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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	R5F21144DSP#U0 Renesas Electronics	1	Renesas Electronics	Small Outline Packages	R5F21144DSP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21276NFP Renesas Electronics	1	RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES	Quad Flat Packages	R5F21276NFP	3D model available Symbol and footprint available 3	1 Download Model
	R5F2136CCDFP#U0 Renesas Electronics	1	Renesas Electronics R5F2136CCDFP#U0, 16bit R8C Microcontroller, 20MHz, 128 kB Flash, 64-Pin LFQFP	Quad Flat Packages	R5F2136CCDFP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21256SNFP#W4 Renesas Electronics	1	IC MCU 16BIT 32KB FLASH 52LQFP	Quad Flat Packages	R5F21256SNFP#W4	3D model available Symbol and footprint available 3	1 Download Model

	R5F21134DFP#U0 Renesas Electronics	1	RENESAS - R5F21134DFP#U0 - MCU, 16BIT, R8C, 20MHZ, LQFP-32	Quad Flat Packages	R5F21134DFP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211B1SP#U0 Renesas Electronics	1	The R8C/1B Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high	Small Outline Packages	R5F211B1SP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21344CDFP#U0 Renesas Electronics	1	The R8C/34C Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/34C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Quad Flat Packages	R5F21344CDFP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21357CNFP#X4 Renesas Electronics	1	The R8C/35C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/35C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Quad Flat Packages	R5F21357CNFP#X4	3D model available Symbol and footprint available 3	1 Download Model
	R5F21272SNFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21272SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F2122CJFP#U0 Renesas Electronics	1	The R8C/22 Group is supported only for customers who have already adopted these products. The RL78/F12, F13, F14, F15 Groups are recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This Furthermore, the data fl	Quad Flat Packages	R5F2122CJFP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F212K2SNFP#X6 Renesas Electronics	1	The R8C/2K Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/2H Group and R8C/2J Group of single-chip MCUs incorporate the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the suppo	Quad Flat Packages	R5F212K2SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21357CNFP#V0 Renesas Electronics	1	The R8C/35C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/35C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Quad Flat Packages	R5F21357CNFP#V0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21322DDSP#54 Renesas Electronics	1	The R8C/32D Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Small Outline Packages	R5F21322DDSP#54	3D model available Symbol and footprint available 3	1 Download Model
	R5F212AASDFA#V2 Renesas Electronics	1	The R8C/2A Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat	Quad Flat Packages	R5F212AASDFA#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F21346CDFP#U0 Renesas Electronics	1	The R8C/34C Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/34C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Quad Flat Packages	R5F21346CDFP#U0	3D model available Symbol and footprint available 3	1 Download Model

	R5F21324MNSP#30 Renesas Electronics	1	The R8C/32M Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32M Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Small Outline Packages	R5F21324MNSP#30	3D model available Symbol and footprint available 3	1 Download Model
	R5F21321MNSP#30 Renesas Electronics	1	The R8C/32M Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32M Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Small Outline Packages	R5F21321MNSP#30	3D model available Symbol and footprint available 3	1 Download Model
	R5F21322DNSP#54 Renesas Electronics	1	The R8C/32D Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Small Outline Packages	R5F21322DNSP#54	3D model available Symbol and footprint available 3	1 Download Model
	R5F21324CNSP#W4 Renesas Electronics	1	The R8C/32C Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Small Outline Packages	R5F21324CNSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F2136CCNFP#50 Renesas Electronics	1	The R8C/36C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/36C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Quad Flat Packages	R5F2136CCNFP#50	3D model available Symbol and footprint available 3	1 Download Model
	R5F211A4SP#U0 Renesas Electronics	1	The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Small Outline Packages	R5F211A4SP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21275SNFP#V2 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21275SNFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F2136CCNFP#V0 Renesas Electronics	1	The R8C/36C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/36C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Quad Flat Packages	R5F2136CCNFP#V0	3D model available Symbol and footprint available 3	1 Download Model
	R5F212BCSDFP#V2 Renesas Electronics	1	The R8C/2B Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/2A Group and R8C/2B Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp	Quad Flat Packages	R5F212BCSDFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F21336CDFP#30 Renesas Electronics	1	The R8C/33C Group is supported only for customers who have already adopted these products.The R8C/33C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed	Quad Flat Packages	R5F21336CDFP#30	3D model available Symbol and footprint available 3	1 Download Model
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