2309- Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	2309B-1HDCGI Renesas Electronics	1	The IDT2309B is a high-speed phase-lock loop (PLL) clock buffer, designed to address high-speed clock distribution applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The IDT2309B is a 16-pin version of the IDT2305B. The IDT2309B accepts one reference input, and drives two banks of four low skew clocks. The -1H version of this device operates at up to 133MHz frequency and has higher drive than the -1 devic	Small Outline Packages	2309B-1HDCGI	3D model available Symbol and footprint available 3	1 Download Model
	2309A-1HDCGI8 Renesas Electronics	1	The 2309A is a high-speed phase-lock loop (PLL) clock buffer, designed to address high-speed clock distribution applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2309A is a 16-pin version of the 2305A. The 2309A accepts one reference input, and drives two banks of four low skew clocks. The -1H version of this device operates up to 133MHz frequency and has higher drive than the -1 device. All parts ha	Small Outline Packages	2309A-1HDCGI8	3D model available Symbol and footprint available 3	1 Download Model
	TSW-123-09-SM-D SAMTEC	1	46 Position, Classic PCB Header Strips, 0.100" pitch	Other	TSW-123-09-SM-D	3D model not available Symbol and footprint available 2	1 Download Model
	TSW-123-09-TL-D SAMTEC	1	46 Position, Classic PCB Header Strips, 0.100" pitch	Other	TSW-123-09-TL-D	3D model not available Symbol and footprint available 2	1 Download Model

	TSW-123-09-S-S SAMTEC	1	23 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-123-09-S-S	3D model not available Symbol and footprint available 2	1 Download Model
	TSW-123-09-H-D SAMTEC	1	46 Position, Classic PCB Header Strips, 0.100" pitch	Other	TSW-123-09-H-D	3D model not available Symbol and footprint available 2	1 Download Model
	TSW-123-09-SS-D SAMTEC	1	46 Position, Classic PCB Header Strips, 0.100" pitch	Other	TSW-123-09-SS-D	3D model not available Symbol and footprint available 2	1 Download Model
	2309390-1 TE Connectivity	1	Configuration Features: Number of Columns 8 \| Backplane Architecture Traditional Backplane \| PCB Mount Orientation Vertical \| Number of Signal Positions 32 \| Number of Positions 40 \| Stackable No \| Number of Power Positions 8 \| Contact Features: Contact Type Socket \| Contact Mating Area Plating Material Thickness 1.27 MICM \| Contact Mating Area Plating Material Gold over Nickel \| Contact Current Rating (Max) 75 AMP \| Contact Base Material Copper Alloy \| PCB Contact Termination Area Plating Material Thicknes	Other	2309390-1	3D model available Symbol and footprint available 3	1 Download Model
	2309409-5 TE Connectivity	1	Body Features: Latch Material High Temperature Thermoplastic \| Retention Post Location Both Ends \| Ejector Type Locking \| Ejector Location Both Ends \| Module Key Type Offset Left \| Connector Profile Low \| Configuration Features: Number of Positions 260 \| Number of Keys 1 \| Number of Rows 2 \| Module Orientation Right Angle \| Contact Features: Contact Base Material Copper Alloy \| Memory Socket Type Memory Card \| Contact Mating Area Plating Material Thickness 30 MICIN \| PCB Contact Termination Area Plating Mat	Other	2309409-5	3D model available Symbol and footprint available 3	1 Download Model
	1823094 Phoenix Contact	1	PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 320 V, nominal cross section: 1.5 mm?, Number of potentials: 3, Number of rows: 1, Number of positions per row: 3, product range: SPT 1,5/..-H-THR, pitch: 5.08 mm, connection method: Push-in spring connection, mounting: THR soldering, conductor/PCB connection direction: 0 ?, color: black, Pin layout: Linear double pinning, Solder pin [P]: 2.6 mm, type of packaging: packed in cardboard	Other	1823094	3D model available Symbol and footprint available 3	1 Download Model
	TSW-123-09-E-S SAMTEC	1	23 Position, Single Row, Classic PCB Header Strips, 0.100" pitch	Other	TSW-123-09-E-S	3D model not available Symbol and footprint available 2	1 Download Model
	2309A-1DCG Renesas Electronics	1	The 2309A is a high-speed phase-lock loop (PLL) clock buffer, designed to address high-speed clock distribution applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 133MHz. The 2309A is a 16-pin version of the 2305A. The 2309A accepts one reference input, and drives two banks of four low skew clocks. The -1H version of this device operates up to 133MHz frequency and has higher drive than the -1 device. All parts ha	Small Outline Packages	2309A-1DCG	3D model available Symbol and footprint available 3	1 Download Model
	V23092A1012A302 TE Connectivity	1	Body Features: Insulation Special Features Tracking Index of Relay Base PTI250 \| Product Weight 6 G \| Product Weight .2116 OZ \| Configuration Features: Output Switching Random \| Contact Features: Contact Arrangement 1 Form A (NO) \| Contact Number of Poles 1 \| Contact Material AgSnO2 \| Contact Current Rating (Max) 6 AMP \| Dimensions: Product Length 1.1 INCH \| Length Class (Mechanical) 25 â€“ 30 MM \| Product Height 15 MM \| Product Width 5 MM \| Product Height .59 INCH \| Product Width .196 INCH \| Product Length	Other	V23092A1012A302	3D model available Symbol and footprint available 3	1 Download Model
	2423090000 Weidmüller	1	Built-in plugs, M12, M 12, Number of poles: 4, Front mounting	Other	2423090000	3D model available Symbol and footprint available 3	1 Download Model
	ERF8-023-09.0-STL-DV-L-K-TR SAMTEC	1	46 Position, 0.80 mm Edge Rate® Rugged High Speed Socket	Other	ERF8-023-09.0-STL-DV-L-K-TR	3D model not available Symbol and footprint available 2	1 Download Model

	2309NZ-1HPGG8 Renesas Electronics	1	The IDT2309NZ is a low-cost buffer designed to distribute high-speed clocks in mobile PC systems and desktop PC systems with SDRAM support. This part has nine outputs, eight of which can be used to drive two DIMMs or four SO-DIMMs, and the remaining can be used for external feedback to a PLL. The IDT2309NZ operates at 3.3V and outputs can run up to 133.33MHz The IDT2309NZ is designed for low EMI and power optimization. It has multiple VDD and VSS pins for noise optimization and consumes less than 32mA at 66	Small Outline Packages	2309NZ-1HPGG8	3D model available Symbol and footprint available 3	1 Download Model
	ERF8-023-09.0-STL-DV-L-TR SAMTEC	1	46 Position, 0.80 mm Edge Rate® Rugged High Speed Socket	Other	ERF8-023-09.0-STL-DV-L-TR	3D model not available Symbol and footprint available 2	1 Download Model
	ERF8-023-09.0-L-DV SAMTEC	1	46 Position, 0.80 mm Edge Rate® Rugged High Speed Socket	Other	ERF8-023-09.0-L-DV	3D model not available Symbol and footprint available 2	1 Download Model
	2309413-3 TE Connectivity	1	Body Features: Retention Post Location Both Ends \| Retention Post Material Stainless Steel \| Connector Profile High \| Latch Material High Temperature Thermoplastic \| Ejector Type Locking \| Ejector Location Both Ends \| Module Key Type Offset Left \| Configuration Features: Number of Positions 260 \| Module Orientation Right Angle \| Number of Rows 2 \| Number of Keys 1 \| Contact Features: Contact Underplating Material Nickel \| Contact Mating Area Plating Material Thickness 10 MICIN \| Contact Current Rating (Max)	Other	2309413-3	3D model available Symbol and footprint available 3	1 Download Model
	TSW-123-09-FM-D SAMTEC	1	46 Position, Classic PCB Header Strips, 0.100" pitch	Other	TSW-123-09-FM-D	3D model not available Symbol and footprint available 2	1 Download Model
	CY2309SXI-1 Infineon	1	Zero Delay Buffer	Small Outline Packages	CY2309SXI-1	3D model available Symbol and footprint available 3	1 Download Model
	DW-23-09-F-D-315 SAMTEC	1	display	Header, Vertical	DW-23-09-F-D-315	3D model available Symbol and footprint available 3	1 Download Model
	V23092-A1005-A801 TE Connectivity	1	Power Relays, Standard, Monostable, DC, 170 mW Coil Power Rating DC, 147 Ω Coil Resistance, UL Coil Insulation Class F, SCHRACK Slimline PCB Relay SNR	Other	V23092-A1005-A801	3D model available Symbol and footprint available 3	1 Download Model
	MPC962309DT-1H Renesas Electronics	1	Renesas Electronics	Small Outline Packages	MPC962309DT-1H	3D model available Symbol and footprint available 3	1 Download Model
	CY2309CZXI-1 Infineon	1	Clock Buffer 3.3VZDB IND	Small Outline Packages	CY2309CZXI-1	3D model available Symbol and footprint available 3	1 Download Model
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