12.17 Model Download Search Results
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ADS1217IPFBTG4
Texas Instruments
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1 | Analog to Digital Converters - ADC 8-Ch 24-Bit ADC | Quad Flat Packages | ADS1217IPFBTG4 |
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1217136-2
TE Connectivity
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1 | 0.250" (6.35mm) Quick-connect plug, solder joint, non-insulated | Other | 1217136-2 |
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C0603C104J4RAC31217111
Yageo Group
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1 | .100UF 16.0V | Capacitor Chip Non-polarised | C0603C104J4RAC31217111 |
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C0402C223K5RAC31217042
Yageo Group
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1 | .022UF 50.0V | Capacitor Chip Non-polarised | C0402C223K5RAC31217042 |
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LT1217CS8#PBF
Analog Devices
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1 | IC OPAMP CFA 1 CIRCUIT 8SO | Small Outline Packages | LT1217CS8#PBF |
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C0402C104J4RAC31217665
Yageo Group
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1 | .100UF 16.0V | Capacitor Chip Non-polarised | C0402C104J4RAC31217665 |
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1-2176072-2
TE Connectivity
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1 | Thin Film Resistors - SMD CPF 0201 64R9 0.5% 25PPM | Resistor Chip | 1-2176072-2 |
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C0603C101K5GAC31217665
Yageo Group
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1 | 100.PF 50.0V | Capacitor Chip Non-polarised | C0603C101K5GAC31217665 |
3
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C0603C101J5GAC31217111
Yageo Group
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1 | 100.PF 50.0V | Capacitor Chip Non-polarised | C0603C101J5GAC31217111 |
3
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MLX91217LVA-ACA-003-SP
Melexis
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1 | Board Mount Current Sensors Gen2.5 HiSpeed Conv.Hall Prog.Curr.Sens Ana 9mV/mT | Other | MLX91217LVA-ACA-003-SP |
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C0402C120J5GAC31217665
Yageo Group
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1 | 12.0PF 50.0V | Other | C0402C120J5GAC31217665 |
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C0402C103K5RAC31217042
Yageo Group
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1 | Cap Ceramic 0.01uF 50V X7R 10% Pad SMD 0402 125°C | Capacitor Chip Non-polarised | C0402C103K5RAC31217042 |
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1-2176633-9
TE Connectivity
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1 | Power Resistor, Wire Wound, 10 W, 5.6 Ω, 5 %, ±300 ppm/°C, Radial-Leaded, Steel Termination, 30 x 20 x 10 mm, Loose Piece - Box, 2 Termination, CGS SQ | Other | 1-2176633-9 |
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1-2176633-0
TE Connectivity
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1 | 2.4 Ω, Wire Wound, Power Resistor, 5 %, 30 x 20 x 10 mm, 2 Termination, Loose Piece - Box, 10 W, ±300 ppm/°C, Steel Termination, Radial-Leaded, CGS SQ | Other | 1-2176633-0 |
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SL1111217S
Fischer Elektronik GmbH & Co. KG
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1 | male header | Other | SL1111217S |
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1-2176615-3
TE Connectivity
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1 | .33 Ω, Wire Wound, Power Resistor, 5 %, 2 Termination, Taped & Reeled, 1 W, ±200 ppm/°C, Solder, Height .14 in [3.55 mm], CGS SMQ | Other | 1-2176615-3 |
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1719771217
Molex
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1 | 2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Surface Mount, with Pegs, 0.75µm Selective Gold (Au) Plating, 17 Circuits, Tape and Reel | Other | 1719771217 |
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430451217
Molex
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1 | Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Dual Row, 12 Circuits, with PCB Press-fit Metal Retention Clip, Glow-Wire Capable, Black, Tape and Reel | Other | 430451217 |
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R5F1217AGNA#40
Renesas Electronics
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1 | The RL78/G16 microcontroller is a general-purpose microcontroller with capacitive touch channels and a 16 MHz operating frequency. There is a broad lineup of touch microcontrollers available, including Renesas' smallest 10-pin package. It is also equipped with functional safety-compliant hardware to support the acquisition of IEC/UL60730 certification, the safety standard for home appliances. In addition, it has a high precision (±1.0%) high-speed on-chip oscillator, data flash, a rich serial interface, and | Quad Flat No-Lead | R5F1217AGNA#40 |
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1-2176641-0
TE Connectivity
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1 | 10 µH Power Inductor, 1700 mA, .13 Ω DC Resistance, 10 %, Length .224 in [5.7 mm], Width 5 mm [.196 in], Height .185 in [4.7 mm], Sigma 3627 | Other | 1-2176641-0 |
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TSW-112-17-SM-S
SAMTEC
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1 | 12 Position, Single Row, Classic PCB Header Strips, 0.100" pitch | Other | TSW-112-17-SM-S |
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1-2176641-8
TE Connectivity
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1 | 100 µH Power Inductor, 560 mA, 1.204 Ω DC Resistance, 10 %, Length .224 in [5.7 mm], Width 5 mm [.196 in], Height .185 in [4.7 mm], Sigma 3627 | Other | 1-2176641-8 |
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1-2176640-8
TE Connectivity
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1 | 1000 µH Power Inductor, 50 mA, 25 Ω DC Resistance, 10 %, Length .177 in [4.5 mm], Width 3.2 mm [.125 in], Height .102 in [2.6 mm], Sigma 3627 | Other | 1-2176640-8 |
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1-2176616-2
TE Connectivity
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1 | .3 Ω, Wire Wound, Power Resistor, 5 %, 2 Termination, Taped & Reeled, 2 W, ±200 ppm/°C, Solder, Height .197 in [5 mm], CGS SMQ | Other | 1-2176616-2 |
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1217133-1
TE Connectivity
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1 | Contact Features: Contact Underplating Material Thickness 2.54 MICM | Mating Tab Width .187 INCH | PCB Terminal Type Tab | Terminal Plating Material Tin | Contact Mating Area Plating Material Thickness 150 MICIN | Contact Underplating Material Thickness 100 MICIN | Contact Underplating Material Thickness 1.27 MICM | Terminal Orientation Straight | Contact Mating Area Plating Material Thickness 3.81 MICM | Contact Underplating Material Thickness 50 MICIN | Mating Tab Thickness .032 INCH | Mating Tab Thicknes | Other | 1217133-1 |
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