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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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505274-0612
Molex
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1 | SlimStack Board-to-Board Connector, 0.35mm Pitch, SSB RP Series, Plug, 0.80 or 0.90mm Mated Height, 2.00mm Mated Width, Circuits, Armor Nail | Other | 505274-0612 |
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70553-0018
Molex
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1 | CGRID SL SRD HDR 120 RA SR 15 U 19CKT | Header, Shrouded - Right Angle PTH Box | 70553-0018 |
3
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505066-1422
Molex
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1 | SlimStack Board-to-Board Connector, 0.35mm Pitch, SSB RP Series, Receptacle, 0.60mm Mated Height, 2.00mm Mated Width, Circuits, Armor Nail | Other | 505066-1422 |
3
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04025U150GAT2A
Kyocera AVX
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1 | AVX 0402 U 15pF Ceramic Multilayer Capacitor, 50 V dc, +125°C, C0G Dielectric, ±2% SMD | Capacitor Chip Non-polarised | 04025U150GAT2A |
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06032U8R2CAT2A
Kyocera AVX
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1 | AVX 0603 U 8.2pF Ceramic Multilayer Capacitor, 200 V dc, +125°C, C0G Dielectric, ±0.25pF SMD | Capacitor Chip Non-polarised | 06032U8R2CAT2A |
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06032U1R2BAT2A
Kyocera AVX
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1 | AVX 0603 U 1.2pF Ceramic Multilayer Capacitor, 200 V dc, +125°C, C0G Dielectric, ±0.1pF SMD | Capacitor Chip Non-polarised | 06032U1R2BAT2A |
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04025U1R5BAT2A
Kyocera AVX
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1 | AVX 0402 U 1.5pF Ceramic Multilayer Capacitor, 50 V dc, +125°C, C0G Dielectric, ±0.1pF SMD | Capacitor Chip Non-polarised | 04025U1R5BAT2A |
3
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505274-3012
Molex
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1 | SlimStack Board-to-Board Connector, 0.35mm Pitch, SSB RP Series, Plug, 0.80 or 0.90mm Mated Height, 2.00mm Mated Width, Circuits, Armor Nail | Other | 505274-3012 |
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5050665422
Molex
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1 | SlimStack Board-to-Board Connector, 0.35mm Pitch, SSB RP Series, Receptacle, 0.60mm Mated Height, 2.00mm Mated Width, Circuits, Armor Nail,,, | Other | 5050665422 |
3
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251012
LITTELFUSE
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1 | Fuses with Leads - Through Hole - U 576-0251012.MRT1L | Other | 251012 |
2
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ATSAML21J18B-AUT
Microchip
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1 | MICROCHIP - ATSAML21J18B-AUT. - Cortex-MO+,256KBFLASH, 32 KBSRAM, USB, U | Quad Flat Packages | ATSAML21J18B-AUT |
3
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505070-0642
Molex
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1 | SlimStack Board-to-Board Connector, 0.35mm Pitch, SSB RP Series, Plug, 0.60 or 0.70mm Mated Height, 2.00mm Mated Width, Circuits, Armor Nail, 0.15mm Fitting Nail Width | Other | 505070-0642 |
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505070-5422
Molex
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1 | SlimStack Board-to-Board Plug, 0.35mm Pitch, SSB RP Series, 0.60 or 0.70mm Mated Height, 2.00mm Mated Width, 54 Circuits, Armor Nail, 0.15mm Fitting Nail Width | Other | 505070-5422 |
3
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ACASA1003U1003P1AT
Vishay
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1 | Resistor Networks & Arrays ACAS 0612 100K U 100K AT P1 | Other | ACASA1003U1003P1AT |
3
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505274-3040
Molex
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1 | SlimStack Board-to-Board Connector, 0.35mm Pitch, SSB RP Series, Plug, 0.80 or 0.90mm Mated Height, 2.00mm Mated Width, Circuits, Armor Nail | Other | 505274-3040 |
3
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2-178298-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 1 | Number of Positions 10 | PCB Mount Orientation Horizontal | Contact Features: Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 8 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Housing Features: Centerline (Pitch) .15 INCH | Housing Material Polyester GF | Centerline (Pitch) 3.81 MM | Industry Standards: U | Other | 2-178298-3 |
3
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1750203
Phoenix Contact
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1 | PCB header, nominal cross section: 1.5 mm?, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 24, Number of rows: 2, Number of positions per row: 12, number of connections: 24, product range: MCDNV 1,5/..-G1-THR, pitch: 3.81 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 1.4 mm, Stecksystem: MINI COMBICON, Locking: without, type of packaging: packed in cardboard, The pin length is 1.4 mm. U | Other | 1750203 |
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1750274
Phoenix Contact
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1 | PCB header, nominal cross section: 1.5 mm?, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 38, Number of rows: 2, Number of positions per row: 19, number of connections: 38, product range: MCDNV 1,5/..-G1-THR, pitch: 3.81 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 1.4 mm, Stecksystem: MINI COMBICON, Locking: without, type of packaging: packed in cardboard, The pin length is 1.4 mm. U | Other | 1750274 |
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178216-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Positions 12 | PCB Mount Orientation Horizontal | Number of Rows 4 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 8 AMP | Housing Features: Centerline (Pitch) .15 INCH | Centerline (Pitch) 3.81 MM | Housing Material Polyester GF | Industry Standards: U | Other | 178216-2 |
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8-353082-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 3 | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 30 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Housing Features: Centerline (Pitch) .399 INCH | Centerline (Pitch) 10.16 MM | Housing Material Polyester GF | Industry Standards: U | Other | 8-353082-2 |
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5749230-1
TE Connectivity
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1 | Body Features: Shield Plating Finish Bright | Shield Material Copper Alloy | Panel Ground Feature Type None | Shield Plating Material Tin over Nickel | Primary Product Color Black | Configuration Features: Connector Contact Load Condition Fully Loaded | Number of Positions 4 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 170 MICIN | Contact Underplating Material Thickness 50 MICIN | Contact U | Other | 5749230-1 |
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1821326
Phoenix Contact
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1 | PCB header, nominal cross section: 0.5 mm?, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Gold, type of contact: Male connector, Number of potentials: 10, Number of rows: 1, Number of positions per row: 10, number of connections: 10, product range: MC 0,5/..-G-THR, pitch: 2.54 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, Stecksystem: MICRO COMBICON - FMC 0,5, Locking: without, type of packaging: 44 mm wide tape, Sample values available u | Other | 1821326 |
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1821371
Phoenix Contact
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1 | PCB header, nominal cross section: 0.5 mm?, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Gold, type of contact: Male connector, Number of potentials: 15, Number of rows: 1, Number of positions per row: 15, number of connections: 15, product range: MC 0,5/..-G-THR, pitch: 2.54 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, Stecksystem: MICRO COMBICON - FMC 0,5, Locking: without, type of packaging: 56 mm wide tape, Sample values available u | Other | 1821371 |
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LHUV-0415-A070
Lumileds
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1 | High Power LEDs - Single Color UV/NUV 415nm - 420nm LUXEON UV U Line | Other | LHUV-0415-A070 |
3
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08052U9R1CAT2A
Kyocera AVX
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1 | AVX 0805 U 9.1pF Ceramic Multilayer Capacitor, 200 V dc, +125°C, C0G Dielectric, ±0.25pF SMD | Capacitor Chip Non-polarised | 08052U9R1CAT2A |
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