18125 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	18125 Molex	1	Barrier Strip Terminal Block, 20A, 3.31mm2, 2 Row(s), 1 Deck(s)		18125	3D model not available Symbol and footprint not available 0	0 Build or Request
	18125C105KAT2A Kyocera AVX	1	AVX - 18125C105KAT2A - SMD Multilayer Ceramic Capacitor, 1 µF, 50 V, 1812 [4532 Metric], ± 10%, X7R, AVX 1812 MLCC	Capacitor Chip Non-polarised	18125C105KAT2A	3D model available Symbol and footprint available 3	1 Download Model
	18125C474JAT2A Kyocera AVX	1	18125C474JAT2A	Capacitor Chip Non-polarised	18125C474JAT2A	3D model available Symbol and footprint available 3	1 Download Model
	18125C475JAT2A Kyocera AVX	1	4.7 µF ±5% 50V Ceramic Capacitor X7R 1812 (4532 Metric)	Capacitor Chip Non-polarised	18125C475JAT2A	3D model available Symbol and footprint available 3	1 Download Model

	18125C474KAT2A Kyocera AVX	1	AVX - 18125C474KAT2A - SMD Multilayer Ceramic Capacitor, 0.47 µF, 50 V, 1812 [4532 Metric], ± 10%, X7R, AVX 1812 MLCC	Capacitor Chip Non-polarised	18125C474KAT2A	3D model available Symbol and footprint available 3	1 Download Model
	18125A103JAT2A Kyocera AVX	1	AVX 18125A103JAT2A 10nF Multilayer Ceramic Capacitor MLCC 50V dc ±5% Tolerance SMD	Capacitor Chip Non-polarised	18125A103JAT2A	3D model available Symbol and footprint available 3	1 Download Model
	18125C684KAZ2A Kyocera AVX	1	Capacitor MLCC 1812 680nF 50V AVX 1812 Standard 680nF Ceramic Multilayer Capacitor, 50 V dc, +125degC, X7R Dielectric, /-10% SMD	Capacitor Chip Non-polarised	18125C684KAZ2A	3D model available Symbol and footprint available 3	1 Download Model
	18125C225KAT2A Kyocera AVX	1	AVX 1812 Standard 2.2	Capacitor Chip Non-polarised	18125C225KAT2A	3D model available Symbol and footprint available 3	1 Download Model
	18125C334KAT2A Kyocera AVX	1	AVX - 18125C334KAT2A - SMD Multilayer Ceramic Capacitor, 0.33 µF, 50 V, 1812 [4532 Metric], ± 10%, X7R, AVX 1812 MLCC	Capacitor Chip Non-polarised	18125C334KAT2A	3D model available Symbol and footprint available 3	1 Download Model
	18125C224KAT2A Kyocera AVX	1	AVX - 18125C224KAT2A - SMD Multilayer Ceramic Capacitor, 0.22 µF, 50 V, 1812 [4532 Metric], ± 10%, X7R, AVX 1812 MLCC	Capacitor Chip Non-polarised	18125C224KAT2A	3D model available Symbol and footprint available 3	1 Download Model
	18125C474KAZ2A Kyocera AVX	1	Multilayer Ceramic Capacitors MLCC - SMD/SMT 50V .47uF X7R 1812 10% Tol FLEX	Capacitor Chip Non-polarised	18125C474KAZ2A	3D model available Symbol and footprint available 3	1 Download Model
	18125C475KAT2A Kyocera AVX	1	4.7 µF ±10% 50V Ceramic Capacitor X7R 1812 (4532 Metric)	Capacitor Chip Non-polarised	18125C475KAT2A	3D model available Symbol and footprint available 3	1 Download Model
	18125A472FAT2A Kyocera AVX	1	AVX - 18125A472FAT2A - Capacitor,Ceramic,4.7nF,50VDC,1-% Tol,1+% Tol,C0G-TC Code,-30,30ppm-TC	Capacitor Chip Non-polarised	18125A472FAT2A	3D model available Symbol and footprint available 3	1 Download Model
	PIC16F18125-I/7N Microchip	1	8-bit Microcontrollers - MCU 14KB Flash, 512B RAM, 128B EEPROM, 12b Diff. ADCC, 2x16-bit dual PWM	Quad Flat No-Lead	PIC16F18125-I/7N	3D model available Symbol and footprint available 3	1 Download Model
	AIAC-1812-56NJ-T ABRACON	1	56 nH Unshielded Wirewound Inductor 2.9 A 6.4mOhm Max Nonstandard	Other	AIAC-1812-56NJ-T	3D model available Symbol and footprint available 3	1 Download Model

	72T18125L4-4BB Renesas Electronics	1	The 72T18125 is a 512K x 18 / 1M x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.	BGA	72T18125L4-4BB	3D model available Symbol and footprint available 3	1 Download Model
	1218125-3 TE Connectivity	1	Body Features: Front Shell Plating Material Cadmium \| Front Shell Material Steel \| D-Sub Connector Insert Arrangement MS18275-1 \| Rear Shell Plating Material Cadmium \| Rear Shell Material Steel \| Configuration Features: Number of Positions 25 \| PCB Mount Orientation Vertical \| Power/Signal/Coax Combination No \| Contact Features: Contact Current Rating (Max) 5 AMP \| Contact Base Material Brass \| Contact Type Pin \| Contact Size Size 20 \| Contact Mating Area Plating Material Gold \| Housing Features: Centerline	Other	1218125-3	3D model available Symbol and footprint available 3	1 Download Model
	VG181256U111DP Kyocera AVX	1	Varistors 40VAC 56VDC 4.8J 800 pF 68 V 110V	Varistors Chip	VG181256U111DP	3D model available Symbol and footprint available 3	1 Download Model
	ASTMLPA-18-125.000MHZ-EJ-E-T ABRACON	1	Standard Clock Oscillators 125MHz 1.8V 20ppm -20C +70C	Other	ASTMLPA-18-125.000MHZ-EJ-E-T	3D model available Symbol and footprint available 3	1 Download Model
	02181.25 LITTELFUSE	1	Axial Lead & Cartridge Fuses 5×20 mm > Time-Lag > 218 Series	Other	02181.25	3D model not available Symbol and footprint available 2	1 Download Model
	1318125-2 TE Connectivity	1	Body Features: Primary Product Color Black \| Configuration Features: PCB Mount Orientation Vertical \| Number of Positions 8 \| Number of Rows 2 \| Contact Features: Contact Mating Area Plating Material Thickness .38 MICM \| Contact Type Pin \| Contact Current Rating (Max) 5 AMP \| Contact Mating Area Plating Material Gold \| Contact Mating Area Plating Material Thickness 15 MICIN \| Housing Features: Centerline (Pitch) .099 INCH \| Centerline (Pitch) 2.5 MM \| Housing Material Polyester GF \| Industry Standards: UL F	Other	1318125-2	3D model available Symbol and footprint available 3	1 Download Model
	72T18125L5BBGI Renesas Electronics	1	The 72T18125 is a 512K x 18 / 1M x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.	BGA	72T18125L5BBGI	3D model available Symbol and footprint available 3	1 Download Model
	72T18125L5BB Renesas Electronics	1	The 72T18125 is a 512K x 18 / 1M x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.	BGA	72T18125L5BB	3D model available Symbol and footprint available 3	1 Download Model
	72T18125L6-7BB Renesas Electronics	1	The 72T18125 is a 512K x 18 / 1M x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.	BGA	72T18125L6-7BB	3D model available Symbol and footprint available 3	1 Download Model
	78931812515 Würth Elektronik	1	WE PSPA Push Pull Transformer Size 1208; Ui = 5 V; Uo1 = 15 V; Io1 = 250 mA; L = 86 ÂµH; fswitch = 420 kHz	Other	78931812515	3D model available Symbol and footprint available 3	1 Download Model
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