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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	TPSMB110CA LITTELFUSE	1	ESD Protection Diodes / TVS Diodes 600W 110V AEC-Q101 5% Bi-Directional	Other	TPSMB110CA	3D model available Symbol and footprint available 3	1 Download Model
	W632GG8MB11A Winbond	1	SDRAM - DDR3 Memory IC 2Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W632GG8MB11A	3D model available Symbol and footprint available 3	1 Download Model
	TPSMB110A LITTELFUSE	1	Automotive, Surface Mount 600 W in DO-214AA, Uni-Directional	Other	TPSMB110A	3D model available Symbol and footprint available 3	1 Download Model
	W632GU6MB11W Winbond	1	2Gb DDR3 SDRAM 1866MHz VFBGA96	BGA	W632GU6MB11W	3D model available Symbol and footprint available 3	1 Download Model

	W632GG6MB11S Winbond	1	Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received wit	BGA	W632GG6MB11S	3D model available Symbol and footprint available 3	1 Download Model
	EKM-B1104112 Panasonic	1	Sensor PIR (Passive Infrared)	Other	EKM-B1104112	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8MB11W Winbond	1	VFBGA - 78	BGA	W632GU8MB11W	3D model available Symbol and footprint available 3	1 Download Model
	EKM-B1109112 Panasonic	1	Sensor Motion, Pyroelectric, PIR (Passive Infrared) 161" (4.1m) 13.5' Module 1μA	Other	EKM-B1109112	3D model available Symbol and footprint available 3	1 Download Model
	W631GU8MB11W Winbond	1	SDRAM - DDR3L Memory IC 1Gbit Parallel 800 MHz 20 ns 78-VFBGA (10.5x8)	BGA	W631GU8MB11W	3D model available Symbol and footprint available 3	1 Download Model
	W632GU8MB11A Winbond	1	BGA78	BGA	W632GU8MB11A	3D model available Symbol and footprint available 3	1 Download Model
	EKM-B1108111 Panasonic	1	Board Mount Motion & Position Sensors 1uA White Digi ST SENS Wide Area	Other	EKM-B1108111	3D model available Symbol and footprint available 3	1 Download Model
	ATSAMB11-ZR210CA Microchip	1	Bluetooth / 802.15.1 Modules with chip antenna - SmartConnect ATSAMB11 SiP Module	Other	ATSAMB11-ZR210CA	3D model available Symbol and footprint available 3	1 Download Model
	PHE840MX6330MB11R17 Yageo Group	1	Capacitor, film, 0.33 uF, +/-20% Tol, -55/+105C, Safety: X2, 275VAC,Lead Spacing=15 mm	Other	PHE840MX6330MB11R17	3D model available Symbol and footprint available 3	1 Download Model
	QMB111PC Star Micronics	1	92dB High External Magnetic Buzzer Component, 12 (Dia.) x 8.5mm, 5V ac Max	Other	QMB111PC	3D model available Symbol and footprint available 3	1 Download Model
	W632GG6MB11K Winbond	1	 Power Supply: VDD, VDDQ = 1.5V ± 0.075V Double Data Rate architecture: two data transfers per clock cycle Eight internal banks for concurrent operation 8 bit prefetch architecture CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13 and 14 Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable OnThe-Fly (OTF) Programmable read burst ordering: interleaved or nibble sequential Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received w	BGA	W632GG6MB11K	3D model available Symbol and footprint available 3	1 Download Model

	EKM-B1101113 Panasonic	1	Sensor PIR (Passive Infrared) 197" (5m) 16.4' Polyethylene, Pearl White Lens, 2.3V ~ 4V, -20°C ~ 60°C (TA)	Other	EKM-B1101113	3D model available Symbol and footprint available 3	1 Download Model
	EKMB1104111 Panasonic	1	Sensor PIR (Passive Infrared)	Other	EKMB1104111	3D model available Symbol and footprint available 3	1 Download Model
	W631GG6MB11W Winbond	1	 Refresh, Self-Refresh, Auto Self-refresh (ASR) and Partial array self refresh (PASR) Precharged Power Down and Active Power Down Data masks (DM) for write data Programmable CAS Write Latency (CWL) per operating frequency Write Latency WL = AL + CWL Multi purpose register (MPR) for readout a predefined system timing calibration bit sequence System level timing calibration support via write leveling and MPR read pattern ZQ Calibration for output driver and ODT using external reference r	BGA	W631GG6MB11W	3D model available Symbol and footprint available 3	1 Download Model
	EKM-B1110112 Panasonic	1	PIR MOTION SENSOR “PaPIRs” WL series・Flat square type (1μA / Digital output)	Other	EKM-B1110112	3D model available Symbol and footprint available 3	1 Download Model
	EKM-B1107112 Panasonic	1	Sensor PIR (Passive Infrared)	Other	EKM-B1107112	3D model available Symbol and footprint available 3	1 Download Model
	TPSMB11CA-E LITTELFUSE	1	TVS Diode, Surface Mount ? 600 W, Bi-directional, DO-214AA	Other	TPSMB11CA-E	3D model available Symbol and footprint available 3	1 Download Model
	GRM43MB11H124KA01K Murata Electronics	1	Chip Multilayer Ceramic Capacitors for General Purpose, (4532M(1812))	Other	GRM43MB11H124KA01K	3D model available Symbol and footprint available 3	1 Download Model
	TPSMB110CA-E LITTELFUSE	1	TVS Diode, Surface Mount ? 600 W, Bi-directional, DO-214AA	Other	TPSMB110CA-E	3D model available Symbol and footprint available 3	1 Download Model
	EKMB1103111 Panasonic	1	EKMB1103111 Panasonic, EKMB1 Pyroelectric Infrared Sensor, 12m 2.3 V to 4 V 3-Pin TO-5	Other	EKMB1103111	3D model available Symbol and footprint available 3	1 Download Model
	EKMB1110111 Panasonic	1	PIR MOTION SENSOR “PaPIRs” WL series・Flat square type (1μA / Digital output)	Other	EKMB1110111	3D model available Symbol and footprint available 3	1 Download Model
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