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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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10131318-12422G0LF
Amphenol Communications Solutions
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1 | Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 30μin Gold plating, Black Color, 12 Positions, LCP, GW Compatible, Tray Packing. | Other | 10131318-12422G0LF |
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3314G-2-201E
Bourns
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1 | 200 Ohms 0.25W, 1/4W Gull Wing Surface Mount Trimmer Potentiometer Cermet 1.0 Turn Top Adjustment TRIMMER 200 OHM 0.25W GW TOP ADJ | Other | 3314G-2-201E |
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GW QSSPA1.WB-LUMU-MMMW-1
ams OSRAM
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1 | OSRAM OPTO SEMICONDUCTORS - GW QSSPA1.WB-LUMU-MMMW-1 - High Brightness LED, OSCONIQ P 3030 Series, Mint, 130 °, 180 lm, 1.3 A | Other | GW QSSPA1.WB-LUMU-MMMW-1 |
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10146997-08200LF
Amphenol Communications Solutions
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1 | Minitek®Pwr 5.7, Right Angle Through Hole Header, Dual Row, Black Color, 8 Positions, 100μin Tin overall plating, LCP, GW Compatible, Tray packing. | Other | 10146997-08200LF |
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GW CSSRM3.CM-M9N4-A232-1-700-R33
ams OSRAM
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1 | AMS OSRAM GROUP - GW CSSRM3.CM-M9N4-A232-1-700-R33 - High Brightness LED, OSLON Square Series, Cool White, 120 °, 320 lm, 5700 K, 1.8 A | Other | GW CSSRM3.CM-M9N4-A232-1-700-R33 |
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PVG3G224C01R00
Bourns
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1 | TRIMMER 220K OHM 0.25W GW TOP 220 kOhms 0.25W, 1/4W Gull Wing Surface Mount Trimmer Potentiometer Cermet 1.0 Turn Top Adjustment | Other | PVG3G224C01R00 |
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10144754-2451LF
Amphenol
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1 | Minitek® Pwr 3.0 BMI, Dual Row, Right Angle Through Hole Header, 30μin Gold plating, 4 Positions, Black Color, LCP, GW Compatible, Tray packing. | Other | 10144754-2451LF |
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10132449-0821GLF
Amphenol
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1 | Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, 80μin Min Matte Tin plating, Black Color, 8 Positions, GW Compatible PA9T, Tray packing. | Other | 10132449-0821GLF |
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10144754-1021LF
Amphenol Communications Solutions
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1 | Minitek® Pwr 3.0 BMI, Dual Row, Right Angle Through Hole Header, Gold Flash plating, 10 Positions, Black Color, LCP, GW Compatible, Tray packing. | Other | 10144754-1021LF |
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GW CSSRM2.PM-N1N3-XX57-1
ams OSRAM
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1 | OSLON Square White LED SMD 72CRI 3000K Osram Opto GW CSSRM2.PM-N1N3-XX57-1, OSLON Square Series White LED, 3000K, 3-Pin SMT, Dome Lens SMD package | Other | GW CSSRM2.PM-N1N3-XX57-1 |
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10144754-2021LF
Amphenol Communications Solutions
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1 | Minitek® Pwr 3.0 BMI, Dual Row, Right Angle Through Hole Header, Gold Flash plating, 20 Positions, Black Color, LCP, GW Compatible, Tray packing. | Other | 10144754-2021LF |
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10146997-10201LF
Amphenol Communications Solutions
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1 | Minitek®Pwr 5.7, Right Angle Through Hole Header, Dual Row, Black Color, 10 Positions, 100μin Tin overall plating, LCP, GW Compatible, Tape and Reel. | Other | 10146997-10201LF |
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GW QTLQS1.LM-LWL2-XX55-1-65-R18
ams OSRAM
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1 | AMS OSRAM GROUP - GW QTLQS1.LM-LWL2-XX55-1-65-R18 - High Brightness LED, OSCONIQ E 2835, White, 120 °, 144 lm, 4000 K, 200 mA | Other | GW QTLQS1.LM-LWL2-XX55-1-65-R18 |
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10142708-100001LF
Amphenol Communications Solutions
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1 | Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 10 Positions, 30μin Gold (100μin Tin on Tails) plating, GW Compatible LCP, Without Pegs, Tray. | Other | 10142708-100001LF |
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EL5203IYZ
Renesas Electronics
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1 | The EL5202 and EL5203 are dual, high-speed VFAs based on a CFA architecture. This gives the typical high slew rate benefits of a CFA family along with the stability and ease of use associated with the VFA type architecture. With slew rates of 3500V/µs, these devices enable the use of voltage feedback amplifiers in a space where the only alternative has been current feedback amplifiers. This family also includes single, dual, and triple versions with 750MHz bandwidths; please see the EL5104 through EL5304 da | Small Outline Packages | EL5203IYZ |
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10160920-1241100LF
Amphenol Communications Solutions
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1 | Minitek Pwr CEM-5 PCIe Connector System, Right Angle Through Hole Hybrid Header (12Power + 4 Signal), 100μin Matte Tin Plating, 2.2mm Tail Length, GW Compatible LCP, Black Color, Tray Packing. | Other | 10160920-1241100LF |
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10131319-10422G0LF
Amphenol Communications Solutions
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1 | Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 30μin Gold on Contact area (100μin Matte Tin on Tails) plating, Black Color, 10 Positions, LCP, GW Compatible, Tray Packing. | Other | 10131319-10422G0LF |
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1969795-1
TE Connectivity
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1 | Configuration Features: Number of Positions 2 | Number of Power Positions 2 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Pre-Tin | Contact Retention Within Housing Without | Contact Type Socket | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Housing Features: Housing C | Header, Shrouded - Straight PTH Box | 1969795-1 |
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1586892-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 3 | Number of Power Positions 3 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 150 – 200 MICIN | PCB Contact Termination Area Plating Material Pre-Tin | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Current Rating (Max | Other | 1586892-3 |
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1586893-3
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 3 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Type Socket | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Retention Within Housing Without | Electrical Characteristics: | Other | 1586893-3 |
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1969803-1
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | Number of Rows 1 | Number of Power Positions 3 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Pre-Tin | Housin | Other | 1969803-1 |
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1969808-1
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 5 | Number of Power Positions 5 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Electrical Characteristics: Ope | Other | 1969808-1 |
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1969815-1
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | PCB Mount Orientation Right Angle | Number of Power Positions 8 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Electrical Characteristics: Ope | Other | 1969815-1 |
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1969805-1
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Right Angle | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Pre-Tin | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Electrical Characteristics: | Other | 1969805-1 |
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1969799-1
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Housing Features: Housing Colo | Other | 1969799-1 |
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