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112-024-213R001 Model Download Search Results

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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image 1 R75H, Film, Metallized Polypropylene, Automotive Grade, 2.7 uF, 5%, 250 VAC, 630 VDC, 125°C, -55°C, 105°C, 0.06 % , 11.1111 GOhms, 180 V/us, 18 nH, 30 g, 32mm, 37mm, 22mm, Lead Spacing = 27.5mm, 112 Other R75PR427050H3J 1 Download Model
Part Image Part Image 1 R60, Film, Metallized Polyester, General Purpose, 47 uF, 10%, 40 VAC, 63 VDC, 105°C, -55°C, 85°C, 1 % , 26.6 MOhms, 1 V/us, 18 nH, 36.34 g, 32mm, 37mm, 22mm, Lead Spacing = 27.5mm, 112 Other R60DR54705050K 1 Download Model
Part Image Part Image
10137002-101LF Amphenol Communications Solutions
1 ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 4-Pair, 8 column, 112 position, Right Angle Receptacle, No Guide Pin. Other 10137002-101LF 1 Download Model
Part Image Part Image
2401838-1 TE Connectivity
1 QSFP112, Connector, .8mm Centerline, Operating Temperature Range -55 – 85 °C, Data Rate (Max) 112 Gb/s, 38 Positionn Other 2401838-1 1 Download Model
Part Image Part Image 1 R76, Film, Double Metallized Polypropylene, General Purpose, 0.47 uF, 5%, 650 VAC, 1600 VDC, 110°C, -55°C, 85°C, 0.03 % , 63.82979 GOhms, 2000 V/us, 18 nH, 31.26 g, 32mm, 37mm, 22mm, Lead Spacing = 27.5mm, 112 Other R76TR34704030J 1 Download Model
Part Image Part Image 1 R76, Film, Double Metallized Polypropylene, General Purpose, 2.2 uF, 5%, 250 VAC, 400 VDC, 110°C, -55°C, 85°C, 0.04 % , 13.63636 GOhms, 300 V/us, 18 nH, 31.26 g, 32mm, 37mm, 22mm, Lead Spacing = 27.5mm, 112 Other R76MR42204030J 1 Download Model
Part Image Part Image 1 R75H, Film, Metallized Polypropylene, Automotive Grade, 0.56 uF, 5%, 650 VAC, 1600 VDC, 125°C, -55°C, 105°C, 0.05 % , 53.5714 GOhms, 1500 V/us, 18 nH, 32.4 g, 32mm, 37mm, 22mm, Lead Spacing = 27.5mm, 112 Other R75TR356050H3J 1 Download Model
Part Image Part Image 1 ARM Microcontrollers - MCU S32K144 Arm Cortex-M4F, 112 MHz, 512 Kb Flash, CAN FD, FlexIO, CSEc security, LQFP64 - S32K MCUs for General Purpose Quad Flat Packages FS32K144UAT0VLHT 1 Download Model
Part Image Part Image
2372928-2 TE Connectivity
1 Configuration Features: Number of Positions 38 | Contact Features: Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Electrical Characteristics: Data Rate (Max) 112 GBS | Housing Features: Centerline (Pitch) .8 MM | Industry Standards: UL Flammability Rating UL 94V-0 | Operation/Application: Heat Sink Compatible No | Other: Included Lightpipe No | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: P Other 2372928-2 1 Download Model
Part Image Part Image
2302794-1 TE Connectivity
1 High Speed Backplane Connectors, 112 Position, Mating Alignment, Keyed Mating Alignment Type, 7 Row, 16 Column, PCB Mount Header, MULTIGIG RT 3 Other 2302794-1 1 Download Model
Part Image Part Image 1 R75, Film, Metallized Polypropylene, General Purpose, 10 uF, 5%, 90 VAC, 160 VDC, 105°C, -55°C, 85°C, 0.1 % , 3 GOhms, 50 V/us, 18 nH, 31.26 g, 32mm, 37mm, 22mm, Lead Spacing = 27.5mm, 112 Other R75GR51004000J 1 Download Model
Part Image Part Image 1 R76H, Film, Double Metallized Polypropylene, Automotive Grade, 0.47 uF, 5%, 650 VAC, 1600 VDC, 125°C, -55°C, 105°C, 0.03 % , 63.83 GOhms, 2000 V/us, 18 nH, 35.7 g, 32mm, 37mm, 22mm, Lead Spacing = 27.5mm, 112 Other R76TR347050H3J 1 Download Model
Part Image Part Image
2372133-2 TE Connectivity
1 Configuration Features: Number of Positions 76 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Dimensions: PCB Thickness (Recommended) 2.2 MM | PCB Thickness (Recommended) .086 INCH | Electrical Characteristics: Data Rate (Max) 112 GBS | Housing Features: Centerline (Pitch) .8 MM | Centerline (Pitch) .032 INCH | Industry Standards: UL Flammability Rating UL 94V-0 | Operation/Application: Circuit Application High Speed Data | Pluggable I/O Applic Other 2372133-2 1 Download Model
Part Image Part Image
2372133-1 TE Connectivity
1 Configuration Features: Number of Positions 76 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Current Rating (Max) .5 AMP | Dimensions: PCB Thickness (Recommended) 2.2 MM | PCB Thickness (Recommended) .086 INCH | Electrical Characteristics: Data Rate (Max) 112 GBS | Housing Features: Centerline (Pitch) .032 INCH | Centerline (Pitch) .8 MM | Industry Standards: UL Flammability Rating UL 94V-0 | Operation/Application: Circuit Application High Speed Data | Pluggable I/O Applic Other 2372133-1 1 Download Model
Part Image Part Image
1410190-3 TE Connectivity
1 Configuration Features: Number of Positions 112 | Number of Rows 7 | Number of Columns 16 | Backplane Architecture Traditional Backplane | Guide Location Center | Card Slot Centerline 20.3 MM | Card Slot Centerline .8 INCH | PCB Mount Orientation Right Angle | Contact Features: Contact Current Rating (Max) 1 AMP | Dimensions: Row-to-Row Spacing .053 INCH | Row-to-Row Spacing 1.35 MM | Housing Features: Number of Shrouded Sides 2 | Centerline (Pitch) .071 INCH | Centerline (Pitch) 1.8 MM | Mechanical Attachm Other 1410190-3 1 Download Model
Part Image Part Image 1 R76H, Film, Double Metallized Polypropylene, Automotive Grade, 0.22 uF, 5%, 700 VAC, 2000 VDC, 125°C, -55°C, 105°C, 0.03 % , 100 GOhms, 2500 V/us, 18 nH, 31.5 g, 32mm, 37mm, 22mm, Lead Spacing = 27.5mm, 112 Other R76UR322050H3J 1 Download Model
Part Image Part Image
2378765-1 TE Connectivity
1 Configuration Features: Number of Positions 20 | Contact Features: PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Tail Plating Material Gold Flash | Contact Current Rating (Max) 1.5 AMP | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Electrical Characteristics: Data Rate (Max) 112 GBS | Industry Standards: UL Flammability Rating UL 94V-0 | Operation/Application: Circuit Application High Speed Data | Pluggabl Other 2378765-1 1 Download Model
Part Image Part Image
1410326-3 TE Connectivity
1 Body Features: Primary Product Color Black | Configuration Features: Card Slot Centerline 20.3 MM | Number of Positions 112 | Number of Ground Positions 31 | Card Slot Centerline .8 INCH | Number of Pairs 20 | Backplane Architecture Traditional Backplane | Guide Location Right | Number of Rows 7 | Number of Columns 16 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Length .8 INCH | PCB Contact Termination Area Plating Material Tin-Lead | Contact Underplating Material Nickel | Con Other 1410326-3 1 Download Model
Part Image Part Image 1 I/O Connectors 24P Centronics fem R/A dip solder Other 112-024-213R001 0 Build or Request
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2-487952-4 TE Connectivity
1 024 1MM FPC BTM HORZ 2-487952-4 1 Download Model
Part Image Part Image
2-487952-4 TE Connectivity
1 024 1MM FPC BTM HORZ 2-487952-4 1 Download Model
Part Image Part Image
2-487378-3 TE Connectivity
1 024 HOUSING FFC RCPT 100CL SR 2-487378-3 1 Download Model
Part Image Part Image
2-487769-2 TE Connectivity
1 024 HOUSING FFC RCPT 100CL SR 2-487769-2 1 Download Model
Part Image Part Image
102153-5 TE Connectivity
1 024 UNIV HDR SP 4S 15DP STD 102153-5 1 Download Model
Part Image Part Image
102161-5 TE Connectivity
1 024 UNIV HDR RA 4S 15DP STD 102161-5 1 Download Model
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