Connector Contact Load Condition Fully Loaded | PCB Mount Orientation Vertical | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness 31.5 MICIN | Mating Square Post Dimension .025 INCH | PCB Contact Termination Area Plating Material Thickness 3 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nick Header, Vertical 3-826646-2 1 Download Model
Part Image Part Image
79RC32K438-266BBGI Renesas Electronics
1 32-bit MIPS CPU core with dual on-chip 10/100 Mbps Ethernet interface, DDR controller, 32-bit PCI interface, I2C controller, DMA controller, Serial Peripheral interface BGA 79RC32K438-266BBGI 1 Download Model
Part Image Part Image
1-826646-3 TE Connectivity
This part was updated within the past 30 days.
Set alerts for model updates on the part download page.
1 Body Features: Primary Product Color Green | Configuration Features: Connector Contact Load Condition Fully Loaded | \r\nBoard-to-Board Configuration Parallel | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 13 | Contact Features: Mating Square Post Dimension .025 INCH | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Base Material Phosphor Bronze | Mating Square Post Dimension .63 MM | Contact Type Pin | PCB Contact Termination Area Plating Mat Header, Vertical 1-826646-3 1 Download Model
Part Image Part Image
171826-6 TE Connectivity
1 Body Features: Connector Profile Low | Primary Product Color Natural | Configuration Features: Number of Positions 6 | PCB Mount Orientation Horizontal | Number of Rows 1 | Contact Features: PCB Contact Termination Area Plating Material Thickness .8 MICM | Contact Current Rating (Max) 3.5 AMP | Contact Type Pin | Contact Mating Area Length 7.5 MM | Contact Base Material Brass | Contact Mating Area Length .295 INCH | Contact Mating Area Plating Material Nickel | Contact Shape & Form Square | Mating Square Po Other 171826-6 1 Download Model
Part Image Part Image
79RC32K438-266BBI Renesas Electronics
1 32-bit MIPS CPU core with dual on-chip 10/100 Mbps Ethernet interface, DDR controller, 32-bit PCI interface, I2C controller, DMA controller, Serial Peripheral interface BGA 79RC32K438-266BBI 1 Download Model
Part Image Part Image
2-826634-0 TE Connectivity
1 2/20 r/a pin header gold Mod II Other 2-826634-0 1 Download Model
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1-826632-0 TE Connectivity
1 10w Double row straight header gold Other 1-826632-0 1 Download Model
Part Image Part Image
1-826632-8 TE Connectivity
1 CONN HEADER VERT 36POS 2.54MM Header, Vertical 1-826632-8 1 Download Model
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ESP8266 Espressif Systems
1 Wi-Fi Alliance Quad Flat No-Lead ESP8266 1 Download Model
Part Image Part Image 1 CS10 Series Other CS10-3082667 1 Download Model
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1-826648-6 TE Connectivity
1 Conn Unshrouded Header HDR 16 POS 2.54mm Solder ST Thru-Hole Carton Header, Vertical 1-826648-6 1 Download Model
Part Image Part Image
282826-6 TE Connectivity
1 Body Features: Product Orientation Vertical | Primary Product Color Green | Configuration Features: Stacking Configuration Side Stackable | Number of Rows 1 | Number of Positions 6 | Contact Features: Contact Base Material Copper Alloy | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 15 AMP | Dimensions: Wire Size .05 – 3 MMSQ | Wire Size 30 – 12 AWG | Electrical Characteristics: Operating Voltage 600 VAC | Housing Features: Housing Material PA 66 | Centerline (Pitch) .394 INCH Other 282826-6 1 Download Model
Part Image Part Image 1 CRYSTAL 26.6900MHZ 20PF SMD Other ABM8-26.690MHZ-20-B2Y-T 1 Download Model
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826659-4 TE's AMP
1 8 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER 826659-4 0 Build or Request
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826649-7 TE's AMP
1 7 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER 826649-7 0 Build or Request
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826657-3 TE Connectivity
1 CONNECTOR, 6 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER 826657-3 0 Build or Request
Part Image Part Image
826657-8 TE Connectivity
1 CONNECTOR, 16 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER 826657-8 0 Build or Request
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