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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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R75PR427050H3J
KEMET
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1 | R75H, Film, Metallized Polypropylene, Automotive Grade, 2.7 uF, 5%, 250 VAC, 630 VDC, 125°C, -55°C, 105°C, 0.06 % , 11.1111 GOhms, 180 V/us, 18 nH, 30 g, 32mm, 37mm, 22mm, Lead Spacing = 27.5mm, 112 | Other | R75PR427050H3J |
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R60DR54705050K
KEMET
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1 | R60, Film, Metallized Polyester, General Purpose, 47 uF, 10%, 40 VAC, 63 VDC, 105°C, -55°C, 85°C, 1 % , 26.6 MOhms, 1 V/us, 18 nH, 36.34 g, 32mm, 37mm, 22mm, Lead Spacing = 27.5mm, 112 | Other | R60DR54705050K |
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10137002-101LF
Amphenol Communications Solutions
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1 | ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 4-Pair, 8 column, 112 position, Right Angle Receptacle, No Guide Pin. | Other | 10137002-101LF |
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2401838-1
TE Connectivity
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1 | QSFP112, Connector, .8mm Centerline, Operating Temperature Range -55 – 85 °C, Data Rate (Max) 112 Gb/s, 38 Positionn | Other | 2401838-1 |
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R76TR34704030J
KEMET
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1 | R76, Film, Double Metallized Polypropylene, General Purpose, 0.47 uF, 5%, 650 VAC, 1600 VDC, 110°C, -55°C, 85°C, 0.03 % , 63.82979 GOhms, 2000 V/us, 18 nH, 31.26 g, 32mm, 37mm, 22mm, Lead Spacing = 27.5mm, 112 | Other | R76TR34704030J |
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R76MR42204030J
KEMET
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1 | R76, Film, Double Metallized Polypropylene, General Purpose, 2.2 uF, 5%, 250 VAC, 400 VDC, 110°C, -55°C, 85°C, 0.04 % , 13.63636 GOhms, 300 V/us, 18 nH, 31.26 g, 32mm, 37mm, 22mm, Lead Spacing = 27.5mm, 112 | Other | R76MR42204030J |
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R75TR356050H3J
KEMET
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1 | R75H, Film, Metallized Polypropylene, Automotive Grade, 0.56 uF, 5%, 650 VAC, 1600 VDC, 125°C, -55°C, 105°C, 0.05 % , 53.5714 GOhms, 1500 V/us, 18 nH, 32.4 g, 32mm, 37mm, 22mm, Lead Spacing = 27.5mm, 112 | Other | R75TR356050H3J |
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FS32K144UAT0VLHT
NXP
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1 | ARM Microcontrollers - MCU S32K144 Arm Cortex-M4F, 112 MHz, 512 Kb Flash, CAN FD, FlexIO, CSEc security, LQFP64 - S32K MCUs for General Purpose | Quad Flat Packages | FS32K144UAT0VLHT |
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2372928-2
TE Connectivity
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1 | Configuration Features: Number of Positions 38 | Contact Features: Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Electrical Characteristics: Data Rate (Max) 112 GBS | Housing Features: Centerline (Pitch) .8 MM | Industry Standards: UL Flammability Rating UL 94V-0 | Operation/Application: Heat Sink Compatible No | Other: Included Lightpipe No | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: P | Other | 2372928-2 |
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2302794-1
TE Connectivity
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1 | High Speed Backplane Connectors, 112 Position, Mating Alignment, Keyed Mating Alignment Type, 7 Row, 16 Column, PCB Mount Header, MULTIGIG RT 3 | Other | 2302794-1 |
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R75GR51004000J
KEMET
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1 | R75, Film, Metallized Polypropylene, General Purpose, 10 uF, 5%, 90 VAC, 160 VDC, 105°C, -55°C, 85°C, 0.1 % , 3 GOhms, 50 V/us, 18 nH, 31.26 g, 32mm, 37mm, 22mm, Lead Spacing = 27.5mm, 112 | Other | R75GR51004000J |
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R76TR347050H3J
KEMET
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1 | R76H, Film, Double Metallized Polypropylene, Automotive Grade, 0.47 uF, 5%, 650 VAC, 1600 VDC, 125°C, -55°C, 105°C, 0.03 % , 63.83 GOhms, 2000 V/us, 18 nH, 35.7 g, 32mm, 37mm, 22mm, Lead Spacing = 27.5mm, 112 | Other | R76TR347050H3J |
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2372133-2
TE Connectivity
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1 | Configuration Features: Number of Positions 76 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Dimensions: PCB Thickness (Recommended) 2.2 MM | PCB Thickness (Recommended) .086 INCH | Electrical Characteristics: Data Rate (Max) 112 GBS | Housing Features: Centerline (Pitch) .8 MM | Centerline (Pitch) .032 INCH | Industry Standards: UL Flammability Rating UL 94V-0 | Operation/Application: Circuit Application High Speed Data | Pluggable I/O Applic | Other | 2372133-2 |
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2372133-1
TE Connectivity
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1 | Configuration Features: Number of Positions 76 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Dimensions: PCB Thickness (Recommended) 2.2 MM | PCB Thickness (Recommended) .086 INCH | Electrical Characteristics: Data Rate (Max) 112 GBS | Housing Features: Centerline (Pitch) .032 INCH | Centerline (Pitch) .8 MM | Industry Standards: UL Flammability Rating UL 94V-0 | Operation/Application: Circuit Application High Speed Data | Pluggable I/O Applic | Other | 2372133-1 |
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1410190-3
TE Connectivity
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1 | Configuration Features: Number of Positions 112 | Number of Rows 7 | Number of Columns 16 | Backplane Architecture Traditional Backplane | Guide Location Center | Card Slot Centerline 20.3 MM | Card Slot Centerline .8 INCH | PCB Mount Orientation Right Angle | Contact Features: Contact Current Rating (Max) 1 AMP | Dimensions: Row-to-Row Spacing .053 INCH | Row-to-Row Spacing 1.35 MM | Housing Features: Number of Shrouded Sides 2 | Centerline (Pitch) .071 INCH | Centerline (Pitch) 1.8 MM | Mechanical Attachm | Other | 1410190-3 |
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R76UR322050H3J
KEMET
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1 | R76H, Film, Double Metallized Polypropylene, Automotive Grade, 0.22 uF, 5%, 700 VAC, 2000 VDC, 125°C, -55°C, 105°C, 0.03 % , 100 GOhms, 2500 V/us, 18 nH, 31.5 g, 32mm, 37mm, 22mm, Lead Spacing = 27.5mm, 112 | Other | R76UR322050H3J |
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2378765-1
TE Connectivity
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1 | Configuration Features: Number of Positions 20 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Tail Plating Material Gold Flash | Contact Current Rating (Max) 1.5 AMP | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Electrical Characteristics: Data Rate (Max) 112 GBS | Industry Standards: UL Flammability Rating UL 94V-0 | Operation/Application: Circuit Application High Speed Data | Pluggabl | Other | 2378765-1 |
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1410326-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Card Slot Centerline 20.3 MM | Number of Positions 112 | Number of Ground Positions 31 | Card Slot Centerline .8 INCH | Number of Pairs 20 | Backplane Architecture Traditional Backplane | Guide Location Right | Number of Rows 7 | Number of Columns 16 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Length .8 INCH | PCB Contact Termination Area Plating Material Tin-Lead | Contact Underplating Material Nickel | Con | Other | 1410326-3 |
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112-024-213R001
NorComp
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1 | I/O Connectors 24P Centronics fem R/A dip solder | Other | 112-024-213R001 |
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2-487952-4
TE Connectivity
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1 | 024 1MM FPC BTM HORZ | 2-487952-4 |
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2-487952-4
TE Connectivity
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1 | 024 1MM FPC BTM HORZ | 2-487952-4 |
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2-487378-3
TE Connectivity
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1 | 024 HOUSING FFC RCPT 100CL SR | 2-487378-3 |
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2-487769-2
TE Connectivity
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1 | 024 HOUSING FFC RCPT 100CL SR | 2-487769-2 |
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102153-5
TE Connectivity
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1 | 024 UNIV HDR SP 4S 15DP STD | 102153-5 |
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102161-5
TE Connectivity
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1 | 024 UNIV HDR RA 4S 15DP STD | 102161-5 |
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