144-5 Model Download Search Results
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TMS-144-56-G-S
SAMTEC
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1 | 44 Position, Single-Row .050" x .100" Micro Terminal Strip | Other | TMS-144-56-G-S |
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TMS-144-55-S-S
SAMTEC
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1 | 44 Position, Single-Row .050" x .100" Micro Terminal Strip | Other | TMS-144-55-S-S |
2
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TMS-144-55-SM-S
SAMTEC
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1 | 44 Position, Single-Row .050" x .100" Micro Terminal Strip | Other | TMS-144-55-SM-S |
2
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TMS-144-59-T-S
SAMTEC
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1 | 44 Position, Single-Row .050" x .100" Micro Terminal Strip | Other | TMS-144-59-T-S |
2
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2-1445050-7
TE Connectivity
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1 | MICRO MNL HDR ASSY S/ROW LF | Other | 2-1445050-7 |
3
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2-1445055-6
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 6 | Number of Positions 6 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact M | Other | 2-1445055-6 |
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1445055-3
TE Connectivity
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1 | CONN HEADER R/A 3POS 3MM | Other | 1445055-3 |
3
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ADAU1445YSVZ-3A-RL
Analog Devices
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1 | Digital Audio Processor | Other | ADAU1445YSVZ-3A-RL |
2
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ADAU1445YSVZ-3A
Analog Devices
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1 | Digital Audio Processor | Quad Flat Packages | ADAU1445YSVZ-3A |
3
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3-1445056-0
TE Connectivity
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1 | Pin & Socket Connectors | Other | 3-1445056-0 |
3
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1445088-2
TE Connectivity
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1 | CONN HEADER R/A 2POS 3MM | Other | 1445088-2 |
3
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1 | NXP - LPC4088FBD144,551 - MCU, 32BIT, CORTEX-M4, 120MHZ, LQFP-144 | Quad Flat Packages | LPC4088FBD144,551 |
3
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EPM7256AETC144-5N
Intel
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1 | CPLD MAX® 7000A Family 5K Gates 256 Macro Cells 172.4MHz 3.3V 144-Pin TQFP Tray | Quad Flat Packages | EPM7256AETC144-5N |
3
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X5649S14-4.5A
Renesas Electronics
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1 | Supervisory Circuits | Small Outline Packages | X5649S14-4.5A |
3
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LTC1445CDHD#PBF
Analog Devices
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1 | IC COMP QD LP 1.221VREF 16-DFN | Small Outline No-lead | LTC1445CDHD#PBF |
3
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10144518-104802LF
Amphenol
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1 | BergStak® Lite 0.80mm, Board-to-Board Connector, 100 Positions, Dual Row, Vertical Header. | Other | 10144518-104802LF |
2
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TX1-ZB1445-CED
COILCRAFT
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1 | 12 V,15 V,7.5 Wt1000 kHz Isolation Transformers | Other | TX1-ZB1445-CED |
2
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3-1445097-2
TE Connectivity
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1 | MICRO MNL HDR ASSY S/ROW AU LF | Other | 3-1445097-2 |
3
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1445088-6
TE Connectivity
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1 | CONN HEADER R/A 6POS 3MM | Other | 1445088-6 |
3
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SFT1445-TL-H
onsemi
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1 | N-channel MOSFET?%0 | Other | SFT1445-TL-H |
2
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2-1445093-3
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 3 | PCB Mount Orientation Vertical | Number of Power Positions 3 | Contact Features: Contact Mating Area Plating Material Gold | Contact Retention Within Housing Without | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | Contact | Other | 2-1445093-3 |
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3-1445057-0
TE Connectivity
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1 | Configuration Features: Number of Positions 10 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 10 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2 MICM | PCB Contact Termination Area Plating Material Thickness 78.74 MICIN | Contact Underplating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Conta | Other | 3-1445057-0 |
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ADUM1445ARSZ
Analog Devices
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1 | Digital Isolators Micro-power Quad-CH Digital Isolator | Small Outline Packages | ADUM1445ARSZ |
3
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2-1445096-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 4 | Number of Power Positions 4 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Retention Within Housing Without | Contact | Other | 2-1445096-4 |
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2-1445052-6
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 6 | Number of Positions 6 | Number of Rows 1 | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact | Other | 2-1445052-6 |
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![Part Image](["https://samtec-cdn.azureedge.net/kineticimages/images/product/series/tms_thumb.png","https://samtec-cdn.azureedge.net/kineticimages/images/product/series/tms_thumb.png",null])
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![Part Image](["https://componentsearchengine.com/Thumbnails/9/ADAU1445YSVZ-3A.jpg",null,"//content.supplyframe.com/images/process/fit-in/100x100/p/qfp_100.jpg"])
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![Part Image](["https://componentsearchengine.com/2D/0T/13331415.1.1.png",null,"//content.supplyframe.com/images/process/fit-in/100x100/p/qfp_144.jpg"])
![Part Image](["https://componentsearchengine.com/2D/0T/12080471.1.1.png",null,null])
![Part Image](["https://componentsearchengine.com/Thumbnails/9/LTC1445CDHD#PBF.jpg",null,null])
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