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	R5F212ACSDFA#V2 Renesas Electronics	1	The R8C/2A Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat	Quad Flat Packages	R5F212ACSDFA#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F212BCSNFA#X6 Renesas Electronics	1	The R8C/2B Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/2A Group and R8C/2B Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp	Quad Flat Packages	R5F212BCSNFA#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21324CNSP#54 Renesas Electronics	1	The R8C/32C Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Small Outline Packages	R5F21324CNSP#54	3D model available Symbol and footprint available 3	1 Download Model
	R5F212H2SNSP#U0 Renesas Electronics	1	The R8C/2H Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/2G Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating m	Small Outline Packages	R5F212H2SNSP#U0	3D model available Symbol and footprint available 3	1 Download Model

	R5F2138CMNFP#V0 Renesas Electronics	1	The R8C/38M Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/38M Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Quad Flat Packages	R5F2138CMNFP#V0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21292SNSP#U0 Renesas Electronics	1	The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat	Small Outline Packages	R5F21292SNSP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21334CDFP#50 Renesas Electronics	1	The R8C/33C Group is supported only for customers who have already adopted these products.The R8C/33C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed	Quad Flat Packages	R5F21334CDFP#50	3D model available Symbol and footprint available 3	1 Download Model
	R5F21368SNFP#50 Renesas Electronics	1	The R8C/36T-A Group is supported only for customers who have already adopted these products. The RX130 Group is recommended for new designs.The R8C/36T-A Group of single-chip microcontrollers (MCUs) incorporates the R8C CPU core, which provides sophisticated instructions for a high level of efficiency. With 1Mb of address space, the CPU core is capable of executing instructions at high speed. In addition, it features a multiplier for high-speed arithmetic processing.Power consumption is low, and additional	Quad Flat Packages	R5F21368SNFP#50	3D model available Symbol and footprint available 3	1 Download Model
	R5F21336CNFP#30 Renesas Electronics	1	The R8C/33C Group is supported only for customers who have already adopted these products.The R8C/33C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed	Quad Flat Packages	R5F21336CNFP#30	3D model available Symbol and footprint available 3	1 Download Model
	R5F21367CDFP#V0 Renesas Electronics	1	The R8C/36C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/36C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Quad Flat Packages	R5F21367CDFP#V0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21292SDSP#U0 Renesas Electronics	1	The R8C/29 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat	Small Outline Packages	R5F21292SDSP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21324DNSP#W4 Renesas Electronics	1	The R8C/32D Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow	Small Outline Packages	R5F21324DNSP#W4	3D model available Symbol and footprint available 3	1 Download Model
	R5F21357CDFP#V0 Renesas Electronics	1	The R8C/35C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/35C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Quad Flat Packages	R5F21357CDFP#V0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21266KFP#U0 Renesas Electronics	1	The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21266KFP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F212K4SNFP#V2 Renesas Electronics	1	The R8C/2K Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/2H Group and R8C/2J Group of single-chip MCUs incorporate the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the suppo	Quad Flat Packages	R5F212K4SNFP#V2	3D model available Symbol and footprint available 3	1 Download Model

	R5F21357MNFP#30 Renesas Electronics	1	The R8C/35M Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/35M Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Quad Flat Packages	R5F21357MNFP#30	3D model available Symbol and footprint available 3	1 Download Model
	R5F21334CNFP#V2 Renesas Electronics	1	The R8C/33C Group is supported only for customers who have already adopted these products.The R8C/33C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed	Quad Flat Packages	R5F21334CNFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F21284SNSP#U0 Renesas Electronics	1	The R8C/28 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Small Outline Packages	R5F21284SNSP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21272SDFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21272SDFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F212BASDFP#V2 Renesas Electronics	1	The R8C/2B Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/2A Group and R8C/2B Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp	Quad Flat Packages	R5F212BASDFP#V2	3D model available Symbol and footprint available 3	1 Download Model
	R5F21368CDFA#V0 Renesas Electronics	1	The R8C/36C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/36C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Quad Flat Packages	R5F21368CDFA#V0	3D model available Symbol and footprint available 3	1 Download Model
	R5F211A2SP#U0 Renesas Electronics	1	The R8C/1A Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high sp	Small Outline Packages	R5F211A2SP#U0	3D model available Symbol and footprint available 3	1 Download Model
	R5F213M8UNNP#W0 Renesas Electronics	1	The R8C/3MU, R8C/3MK Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency.The R8C/3MQ Group single-chip MCU functions as a low-power-consumption transceiver which supports 2. 4 GHz compliant to IEEE802. 15. 4 standard and incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts	Quad Flat No-Lead	R5F213M8UNNP#W0	3D model available Symbol and footprint available 3	1 Download Model
	R5F21346UDFP#V0 Renesas Electronics	1	The R8C/34U Group is supported only for the customers who have already adopted these products. For new adoption, please consider other products such as RL78/G1C, RL78/L1C Group.The R8C/34P Group, R8C/34R Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumpt	Quad Flat Packages	R5F21346UDFP#V0	3D model available Symbol and footprint available 3	1 Download Model
	R5F213G2CNSP#W4 Renesas Electronics	1	The R8C/3GC Group is supported only for customers who have already adopted these products. The RL78/G1F, RL78/G13 Groups are recommended for new designs.The R8C/3GC Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Small Outline Packages	R5F213G2CNSP#W4	3D model available Symbol and footprint available 3	1 Download Model
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