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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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18125
Molex
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1 | Barrier Strip Terminal Block | 18125 |
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18125C105KAT2A
Kyocera AVX
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1 | AVX - 18125C105KAT2A - SMD Multilayer Ceramic Capacitor, 1 µF, 50 V, 1812 [4532 Metric], ± 10%, X7R, AVX 1812 MLCC | Capacitor Chip Non-polarised | 18125C105KAT2A |
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18125A472FAT2A
Kyocera AVX
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1 | AVX - 18125A472FAT2A - Capacitor,Ceramic,4.7nF,50VDC,1-% Tol,1+% Tol,C0G-TC Code,-30,30ppm-TC | Capacitor Chip Non-polarised | 18125A472FAT2A |
3
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AIAC-1812-56NJ-T
ABRACON
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1 | 56 nH Unshielded Wirewound Inductor 2.9 A 6.4mOhm Max Nonstandard | Other | AIAC-1812-56NJ-T |
3
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1318125-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 8 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Housing Features: Centerline (Pitch) .099 INCH | Centerline (Pitch) 2.5 MM | Housing Material Polyester GF | Industry Standards: UL F | Other | 1318125-2 |
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72T18125L4-4BB
Renesas Electronics
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1 | The 72T18125 is a 512K x 18 / 1M x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode. | BGA | 72T18125L4-4BB |
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1218125-3
TE Connectivity
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1 | Body Features: Front Shell Plating Material Cadmium | Front Shell Material Steel | D-Sub Connector Insert Arrangement MS18275-1 | Rear Shell Plating Material Cadmium | Rear Shell Material Steel | Configuration Features: Number of Positions 25 | PCB Mount Orientation Vertical | Power/Signal/Coax Combination No | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Base Material Brass | Contact Type Pin | Contact Size Size 20 | Contact Mating Area Plating Material Gold | Housing Features: Centerline | Other | 1218125-3 |
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18125C684KAZ2A
Kyocera AVX
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1 | Capacitor MLCC 1812 680nF 50V AVX 1812 Standard 680nF Ceramic Multilayer Capacitor, 50 V dc, +125degC, X7R Dielectric, /-10% SMD | Capacitor Chip Non-polarised | 18125C684KAZ2A |
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18125C474KAT2A
Kyocera AVX
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1 | AVX - 18125C474KAT2A - SMD Multilayer Ceramic Capacitor, 0.47 µF, 50 V, 1812 [4532 Metric], ± 10%, X7R, AVX 1812 MLCC | Capacitor Chip Non-polarised | 18125C474KAT2A |
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18125C474JAT2A
Kyocera AVX
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1 | 18125C474JAT2A | Capacitor Chip Non-polarised | 18125C474JAT2A |
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18125A103JAT2A
Kyocera AVX
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1 | AVX 18125A103JAT2A 10nF Multilayer Ceramic Capacitor MLCC 50V dc ±5% Tolerance SMD | Capacitor Chip Non-polarised | 18125A103JAT2A |
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18125C225KAT2A
Kyocera AVX
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1 | AVX 1812 Standard 2.2 | Capacitor Chip Non-polarised | 18125C225KAT2A |
3
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18125C334KAT2A
Kyocera AVX
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1 | AVX - 18125C334KAT2A - SMD Multilayer Ceramic Capacitor, 0.33 µF, 50 V, 1812 [4532 Metric], ± 10%, X7R, AVX 1812 MLCC | Capacitor Chip Non-polarised | 18125C334KAT2A |
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18125C224KAT2A
Kyocera AVX
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1 | AVX - 18125C224KAT2A - SMD Multilayer Ceramic Capacitor, 0.22 µF, 50 V, 1812 [4532 Metric], ± 10%, X7R, AVX 1812 MLCC | Capacitor Chip Non-polarised | 18125C224KAT2A |
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ASTMLPA-18-125.000MHZ-EJ-E-T
ABRACON
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1 | Standard Clock Oscillators 125MHz 1.8V 20ppm -20C +70C | Other | ASTMLPA-18-125.000MHZ-EJ-E-T |
3
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02181.25
LITTELFUSE
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1 | Axial Lead & Cartridge Fuses 5×20 mm > Time-Lag > 218 Series | Other | 02181.25 |
2
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78931812515
Würth Elektronik
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1 | WE-PSPA Push Pull & Gate Drive Transformer NEW | Other | 78931812515 |
2
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72T18125L6-7BB
Renesas Electronics
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1 | The 72T18125 is a 512K x 18 / 1M x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode. | BGA | 72T18125L6-7BB |
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72T18125L10BB
Renesas Electronics
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1 | The 72T18125 is a 512K x 18 / 1M x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode. | BGA | 72T18125L10BB |
3
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AISM-1812-5R6K-T
ABRACON
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1 | 5.6 µH Unshielded Drum Core, Wirewound Inductor 300 mA 1.1Ohm Max 1812 (4532 Metric) | Inductors Precision Moulded | AISM-1812-5R6K-T |
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72T18125L5BB
Renesas Electronics
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1 | The 72T18125 is a 512K x 18 / 1M x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode. | BGA | 72T18125L5BB |
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72T18125L5BBGI
Renesas Electronics
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1 | The 72T18125 is a 512K x 18 / 1M x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode. | BGA | 72T18125L5BBGI |
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1318125-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 8 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 15 MICIN | Housing Features: Centerline (Pitch) .099 INCH | Centerline (Pitch) 2.5 MM | Housing Material Polyester GF | Industry Standards: UL F | Other | 1318125-2 |
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02181.25MXBP
LITTELFUSE
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1 | Axial Lead & Cartridge Fuses 5×20 mm > Time-Lag > 218 Series | Other | 02181.25MXBP |
2
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PIC16F18125T-I/ST
Microchip
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1 | PIC PIC® 16F Microcontroller IC 8-Bit 32MHz 14KB (14K x 8) FLASH 14-TSSOP | Small Outline Packages | PIC16F18125T-I/ST |
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