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408-52160-100-12
ept
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1 | 160 pins, with key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tray packaging, Perpendicular, SMT, Direct Connector, High Density, High Speed | Other | 408-52160-100-12 |
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OPA354-Q1
TEXAS
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1 | SOT-23 (5) 2.90 mm × 1.60 mm | SOT23 (5-Pin) | OPA354-Q1 |
3
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L-C150SRCT
Paralight
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1 | 3.20 X 1.60 X 1.10 mm SMD CHIP LED (1206) | LEDs Chip | L-C150SRCT |
2
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Z0110MN5AA4
STMicroelectronics
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1 | (1) ITM = 1.4 A, tp = 380 µs 25 °C Max. 1.60 V | SOT223 (3-Pin) | Z0110MN5AA4 |
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LF992103
Würth Elektronik
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1 | MEPT - 7X7 - M3 - P9 / 1.60 / 3.50 v - RM2.54 | Other | LF992103 |
3
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ALA321C3
Amotech
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1 | Antenna, Bluetooth, Zigbee, Wireless, 2.4 GHz Antenna, Chip; 3.20 mm L X 1.60 mm W X 1.40 mm H body | Other | ALA321C3 |
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408-52200-100-12
ept
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1 | 200 pins, with key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tray packaging, Perpendicular, SMT, Direct Connector, High Density, High Speed | Other | 408-52200-100-12 |
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408-52180-100-12
ept
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1 | 180 pins, with key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tray packaging, Perpendicular, SMT, Direct Connector, High Density, High Speed | Other | 408-52180-100-12 |
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744373770047
Würth Elektronik
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1 | WE-LHMI SMT Power Inductor Size 1335; L = 0.47 µH ; IR = 19.0 A; Isat = 40,2 A; RDC = 1.60 mΩ | Other | 744373770047 |
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408-52060-100-11
ept
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1 | 60 pins, with key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tape & Reel packaging, Perpendicular, SMT, Direct Connector, High Density, High Speed | Other | 408-52060-100-11 |
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408-52140-100-11
ept
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1 | 140 pins, with key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tape & Reel packaging, Perpendicular, SMT, Direct Connector, High Density, High Speed | Other | 408-52140-100-11 |
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408-52060-000-11
ept
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1 | 60 pins, without key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tape & Reel packaging, Perpendicular, SMT, Direct Connector, High Density, High Speed | Other | 408-52060-000-11 |
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408-52020-000-11
ept
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1 | 20 pins, without key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tape & Reel packaging, Perpendicular, SMT, Direct Connector, High Density, High Speed | Other | 408-52020-000-11 |
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408-52100-100-11
ept
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1 | 100 pins, with key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tape & Reel packaging, Perpendicular, SMT, Direct Connector, High Density, High Speed | Other | 408-52100-100-11 |
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408-52080-100-11
ept
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1 | 80 pins, with key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tape & Reel packaging, Perpendicular, SMT, Direct Connector, High Density, High Speed | Other | 408-52080-100-11 |
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408-52120-100-11
ept
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1 | 120 pins, with key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tape & Reel packaging, Perpendicular, SMT, Direct Connector, High Density, High Speed | Other | 408-52120-100-11 |
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408-52040-000-11
ept
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1 | 40 pins, without key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tape & Reel packaging, Perpendicular, SMT, Direct Connector, High Density, High Speed | Other | 408-52040-000-11 |
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ESDR0502BT1G
onsemi
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1 | Low Capacitance 0.5 pF Typical; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; Low Clamping Voltage; Stand−off Voltage: 5 V; Small Body Outline Dimensions: 0.063” x 0.063” (1.60 mm x 1.60 mm); Response Time is Typically < 1.0 ns; IEC61000−4−2 Level 4 ESD Protection ISO10605 330 pF/2 k ±17 kV (Contact); This is a Pb−Free Device | SOT23 (3-Pin) | ESDR0502BT1G |
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R5F10RGCGFB#V0
Renesas Electronics
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1 | RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s | Quad Flat Packages | R5F10RGCGFB#V0 |
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R5F10RLAGFB#V0
Renesas Electronics
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1 | RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s | Quad Flat Packages | R5F10RLAGFB#V0 |
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R5F10RLCGNB#00
Renesas Electronics
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1 | RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s | Quad Flat No-Lead | R5F10RLCGNB#00 |
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R5F10RLAGFA#10
Renesas Electronics
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1 | RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s | Quad Flat Packages | R5F10RLAGFA#10 |
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R5F10RLAAFA#10
Renesas Electronics
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1 | RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s | Quad Flat Packages | R5F10RLAAFA#10 |
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R5F10RGAAFB#10
Renesas Electronics
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1 | RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s | Quad Flat Packages | R5F10RGAAFB#10 |
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R5F10RGCAFB#V0
Renesas Electronics
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1 | RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s | Quad Flat Packages | R5F10RGCAFB#V0 |
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