2-323 Model Download Search Results
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GTCC23-231M-R01-2
LITTELFUSE
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1 | Littelfuse GTCC23 Series 230V 1kA SMD 2 Electrode Gas Discharge Tube | Other | GTCC23-231M-R01-2 |
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MFS2323BMBA5EP
NXP
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1 | Safety System Basis Chip, ASIL B, CAN FD + LIN + LDT, HV Buck + 2 HV LDO , 5.5V ~ 40V , -40°C ~ 125°C (TA) | Other | MFS2323BMBA5EP |
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M80-4000000F1-02-323-00-000
Harwin
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1 | Datamate Mix-Tek: 2 Pos Receptacle SIL Right-Angle 3.5mm THT Power Connector Slotted Jackscrews | Other | M80-4000000F1-02-323-00-000 |
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1823230
Phoenix Contact
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1 | SPT-THR 1,5/ 6-V-3,5 P20 R44 - Printed circuit board terminal, nominal current: 17.5 A, rated voltage (III/2): 160 V, nominal cross section: 1.5 mm2, number of potentials: 6, number of rows: 1, number of positions per row: 6, product range: SPT 1,5/..-V-THR, pitch: 3.5 mm, connection method: Push-in spring connection, mounting: THR soldering / wave soldering, conductor/PCB connection direction: 90 °, color: black, Pin layout: Linear pinning, Solder pin [P]: 2 mm, number of solder pins per potenti | Other | 1823230 |
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592-3232-313F
Dialight
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1 | LED Circuit Board Indicator LED Circuit Board Indicator 2 High Red, Yellow (x 2) 2V 30mA Round with Domed Top 3.00mm Dia Surface Mount, Right Angle | Other | 592-3232-313F |
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2323103-8
TE Connectivity
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1 | Body Features: Primary Product Color Black | Connector & Keying Code A | Configuration Features: Number of Rows 1 | PCB Mount Orientation Horizontal | Number of Positions 8 | Contact Features: Mating Tab Width .019 INCH | Contact Mating Area Plating Material Tin | Contact Type Tab | Mating Tab Width .5 MM | Contact Current Rating (Max) 2 AMP | Mating Tab Thickness .015 INCH | Mating Tab Thickness .4 MM | Contact Size .5mm | Housing Features: Centerline (Pitch) .05 INCH | Centerline (Pitch) 1.27 MM | Industr | Other | 2323103-8 |
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292323-5
TE Connectivity
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1 | Body Features: Connector Profile Standard | Shell Plating Material Tin | Shell Plating Finish Bright | Configuration Features: Number of Ports 2 | Panel Ground Location Between Ports | Number of Positions 8 | Contact Features: Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .062 INCH | Other | 292323-5 |
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292323-6
TE Connectivity
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1 | Body Features: Shell Plating Material Tin | Shell Plating Finish Bright | Connector Profile Standard | Configuration Features: Panel Ground Location Between Ports | Number of Ports 2 | Number of Positions 8 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Current Rating (Max) 1 AMP | Dimensions: PCB Thickness (Recommended) 1.57 MM | | Other | 292323-6 |
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232-337
Wago
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1 | THT male header for double-deck assembly; 1.0 x 1.0 mm solder pin; angled; Pin spacing 5 mm; 7-pole | Other | 232-337 |
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RK73H1ETTP2323F
KOA Speer
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1 | Thick Film Resistors - SMD 0.1watt 232Kohms 1% | Resistor Chip | RK73H1ETTP2323F |
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MC56F82323VFM
NXP
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1 | Digital Signal Controllers (DSCs) | Quad Flat No-Lead | MC56F82323VFM |
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232-336
Wago
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1 | THT male header for double-deck assembly; 1.0 x 1.0 mm solder pin; angled; Pin spacing 5 mm; 6-pole | Other | 232-336 |
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232-335
Wago
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1 | THT male header for double-deck assembly; 1.0 x 1.0 mm solder pin; angled; Pin spacing 5 mm; 5-pole | Other | 232-335 |
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232-376
Wago
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1 | THT male header for double-deck assembly; 1.0 x 1.0 mm solder pin; angled; Pin spacing 5.08 mm; 16-pole | Other | 232-376 |
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232-362
Wago
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1 | THT male header for double-deck assembly; 1.0 x 1.0 mm solder pin; angled; Pin spacing 5.08 mm; 2-pole | Other | 232-362 |
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HTSW-123-23-G-T
SAMTEC
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1 | SAMTEC - HTSW-123-23-G-T - HEADER, 2.54MM, THT VERT, 69WAY | Header, Vertical | HTSW-123-23-G-T |
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597-2323-507F
Dialight
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1 | Standard LEDs - SMD LED Indication - Discrete 2-SMD, No Lead | Other | 597-2323-507F |
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OPA2323IDGKR
Texas Instruments
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1 | Operational Amplifiers - Op Amps Dual 5.5-V 20-MHz zero-cross low-nois | Small Outline Packages | OPA2323IDGKR |
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SI2323DDS-T1-GE3
Vishay
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1 | VISHAY - SI2323DDS-T1-GE3 - Power MOSFET, P Channel, 20 V, 5.3 A, 0.032 ohm, SOT-23, Surface Mount | SOT23 (3-Pin) | SI2323DDS-T1-GE3 |
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232-364
Wago
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1 | THT male header for double-deck assembly; 1.0 x 1.0 mm solder pin; angled; Pin spacing 5.08 mm; 4-pole | Other | 232-364 |
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TFCR0805-8W-K-2323BT-1K
Venkel
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1 | Thin Film CR,0805,1/8W,?100PPM,232K ,?0.1% | Other | TFCR0805-8W-K-2323BT-1K |
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TFCR1210-4W-K-2323DT
Venkel
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1 | Thin Film CR,1210,1/4W,?100PPM,232K ,?0.5% | Other | TFCR1210-4W-K-2323DT |
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TFCR2010-4W-K-2323CT
Venkel
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1 | Thin Film CR,2010,1/4W,?100PPM,232K ,?0.25% | Other | TFCR2010-4W-K-2323CT |
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SSW-123-23-G-D
SAMTEC
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1 | 46 Position, .100" Tiger Buy™ Socket Strip | Other | SSW-123-23-G-D |
2
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MCT06030D2323BP100
Vishay
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1 | Vishay Resistor Chip 0603 | Resistor Chip | MCT06030D2323BP100 |
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