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KW CDLMM2.TK-Y2Y6-4L16M1-2686
ams OSRAM
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1 | High Power LEDs - White Forward Lighting LED - OSLON Compact PM - KW CDLMM2.TK - Tiny ceramic package 3 pad design | Other | KW CDLMM2.TK-Y2Y6-4L16M1-2686 |
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RDE5C1H101J0K1H03B
Murata Electronics
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1 | DE Series 4 x 3.5 x 2.5 mm 100 pF 50 V ±5 % C0G Multilayer Ceramic Capacitor | Other | RDE5C1H101J0K1H03B |
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ADC12SJ800AAV
Texas Instruments
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1 | Conversores de analógico a digital (ADC) Single-channel, 12-bit, 800-MSPS analog-to-digital converter (ADC) with JESD204C interface 144-FCBGA -40 to 85 | BGA | ADC12SJ800AAV |
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SSCMRRN005ND7A3
Honeywell
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1 | Capteur de pression ±0,07PSI (±0,5kPa) Différentiel Mâle - 0,08po (1,93mm) tube, double 12 b 8-SMD, sortie en J, ports doubles, même côté | Other | SSCMRRN005ND7A3 |
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5KP54CA
LITTELFUSE
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1 | • 5 kW peak pulse capability\r\nat 10/1000μs waveform,\r\nrepetition rate (duty\r\ncycles):0.01%\r\n• Glass passivated chip\r\njunction in P600 package\r\n• Fast response time:\r\ntypically less than 1.0ps\r\nfrom 0 Volts to BV min\r\n• Excellent clamping\r\ncapability\r\n• Typical failure mode is\r\nshort from over-specified\r\nvoltage or current\r\n• Whisker test is conducted\r\nbased on JEDEC\r\nJESD201A per its table 4a\r\nand 4c\r\n• IEC 61000-4-2 ESD\r\n30kV(Air), 30kV (Contact)\r\n• EFT protection of data\r\nlines in accordance with\r\nIEC 610 | Diodes, Axial Diameter Horizontal Mounting | 5KP54CA |
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SN74BCT125ANS
Texas Instruments
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1 | ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new de | Small Outline Packages | SN74BCT125ANS |
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ISL3295EIHZ-T7A
Renesas Electronics
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1 | A 26% smaller footprint is available with the ISL3298E TDFN package. This device also features a logic supply pin (VL) that sets the switching points of the DE and DI inputs to be compatible with a lower supply voltage in mixed voltage systems. For companion single RS-485 receivers in micro packages, please see the ISL3280E, ISL3281E, ISL3282E, ISL3283E, ISL3284E datasheet. | SOT23 (6-Pin) | ISL3295EIHZ-T7A |
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ISL3295EFHZ-T7A
Renesas Electronics
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1 | A 26% smaller footprint is available with the ISL3298E TDFN package. This device also features a logic supply pin (VL) that sets the switching points of the DE and DI inputs to be compatible with a lower supply voltage in mixed voltage systems. For companion single RS-485 receivers in micro packages, please see the ISL3280E, ISL3281E, ISL3282E, ISL3283E, ISL3284E datasheet. | SOT23 (6-Pin) | ISL3295EFHZ-T7A |
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ISL3295EIHZ-T
Renesas Electronics
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1 | A 26% smaller footprint is available with the ISL3298E TDFN package. This device also features a logic supply pin (VL) that sets the switching points of the DE and DI inputs to be compatible with a lower supply voltage in mixed voltage systems. For companion single RS-485 receivers in micro packages, please see the ISL3280E, ISL3281E, ISL3282E, ISL3283E, ISL3284E datasheet. | SOT23 (6-Pin) | ISL3295EIHZ-T |
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5962-8988002GC
Renesas Electronics
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1 | The HA-2520/883 is a monolithic operational amplifier which delivers an unsurpassed combination of specifications for slew rate, bandwidth and settling time. This dielectrically isolated amplifier is designed for closed loop gains of 3 or greater without external compensation. In addition, this high performance component also provides low offset current and high input impedance. The 100V/µs (min) slew rate and fast settling time of this amplifier make it ideal for pulse amplification and data acquisition de | Other | 5962-8988002GC |
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HS1-1840BEH-Q
Renesas Electronics
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1 | The HS-1840ARH, HS-1840AEH, HS-1840BRH and HS-1840BEH are radiation hardened, monolithic 16 channel multiplexers constructed with the Intersil Rad-Hard Silicon Gate, bonded wafer, Dielectric Isolation process. They are designed to provide a high input impedance to the analog source if device power fails (open), or the analog signal voltage inadvertently exceeds the supply by up to ±35V, regardless of whether the device is powered on or off. Excellent for use in redundant applications, since the secondary de | Ceramic Dual-In-Line Packages | HS1-1840BEH-Q |
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SMAF130A-TP
MCC
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1 | • IEC 61000-4-2 ESD 30kV(Air), 30kV (Contact)\r\n• For Surface Mount Applications\r\n• Unidirectional And Bidirectional\r\n• Fast Response Time:Typical Less Than 1ps From 0V to BV Min\r\n• High Temp Soldering: 260°C / 10 Seconds At Terminals\r\n• For Bidirectional Devices Add “C” To The Suffix of\r\nThe Part Number: i.e.SMAF5.0CA for 5% Tolerance\r\n• Halogen Free. “Green” Device (Note 1)\r\n• Moisture Sensitivity Level 1\r\n• Epoxy Meets UL 94 V-0 Flammability Rating\r\n• Lead Free Finish/RoHS Compliant (Note2) ("P" Suffix De | Small Outline Diode Flat Lead | SMAF130A-TP |
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HS1-1840ARH-T
Renesas Electronics
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1 | The HS-1840ARH, HS-1840AEH, HS-1840BRH and HS-1840BEH are radiation hardened, monolithic 16 channel multiplexers constructed with the Intersil Rad-Hard Silicon Gate, bonded wafer, Dielectric Isolation process. They are designed to provide a high input impedance to the analog source if device power fails (open), or the analog signal voltage inadvertently exceeds the supply by up to ±35V, regardless of whether the device is powered on or off. Excellent for use in redundant applications, since the secondary de | Ceramic Dual-In-Line Packages | HS1-1840ARH-T |
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1707311
Phoenix Contact
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1 | PCB header, nominal cross section: 1.5 mm?, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 12, Number of rows: 1, Number of positions per row: 12, number of connections: 12, product range: MCV 1,5/..-GF-THR, pitch: 3.81 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 1.4 mm, Stecksystem: MINI COMBICON, Locking: Screw locking, type of packaging: packed in cardboard, User information and de | Other | 1707311 |
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HS1-1840ARH-Q
Renesas Electronics
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1 | The HS-1840ARH, HS-1840AEH, HS-1840BRH and HS-1840BEH are radiation hardened, monolithic 16 channel multiplexers constructed with the Intersil Rad-Hard Silicon Gate, bonded wafer, Dielectric Isolation process. They are designed to provide a high input impedance to the analog source if device power fails (open), or the analog signal voltage inadvertently exceeds the supply by up to ±35V, regardless of whether the device is powered on or off. Excellent for use in redundant applications, since the secondary de | Ceramic Dual-In-Line Packages | HS1-1840ARH-Q |
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1955730
Phoenix Contact
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1 | PCB header, nominal cross section: 2.5 mm?, color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 12, Number of rows: 1, Number of positions per row: 12, number of connections: 12, product range: CCV 2,5/..-GF, pitch: 5.08 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, Stecksystem: CLASSIC COMBICON, Locking: Screw locking, type of packaging: packed in cardboard, User information and de | Other | 1955730 |
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SMAF150A-TP
MCC
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1 | • IEC 61000-4-2 ESD 30kV(Air), 30kV (Contact)\r\n• For Surface Mount Applications\r\n• Unidirectional And Bidirectional\r\n• Fast Response Time:Typical Less Than 1ps From 0V to BV Min\r\n• High Temp Soldering: 260°C / 10 Seconds At Terminals\r\n• For Bidirectional Devices Add “C” To The Suffix of\r\nThe Part Number: i.e.SMAF5.0CA for 5% Tolerance\r\n• Halogen Free. “Green” Device (Note 1)\r\n• Moisture Sensitivity Level 1\r\n• Epoxy Meets UL 94 V-0 Flammability Rating\r\n• Lead Free Finish/RoHS Compliant (Note2) ("P" Suffix De | Small Outline Diode Flat Lead | SMAF150A-TP |
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ISL3298EFRTZ-T
Renesas Electronics
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1 | A 26% smaller footprint is available with the ISL3298E TDFN package. This device also features a logic supply pin (VL) that sets the switching points of the DE and DI inputs to be compatible with a lower supply voltage in mixed voltage systems. For companion single RS-485 receivers in micro packages, please see the ISL3280E, ISL3281E, ISL3282E, ISL3283E, ISL3284E datasheet. | Small Outline No-lead | ISL3298EFRTZ-T |
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HS1-1840BRH-Q
Renesas Electronics
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1 | The HS-1840ARH, HS-1840AEH, HS-1840BRH and HS-1840BEH are radiation hardened, monolithic 16 channel multiplexers constructed with the Intersil Rad-Hard Silicon Gate, bonded wafer, Dielectric Isolation process. They are designed to provide a high input impedance to the analog source if device power fails (open), or the analog signal voltage inadvertently exceeds the supply by up to ±35V, regardless of whether the device is powered on or off. Excellent for use in redundant applications, since the secondary de | Ceramic Dual-In-Line Packages | HS1-1840BRH-Q |
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SLG51002C
Renesas Electronics
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1 | SLG51002 contains eight compact and customizable low dropout regulators and is designed for high performance camera modules and other small multi-rail applications.BenefitstGreenPAK™ cost-effective NVM programmable device with integrated high performance LDOs that enables innovators to integrate many system functions while minimizing component count, board space, and power consumptiontLDOs exceed the power performance requirements of newer image sensors to help produce the best image qualitytHelps system de | BGA | SLG51002C |
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HS1-1840BRH-8
Renesas Electronics
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1 | The HS-1840ARH, HS-1840AEH, HS-1840BRH and HS-1840BEH are radiation hardened, monolithic 16 channel multiplexers constructed with the Intersil Rad-Hard Silicon Gate, bonded wafer, Dielectric Isolation process. They are designed to provide a high input impedance to the analog source if device power fails (open), or the analog signal voltage inadvertently exceeds the supply by up to ±35V, regardless of whether the device is powered on or off. Excellent for use in redundant applications, since the secondary de | Ceramic Dual-In-Line Packages | HS1-1840BRH-8 |
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HS1-1840AEH-Q
Renesas Electronics
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1 | The HS-1840ARH, HS-1840AEH, HS-1840BRH and HS-1840BEH are radiation hardened, monolithic 16 channel multiplexers constructed with the Intersil Rad-Hard Silicon Gate, bonded wafer, Dielectric Isolation process. They are designed to provide a high input impedance to the analog source if device power fails (open), or the analog signal voltage inadvertently exceeds the supply by up to ±35V, regardless of whether the device is powered on or off. Excellent for use in redundant applications, since the secondary de | Dual-In-Line Packages | HS1-1840AEH-Q |
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1963748
Phoenix Contact
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1 | PCB header, nominal cross section: 0.5 mm?, color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 12, Number of rows: 1, Number of positions per row: 12, number of connections: 12, product range: MC 0,5/..-G-THT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.8 mm, Stecksystem: MICRO COMBICON - FK-MC 0,5, Locking: without, type of packaging: 44 mm wide tape, User information and de | Other | 1963748 |
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1707719
Phoenix Contact
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1 | PCB header, nominal cross section: 1.5 mm?, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 10, Number of rows: 1, Number of positions per row: 10, number of connections: 10, product range: MCV 1,5/..-GF-THR, pitch: 3.81 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, Stecksystem: MINI COMBICON, Locking: Screw locking, type of packaging: packed in cardboard, User information and de | Other | 1707719 |
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1707298
Phoenix Contact
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1 | PCB header, nominal cross section: 1.5 mm?, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 10, Number of rows: 1, Number of positions per row: 10, number of connections: 10, product range: MCV 1,5/..-GF-THR, pitch: 3.81 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 1.4 mm, Stecksystem: MINI COMBICON, Locking: Screw locking, type of packaging: packed in cardboard, User information and de | Other | 1707298 |
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![Part Image](["https://www.mouser.com/images/ams/images/KW_CDLMM1-TK_SPL.jpg",null,null])
![Part Image](["https://componentsearchengine.com/Thumbnails/9/RDE5C1H101J0K1H03B.jpg",null,"//content.supplyframe.com/images/process/fit-in/100x100/p/http://media.digikey.com/Photos/Murata%20Photos/RDE5C1H561J0K1H03B.jpg"])
![Part Image](["https://componentsearchengine.com/2D/0/14917873.png",null,null])
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![Part Image](["https://componentsearchengine.com/2D/0/15089590.png",null,null])
![Part Image](["https://componentsearchengine.com/Thumbnails/9/ISL3295EIHZ-T7A.jpg",null,null])
![Part Image](["https://componentsearchengine.com/Thumbnails/9/ISL3295EFHZ-T7A.jpg",null,null])
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![Part Image](["https://samacsys.com/Phoenix_Contact/mimes/products/images/28212_1000_int_04.jpg","https://samacsys.com/Phoenix_Contact/mimes/products/images/28212_1000_int_04.jpg",null])
![Part Image](["https://componentsearchengine.com/Thumbnails/1/HS1-1840ARH-Q.jpg",null,null])
![Part Image](["https://samacsys.com/Phoenix_Contact/mimes/products/images/28293_1000_int_04.jpg","https://samacsys.com/Phoenix_Contact/mimes/products/images/28293_1000_int_04.jpg",null])
![Part Image](["https://componentsearchengine.com/2D/0/18015731.png",null,null])
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![Part Image](["https://samacsys.com/Phoenix_Contact/mimes/products/images/22286_1000_int_04.jpg","https://samacsys.com/Phoenix_Contact/mimes/products/images/22286_1000_int_04.jpg",null])
![Part Image](["https://samacsys.com/Phoenix_Contact/mimes/products/images/28214_1000_int_04.jpg","https://samacsys.com/Phoenix_Contact/mimes/products/images/28214_1000_int_04.jpg",null])
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