1367- Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	BCIH1367-2R2M Bao Cheng Elec	1	Powder Molding Type BCIH/IHP1338/50/67-Series	Inductors Precision Moulded	BCIH1367-2R2M	3D model available Symbol and footprint available 3	1 Download Model
	231-367/001-000 Wago	1	THT male header; 1.2 x 1.2 mm solder pin; straight; Pin spacing 5.08 mm; 7-pole	Other	231-367/001-000	3D model available Symbol and footprint available 3	1 Download Model
	1367500-1 TE Connectivity	1	Configuration Features: Number of Positions 30 \| Contact Features: Contact Current Rating (Max) .5 AMP \| Contact Mating Area Plating Material Gold \| Contact Mating Area Plating Material Thickness 29.92 MICIN \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Base Material Phosphor Bronze \| Electrical Characteristics: Data Rate (Max) 10 GBS \| Housing Features: Housing Material LCP (Liquid Crystal Polymer) \| Centerline (Pitch) .03 INCH \| Centerline (Pitch) .8 MM \| Industry Standards: UL Flamm	Other	1367500-1	3D model available Symbol and footprint available 3	1 Download Model
	ASPI-1367-4R7M ABRACON	1	4.7 µH Shielded Drum Core, Wirewound Inductor 13.5 A 11.2mOhm Max Nonstandard	Other	ASPI-1367-4R7M	3D model available Symbol and footprint available 3	1 Download Model

	1713677 Phoenix Contact	1	PCB terminal block, nominal current: 8 A, rated voltage (III/2): 250 V, nominal cross section: 1.5 mm², number of potentials: 10, number of rows: 1, number of positions per row: 10, product range: PTSA 1,5, pitch: 3.5 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 45 °, color: gray, Pin layout: Linear front pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard	Other	1713677	3D model available Symbol and footprint available 3	1 Download Model
	222224113676 KEMET	1	Yageo, 1206 (3216M) 10μF Multilayer Ceramic Capacitor MLCC 10V dc ±10% , SMD 222224113676	Capacitor Chip Non-polarised	222224113676	3D model available Symbol and footprint available 3	1 Download Model
	A1367LKTTF-2B-T Allegro Microsystems	1	Programmable Linear W/Reverse Battery	Other	A1367LKTTF-2B-T	3D model available Symbol and footprint available 3	1 Download Model
	ASPI-1367-6R8M-T ABRACON	1	6.8 ÃÂµH Shielded Drum Core, Wirewound Inductor 11.5 A 14.9mOhm Max Nonstandard	Other	ASPI-1367-6R8M-T	3D model available Symbol and footprint available 3	1 Download Model
	ASPI-1367-2R2M-T ABRACON	1	2.2 µH Shielded Drum Core, Wirewound Inductor 20 A 4.2mOhm Max Nonstandard	Other	ASPI-1367-2R2M-T	3D model available Symbol and footprint available 3	1 Download Model
	1913675 Phoenix Contact	1	PCB header, nominal cross section: 6 mm?, color: green, nominal current: 76 A (41 A in combination with PC 6 plug), rated voltage (III/2): 1000 V, contact surface: Silver, type of contact: Male connector, Number of potentials: 5, Number of rows: 1, Number of positions per row: 5, number of connections: 5, product range: PC 6-16/..-G, pitch: 10.16 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 5 mm, Stecksystem: POWER COMBICON 16, Locking: without, type of packaging: packed in card	Other	1913675	3D model available Symbol and footprint available 3	1 Download Model
	R5F21367CDFP#V0 Renesas Electronics	1	The R8C/36C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/36C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Quad Flat Packages	R5F21367CDFP#V0	3D model available Symbol and footprint available 3	1 Download Model
	B43693C1367Q001 TDK	1	Axial-lead/Soldering Star Capacitors, 360?F/160VDC, 21mm dia x 39mm length	Capacitors, Polarized Axial Diameter Horizontal Mounting	B43693C1367Q001	3D model available Symbol and footprint available 3	1 Download Model
	R5F21367CNFP#V0 Renesas Electronics	1	The R8C/36C Group is supported only for customers who have already adopted these products. The RL78/G14, RL78/G1F Groups are recommended for new designs.The R8C/36C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating	Quad Flat Packages	R5F21367CNFP#V0	3D model available Symbol and footprint available 3	1 Download Model
	A1367LKTTN-2U-T Allegro Microsystems	1	Programmable Linear W/Reverse Battery	Other	A1367LKTTN-2U-T	3D model available Symbol and footprint available 3	1 Download Model
	A1367LKTTN-5B-T Allegro Microsystems	1	Programmable Linear W/Reverse Battery	Other	A1367LKTTN-5B-T	3D model available Symbol and footprint available 3	1 Download Model

	1813670000 Weidmüller	1	PCB plug-in connector, male header, Clip-on flange, THT solder connection, 10.16 mm, Number of poles: 4, 180°, Solder pin length: 3.5 mm, silver-plated, black, Box	Other	1813670000	3D model available Symbol and footprint available 3	1 Download Model
	A1367LKTTF-2U-T Allegro Microsystems	1	Programmable Linear W/Reverse Battery	Other	A1367LKTTF-2U-T	3D model available Symbol and footprint available 3	1 Download Model
	ASPI-1367-3R3M-T ABRACON	1	Inductor Power Shielded Wirewound 3.3uH 20% 200KHz 15A 0.0068Ohm DCR T/R	Other	ASPI-1367-3R3M-T	3D model available Symbol and footprint available 3	1 Download Model
	1367337-1 TE Connectivity	1	Configuration Features: Number of Positions 70 \| Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN \| Contact Mating Area Plating Material Thickness .38 MICM \| Contact Base Material Phosphor Bronze \| Contact Current Rating (Max) .5 AMP \| Contact Mating Area Plating Material Gold \| Housing Features: Housing Material LCP (Liquid Crystal Polymer) \| Centerline (Pitch) .8 MM \| Centerline (Pitch) .031 INCH \| Industry Standards: UL Flammability Rating UL 94V-0 \| Mechanical Attachment: PCB Mo	Other	1367337-1	3D model available Symbol and footprint available 3	1 Download Model
	A1367LKTTG-2U-T Allegro Microsystems	1	Programmable Linear W/Reverse Battery	Other	A1367LKTTG-2U-T	3D model available Symbol and footprint available 3	1 Download Model
	B43793C1367Q001 TDK	1	Axial-lead/Soldering Star Capacitors, 360μF/160VDC, 21mm dia x 39mm length	Other	B43793C1367Q001	3D model available Symbol and footprint available 3	1 Download Model
	A1367LKTTN-2B-T Allegro Microsystems	1	Programmable Linear W/Reverse Battery	Other	A1367LKTTN-2B-T	3D model available Symbol and footprint available 3	1 Download Model
	TPS51367RVET Texas Instruments	1	22-V Input, 12-A Integrated FET Converter with Ultra-Low Quiescent	Quad Flat No-Lead	TPS51367RVET	3D model available Symbol and footprint available 3	1 Download Model
	TPS51367RVER Texas Instruments	1	22-V Input, 12-A Integrated FET Converter with Ultra-Low Quiescent	Quad Flat No-Lead	TPS51367RVER	3D model available Symbol and footprint available 3	1 Download Model
	ML62Q1367-NNNGD LAPIS SEMICONDUCTOR	1	ML62Q1300 Group is a high performance CMOS 16-bit microcontroller equipped with an 16-bit CPU nX-U16/100	Quad Flat No-Lead	ML62Q1367-NNNGD	3D model available Symbol and footprint available 3	1 Download Model
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