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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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BCIH1367-2R2M
Bao Cheng Elec
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1 | Powder Molding Type BCIH/IHP1338/50/67-Series | Inductors Precision Moulded | BCIH1367-2R2M |
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231-367/001-000
Wago
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1 | THT male header; 1.2 x 1.2 mm solder pin; straight; Pin spacing 5.08 mm; 7-pole | Other | 231-367/001-000 |
3
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1367500-1
TE Connectivity
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1 | Configuration Features: Number of Positions 30 | Contact Features: Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Base Material Phosphor Bronze | Electrical Characteristics: Data Rate (Max) 10 GBS | Housing Features: Housing Material LCP (Liquid Crystal Polymer) | Centerline (Pitch) .03 INCH | Centerline (Pitch) .8 MM | Industry Standards: UL Flamm | Other | 1367500-1 |
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ASPI-1367-4R7M
ABRACON
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1 | 4.7 µH Shielded Drum Core, Wirewound Inductor 13.5 A 11.2mOhm Max Nonstandard | Other | ASPI-1367-4R7M |
3
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1713677
Phoenix Contact
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1 | PCB terminal block, nominal current: 8 A, rated voltage (III/2): 250 V, nominal cross section: 1.5 mm², number of potentials: 10, number of rows: 1, number of positions per row: 10, product range: PTSA 1,5, pitch: 3.5 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 45 °, color: gray, Pin layout: Linear front pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard | Other | 1713677 |
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222224113676
KEMET
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1 | Yageo, 1206 (3216M) 10μF Multilayer Ceramic Capacitor MLCC 10V dc ±10% , SMD 222224113676 | Capacitor Chip Non-polarised | 222224113676 |
3
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A1367LKTTF-2B-T
Allegro Microsystems
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1 | Programmable Linear W/Reverse Battery | Other | A1367LKTTF-2B-T |
3
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ASPI-1367-6R8M-T
ABRACON
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1 | 6.8 õH Shielded Drum Core, Wirewound Inductor 11.5 A 14.9mOhm Max Nonstandard | Other | ASPI-1367-6R8M-T |
3
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ASPI-1367-2R2M-T
ABRACON
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1 | 2.2 µH Shielded Drum Core, Wirewound Inductor 20 A 4.2mOhm Max Nonstandard | Other | ASPI-1367-2R2M-T |
3
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1913675
Phoenix Contact
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1 | PCB header, nominal cross section: 6 mm?, color: green, nominal current: 76 A (41 A in combination with PC 6 plug), rated voltage (III/2): 1000 V, contact surface: Silver, type of contact: Male connector, Number of potentials: 5, Number of rows: 1, Number of positions per row: 5, number of connections: 5, product range: PC 6-16/..-G, pitch: 10.16 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 5 mm, Stecksystem: POWER COMBICON 16, Locking: without, type of packaging: packed in card | Other | 1913675 |
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R5F21367CDFP#V0
Renesas Electronics
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1 | The R8C/36C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/36C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating | Quad Flat Packages | R5F21367CDFP#V0 |
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B43693C1367Q001
TDK
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1 | Axial-lead/Soldering Star Capacitors, 360?F/160VDC, 21mm dia x 39mm length | Capacitors, Polarized Axial Diameter Horizontal Mounting | B43693C1367Q001 |
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R5F21367CNFP#V0
Renesas Electronics
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1 | The R8C/36C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/36C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating | Quad Flat Packages | R5F21367CNFP#V0 |
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A1367LKTTN-2U-T
Allegro Microsystems
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1 | Programmable Linear W/Reverse Battery | Other | A1367LKTTN-2U-T |
3
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A1367LKTTN-5B-T
Allegro Microsystems
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1 | Programmable Linear W/Reverse Battery | Other | A1367LKTTN-5B-T |
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1813670000
Weidmüller
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1 | PCB plug-in connector, male header, Clip-on flange, THT solder connection, 10.16 mm, Number of poles: 4, 180°, Solder pin length: 3.5 mm, silver-plated, black, Box | Other | 1813670000 |
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A1367LKTTF-2U-T
Allegro Microsystems
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1 | Programmable Linear W/Reverse Battery | Other | A1367LKTTF-2U-T |
3
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ASPI-1367-3R3M-T
ABRACON
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1 | Inductor Power Shielded Wirewound 3.3uH 20% 200KHz 15A 0.0068Ohm DCR T/R | Other | ASPI-1367-3R3M-T |
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1367337-1
TE Connectivity
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1 | Configuration Features: Number of Positions 70 | Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Thickness .38 MICM | Contact Base Material Phosphor Bronze | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | Housing Features: Housing Material LCP (Liquid Crystal Polymer) | Centerline (Pitch) .8 MM | Centerline (Pitch) .031 INCH | Industry Standards: UL Flammability Rating UL 94V-0 | Mechanical Attachment: PCB Mo | Other | 1367337-1 |
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A1367LKTTG-2U-T
Allegro Microsystems
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1 | Programmable Linear W/Reverse Battery | Other | A1367LKTTG-2U-T |
3
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B43793C1367Q001
TDK
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1 | Axial-lead/Soldering Star Capacitors, 360μF/160VDC, 21mm dia x 39mm length | Other | B43793C1367Q001 |
3
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A1367LKTTN-2B-T
Allegro Microsystems
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1 | Programmable Linear W/Reverse Battery | Other | A1367LKTTN-2B-T |
3
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TPS51367RVET
Texas Instruments
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1 | 22-V Input, 12-A Integrated FET Converter with Ultra-Low Quiescent | Quad Flat No-Lead | TPS51367RVET |
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TPS51367RVER
Texas Instruments
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1 | 22-V Input, 12-A Integrated FET Converter with Ultra-Low Quiescent | Quad Flat No-Lead | TPS51367RVER |
3
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ML62Q1367-NNNGD
LAPIS SEMICONDUCTOR
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1 | ML62Q1300 Group is a high performance CMOS 16-bit microcontroller equipped with an 16-bit CPU nX-U16/100 | Quad Flat No-Lead | ML62Q1367-NNNGD |
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