14450 Model Download Search Results
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14450R-500
Renesas Electronics
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1 | The FT 6050 Smart Transceiver system on chip (SoC) combines a high-performance Neuron® core with a Free Topology transceiver on a single chip to facilitate the design of Industrial Internet of Things (IIoT) devices and consolidate smart control networks. The FT 6050 is a key product in the IzoT® platform — the most comprehensive and open control networking platform for the IIoT. The device natively supports both BACnet and LON communications on the same network and offers compatibility with the large instal | Quad Flat No-Lead | 14450R-500 |
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1445088-6
TE Connectivity
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1 | CONN HEADER R/A 6POS 3MM | Other | 1445088-6 |
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1445055-3
TE Connectivity
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1 | CONN HEADER R/A 3POS 3MM | Other | 1445055-3 |
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1445088-2
TE Connectivity
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1 | CONN HEADER R/A 2POS 3MM | Other | 1445088-2 |
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1445088-8
TE Connectivity
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1 | MICRO MNL HDR ASSY S/ROW AU LF | Other | 1445088-8 |
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231-445/001-000
Wago
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1 | THT male header; 1.0 x 1.0 mm solder pin; angled; Pin spacing 5 mm; 15-pole | Other | 231-445/001-000 |
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1-1445088-0
TE Connectivity
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1 | CONN HEADER R/A 10POS 3MM | Other | 1-1445088-0 |
3
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ROB-14450
SparkFun
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1 | Power Management IC Development Tools SparkFun MotorDriver Dual TB6612FNG Head. | Other | ROB-14450 |
3
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2-1445055-7
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 7 | Number of Positions 7 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Wit | Other | 2-1445055-7 |
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2-1445098-8
TE Connectivity
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1 | Connector Header Through Hole, Right Angle 8 position 0.118" (3.00mm) | Other | 2-1445098-8 |
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2-1445093-8
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 8 | PCB Mount Orientation Vertical | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Layout Inline | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Ter | Other | 2-1445093-8 |
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2-1445099-4
TE Connectivity
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1 | Configuration Features: Number of Positions 4 | Number of Rows 1 | Number of Power Positions 4 | PCB Mount Orientation Right Angle | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plati | Other | 2-1445099-4 |
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2-1445099-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 3 | Number of Power Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness .76 MI | Other | 2-1445099-3 |
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2-1445091-2
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.5 | Other | 2-1445091-2 |
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2-1445088-4
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Right Angle | Number of Power Positions 4 | Contact Features: Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Retention Within Housing Without | Contact Type Pin | Contact Layout Inline | PCB Contact Terminati | Other | 2-1445088-4 |
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2-1445086-3
TE Connectivity
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1 | Micro MATE-N-LOK, Rectangular Power Connectors, Header, Plug, Wire-to-Board, 3 Position, 3mm [.118in] Centerline, Printed Circuit Board, UL 94V-0 | Other | 2-1445086-3 |
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2-1445088-8
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 8 | Number of Power Positions 8 | Contact Features: Multiple Contact Types Without | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | PCB Contact | Other | 2-1445088-8 |
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721-445/001-000
Wago
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1 | THT male header; 1.0 x 1.0 mm solder pin; angled; 100% protected against mismating; Pin spacing 5 mm; 15-pole | Other | 721-445/001-000 |
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144-5003
RS Pro
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0 | RS PRO, 20 MHz Clock Oscillator, ±50ppm TTL, 4-Pin SMD | Other | 144-5003 |
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2-1445053-3
TE Connectivity
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1 | Configuration Features: Number of Power Positions 3 | Number of Rows 1 | Number of Positions 3 | PCB Mount Orientation Vertical | Contact Features: Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area | Other | 2-1445053-3 |
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2-1445056-3
TE Connectivity
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1 | PCB Mount Header, Right Angle, Wire-to-Board, 3 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Tin, Surface Mount, Power, Micro MATE-N-LOK | Other | 2-1445056-3 |
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2-1445055-9
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 9 | Number of Power Positions 9 | PCB Mount Orientation Right Angle | Contact Features: Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Type Pin | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Platin | Other | 2-1445055-9 |
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2-1445085-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | Number of Rows 1 | Number of Positions 2 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB | Other | 2-1445085-2 |
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2-1445057-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 4 | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Ar | Other | 2-1445057-4 |
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2-1445093-3
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 3 | PCB Mount Orientation Vertical | Number of Power Positions 3 | Contact Features: Contact Mating Area Plating Material Gold | Contact Retention Within Housing Without | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | Contact | Other | 2-1445093-3 |
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![Part Image](["https://www.renesas.com/sites/default/files/ft-6050-block-diagram.png","https://www.renesas.com/sites/default/files/ft-6050-block-diagram.png",null])
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