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1376020-1
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Horizontal | Number of Rows 2 | Number of Positions 12 | Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | Housing Features: Centerline (Pitch) .099 INCH | Centerline (Pitch) 2.5 MM | Housing Material Polyester GF | Industry Standards: U | Other | 1376020-1 |
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1750258
Phoenix Contact
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1 | PCB header, nominal cross section: 1.5 mm?, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 34, Number of rows: 2, Number of positions per row: 17, number of connections: 34, product range: MCDNV 1,5/..-G1-THR, pitch: 3.81 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 1.4 mm, Stecksystem: MINI COMBICON, Locking: without, type of packaging: packed in cardboard, The pin length is 1.4 mm. U | Other | 1750258 |
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R5F523T5AGFL#30
Renesas Electronics
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1 | The RX23T Group is a 32-bit microcontroller suited for single inverter control and has a built-in floating-point processing unit (FPU) that enables users to easily program complex inverter control algorithms. This helps to greatly reduce the man-hours required for software development and maintenance. Furthermore, thanks to the RX200 core, the current consumed in software standby mode (with RAM retention) is a mere 0.45μA. RX23T microcontrollers operate in a broad voltage range from 2.7V to 5.5V, which is u | Quad Flat Packages | R5F523T5AGFL#30 |
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R5F523T5ADFD#30
Renesas Electronics
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1 | The RX23T Group is a 32-bit microcontroller suited for single inverter control and has a built-in floating-point processing unit (FPU) that enables users to easily program complex inverter control algorithms. This helps to greatly reduce the man-hours required for software development and maintenance. Furthermore, thanks to the RX200 core, the current consumed in software standby mode (with RAM retention) is a mere 0.45μA. RX23T microcontrollers operate in a broad voltage range from 2.7V to 5.5V, which is u | Quad Flat Packages | R5F523T5ADFD#30 |
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178216-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Horizontal | Number of Positions 12 | Number of Rows 4 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 8 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Housing Features: Centerline (Pitch) 3.81 MM | Centerline (Pitch) .15 INCH | Housing Material Polyester GF | Industry Standards: U | Other | 178216-3 |
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1821355
Phoenix Contact
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1 | PCB header, nominal cross section: 0.5 mm?, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Gold, type of contact: Male connector, Number of potentials: 13, Number of rows: 1, Number of positions per row: 13, number of connections: 13, product range: MC 0,5/..-G-THR, pitch: 2.54 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, Stecksystem: MICRO COMBICON - FMC 0,5, Locking: without, type of packaging: 56 mm wide tape, Sample values available u | Other | 1821355 |
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2-178298-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 1 | Number of Positions 10 | PCB Mount Orientation Horizontal | Contact Features: Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 8 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Housing Features: Centerline (Pitch) .15 INCH | Housing Material Polyester GF | Centerline (Pitch) 3.81 MM | Industry Standards: U | Other | 2-178298-3 |
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2-179960-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Positions 6 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Contact Current Rating (Max) 30 AMP | Contact Type Pin | Housing Features: Centerline (Pitch) 10.16 MM | Centerline (Pitch) .399 INCH | Housing Material Polyester GF | Industry Standards: U | Other | 2-179960-2 |
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2-179960-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Positions 6 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Contact Current Rating (Max) 30 AMP | Contact Type Pin | Housing Features: Centerline (Pitch) 10.16 MM | Centerline (Pitch) .399 INCH | Housing Material Polyester GF | Industry Standards: U | Other | 2-179960-2 |
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1821368
Phoenix Contact
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1 | PCB header, nominal cross section: 0.5 mm?, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Gold, type of contact: Male connector, Number of potentials: 14, Number of rows: 1, Number of positions per row: 14, number of connections: 14, product range: MC 0,5/..-G-THR, pitch: 2.54 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, Stecksystem: MICRO COMBICON - FMC 0,5, Locking: without, type of packaging: 56 mm wide tape, Sample values available u | Other | 1821368 |
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8-353082-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 3 | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 30 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Housing Features: Centerline (Pitch) .399 INCH | Centerline (Pitch) 10.16 MM | Housing Material Polyester GF | Industry Standards: U | Other | 8-353082-2 |
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1750180
Phoenix Contact
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1 | PCB header, nominal cross section: 1.5 mm?, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, type of contact: Male connector, Number of potentials: 20, Number of rows: 2, Number of positions per row: 10, number of connections: 20, product range: MCDNV 1,5/..-G1-THR, pitch: 3.81 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 1.4 mm, Stecksystem: MINI COMBICON, Locking: without, type of packaging: packed in cardboard, The pin length is 1.4 mm. U | Other | 1750180 |
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2-1123309-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Horizontal | Number of Positions 4 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 45 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Housing Features: Housing Material Polyester GF | Centerline (Pitch) 10.16 MM | Centerline (Pitch) .4 INCH | Industry Standards: U | Other | 2-1123309-2 |
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TW6865-TA1-CR
Renesas Electronics
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1 | The TW6865 is a highly integrated solution that supports multi-channel video and audio capture via PCIe x1 interface for PC DVR system and video analytic application. It contains high quality four-channel NTSC/PAL/SECAM video decoders that convert analog composite video signal to digital component YCbCr data and utilize adaptive 4H comb filter for separating luminance and chrominance to reduce cross noise artifacts. The TW6865 contains a high performance proprietary DMA controller that fully optimizes the u | Quad Flat Packages | TW6865-TA1-CR |
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4-6450540-8
TE Connectivity
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1 | Configuration Features: Number of Rows 4 | Number of Signal Positions 16 | Number of Power Positions 2 | Number of Positions 18 | PCB Mount Orientation Vertical | Contact Features: Power Contact Base Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Type Receptacle | Contact Current Rating (Max) 42 AMP | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Retention Within Housing Without | Contact U | Other | 4-6450540-8 |
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4-6450540-8
TE Connectivity
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1 | Configuration Features: Number of Rows 4 | Number of Signal Positions 16 | Number of Power Positions 2 | Number of Positions 18 | PCB Mount Orientation Vertical | Contact Features: Power Contact Base Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Type Receptacle | Contact Current Rating (Max) 42 AMP | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Retention Within Housing Without | Contact U | Other | 4-6450540-8 |
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338068-8
TE Connectivity
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1 | Body Features: Primary Product Color Red | Connector Profile Standard | Daisy Chain Without | Configuration Features: Number of Rows 2 | Number of Positions 8 | PCB Mount Orientation Vertical | Contact Features: Contact Shape & Form Dual Beam | Contact Mating Area Plating Material Thickness 3 – 5 MICM | Contact Mating Area Plating Material Thickness 118.11 – 196.85 MICIN | PCB Contact Termination Area Plating Material Thickness 3 – 5 MICM | PCB Contact Termination Area Plating Material Tin | Contact U | Other | 338068-8 |
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338068-8
TE Connectivity
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1 | Body Features: Primary Product Color Red | Connector Profile Standard | Daisy Chain Without | Configuration Features: Number of Rows 2 | Number of Positions 8 | PCB Mount Orientation Vertical | Contact Features: Contact Shape & Form Dual Beam | Contact Mating Area Plating Material Thickness 3 – 5 MICM | Contact Mating Area Plating Material Thickness 118.11 – 196.85 MICIN | PCB Contact Termination Area Plating Material Thickness 3 – 5 MICM | PCB Contact Termination Area Plating Material Tin | Contact U | Other | 338068-8 |
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CEN-U05NTIN/LEAD
Central Semiconductor Corp
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1 | Power Bipolar Transistor, | CEN-U05NTIN/LEAD |
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CEN-U55N
Central Semiconductor Corp
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1 | Power Bipolar Transistor, 2A I(C), 60V V(BR)CEO, 1-Element, PNP, Silicon, Plastic/Epoxy, 3 Pin, TO-202-2, 3 PIN | CEN-U55N |
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CEN-U06TIN/LEAD
Central Semiconductor Corp
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1 | Power Bipolar Transistor, | CEN-U06TIN/LEAD |
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CEN-U56TIN/LEAD
Central Semiconductor Corp
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1 | Power Bipolar Transistor, | CEN-U56TIN/LEAD |
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CEN-U57PBFREE
Central Semiconductor Corp
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1 | Power Bipolar Transistor, | CEN-U57PBFREE |
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CEN-U51
Central Semiconductor Corp
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1 | Transistor | CEN-U51 |
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CEN-U10
Central Semiconductor
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1 | Power Bipolar Transistor, 0.5A I(C), 300V V(BR)CEO, 1-Element, NPN, Silicon, TO-202, Plastic/Epoxy, 3 Pin, TO-202, 3 PIN | CEN-U10 |
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