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826949-2
TE Connectivity
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1 | Body Features: Primary Product Color Green | Configuration Features: Number of Positions 2 | PCB Mount Orientation Right Angle | Board-to-Board Configuration Perpendicular | Connector Contact Load Condition Fully Loaded | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2 MICM | Mating Square Post Dimension .025 INCH | Contact Underplating Material Nickel | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Mat | Other | 826949-2 |
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B32694A7473J008
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.047uF, 1250V DC, 11.5mm(W) x 20mm(H) x 32.5mm(L) | Other | B32694A7473J008 |
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B32693A1332A010
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.0033uF, 1600V DC, 7mm(W) x 13mm(H) x 27.5mm(L) | Other | B32693A1332A010 |
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B32693A1333K020
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.033uF, 1600V DC, 15.5mm(W) x 22.5mm(H) x 27.5mm(L) | Other | B32693A1333K020 |
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B32694A7683J008
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.068uF, 1250V DC, 13mm(W) x 23mm(H) x 32.5mm(L) | Other | B32694A7683J008 |
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09233326919
HARTING
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1 | DIN 2C male angled, 32pin, w/ board locks, PL2, THR/SMC (rows a,c loaded) | Other | 09233326919 |
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R5F10269GSM#55
Renesas Electronics
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1 | RL78/G12 microcontrollers balance the industry's lowest level of consumption current (CPU: 63 μA/MHz, standby (STOP): 230 nA) and a high performance of 32.4 DMIPS (24 MHz). They have an on-chip oscillator, data flash, A/D converter, and more. Built-in safety features (function that detects illegal operation of hardware) enable support for the household appliance safety standard (IEC/UL 60730). With a 20 to 30-pin compact package lineup, these microcontrollers are perfect for sub-microcontrollers of small ap | Small Outline Packages | R5F10269GSM#55 |
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R5F10269ASM#75
Renesas Electronics
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1 | RL78 RL78/G12 Microcontroller IC 16-Bit 24MHz 12KB (12K x 8) FLASH 20-LSSOP | Small Outline Packages | R5F10269ASM#75 |
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B32693A2332A011
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.0033uF, 2000V DC, 7mm(W) x 14mm(H) x 27.5mm(L) | Other | B32693A2332A011 |
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B32693A6333K008
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.033uF, 630V DC, 7mm(W) x 15mm(H) x 27.5mm(L) | Other | B32693A6333K008 |
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709269L9PF
Renesas Electronics
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1 | The 709269 is a high-speed 16K x 16 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. | Quad Flat Packages | 709269L9PF |
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09041326952
HARTING
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1 | DIN D male straight 32pin, PL2 (leading pins a2,a32) | Other | 09041326952 |
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74269262601
Würth Elektronik
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1 | WE-TMSB SMT EMI Suppression Ferrite Bead Size 0603; Z @ 100MHz = 600 Ω; Zmax = 634 Ω @ 184; IR = 1500 mA; RDC = 0.1 Ω | Ferrite Bead Chip | 74269262601 |
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2-826925-0
TE Connectivity
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1 | Body Features: Primary Product Color Green | Configuration Features: Board-to-Board Configuration Parallel | Connector Contact Load Condition Fully Loaded | Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 40 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3 MICM | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Mating Square Post Dimension .025 INCH | Mating Square Post Dimension .63 MM | Contact Mating Ar | Header, Vertical | 2-826925-0 |
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R5F10269ASM#15
Renesas Electronics
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1 | RL78/G12 microcontrollers balance the industry's lowest level of consumption current (CPU: 63 μA/MHz, standby (STOP): 230 nA) and a high performance of 32.4 DMIPS (24 MHz). They have an on-chip oscillator, data flash, A/D converter, and more. Built-in safety features (function that detects illegal operation of hardware) enable support for the household appliance safety standard (IEC/UL 60730). With a 20 to 30-pin compact package lineup, these microcontrollers are perfect for sub-microcontrollers of small ap | Small Outline Packages | R5F10269ASM#15 |
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1 | Diplexers, Pass Band/Low Band=1710 to 2200MHz, Pass Band/High Band=2496 to 3800MHz | Other | DPX202690DT-4084A5 |
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B32693A7473A010
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.047uF, 1250V DC, 14mm(W) x 21mm(H) x 27.5mm(L) | Other | B32693A7473A010 |
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B32693A1333J010
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.033uF, 1600V DC, 15.5mm(W) x 22.5mm(H) x 27.5mm(L) | Other | B32693A1333J010 |
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B32693A2153K189
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.015uF, 2000V DC, 13mm(W) x 20.5mm(H) x 27.5mm(L) | Other | B32693A2153K189 |
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TDA7269A
STMicroelectronics
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1 | 14 + 14W stereo amplifier with mute & st-by | Transistor Outline, Vertical | TDA7269A |
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B32693A2153K020
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.015uF, 2000V DC, 13mm(W) x 20.5mm(H) x 27.5mm(L) | Other | B32693A2153K020 |
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1378269
Phoenix Contact
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1 | DD32H 2,2/ 8-H-5,08-XX - PCB headers, color: black, nominal current: 8 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of rows: 2, number of positions: 8, product range: DD32H 2,2/..-H, pitch: 5.08 mm, connection method: Crimp connection, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.8 mm, number of solder pins per potential: 1, plug-in system: CONNEXIS DD, Pin connector pattern alignment: Standard, locking: Snap-in locking, mounting metho | Other | 1378269 |
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1 | Filters, Pass Band=673 to 2690MHz, Zc=50se | 50se | Other | DEA162690LT-5051B1 |
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B32693A3332A020
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.0033uF, 2500V DC, 9.5mm(W) x 16mm(H) x 27.5mm(L) | Other | B32693A3332A020 |
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5226993-3
TE Connectivity
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1 | Body Features: Body Material Zinc | Body Plating Material Nickel | Body Material Finish Passivated | Configuration Features: Number of Positions 1 | PCB Mount Orientation Vertical | Number of Coaxial Contacts 1 | Contact Features: RF Connector Center Contact Material Phosphor Bronze | RF Connector Center Contact Plating Thickness 5080 MICIN | RF Connector Center Contact Plating Material Gold | RF Connector Center Contact Underplating Material Nickel | Dimensions: RF Connector Mated Outer Diameter (Approxima | Other | 5226993-3 |
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