2-533 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	2-5338556-1 TE Connectivity	1	Body Features: Shield Plating Finish Bright \| PCB Ground Tab Location .12 INCH \| Shield Material Brass \| PCB Ground Tab Location 3.05 MM \| Connector Profile Low \| Modular Jack Latch Orientation Standard - Latch Down \| Shield Plating Material Tin \| Configuration Features: Connector Contact Density Standard \| Number of Loaded Positions 8 \| Panel Ground Location Top \| PCB Mount Orientation Right Angle \| Status Light Type Not Illuminated \| Panel Ground Location Top and Side \| Port Configuration Single Port \| Nu	Other	2-5338556-1	3D model available Symbol and footprint available 3	1 Download Model
	2-5332070-5 TE Connectivity	1	Body Features: Sleeve Plating Material Tin \| Sleeve Material Copper \| Configuration Features: Compatible With Wire & Cable Type Discrete Wire \| Contact Features: Contact Spring Plating Thickness 30 MICIN \| Contact Mating Area Plating Material Thickness 30 MICM \| Contact Current Rating (Max) 6.5 AMP \| Contact Spring Plating Thickness .685 MICM \| Contact Mating Area Plating Material Thickness 30 MICIN \| Contact Spring Plating Material Gold \| Contact Base Material Beryllium Copper \| Dimensions: Mating Pin Diam	Other	2-5332070-5	3D model available Symbol and footprint available 3	1 Download Model
	2-5338556-1 TE Connectivity	1	Body Features: Shield Plating Finish Bright \| PCB Ground Tab Location .12 INCH \| Shield Material Brass \| PCB Ground Tab Location 3.05 MM \| Connector Profile Low \| Modular Jack Latch Orientation Standard - Latch Down \| Shield Plating Material Tin \| Configuration Features: Connector Contact Density Standard \| Number of Loaded Positions 8 \| Panel Ground Location Top \| PCB Mount Orientation Right Angle \| Status Light Type Not Illuminated \| Panel Ground Location Top and Side \| Port Configuration Single Port \| Nu	Other	2-5338556-1	3D model available Symbol and footprint available 3	1 Download Model
	2-5332095-4 TE Connectivity	1	Body Features: Sleeve Material Copper \| Sleeve Plating Material Tin \| Configuration Features: Compatible With Wire & Cable Type Discrete Wire \| Contact Features: Contact Mating Area Plating Material Thickness 30 MICM \| Contact Spring Plating Thickness .762 MICM \| Contact Spring Plating Thickness 30 MICIN \| Contact Spring Plating Material Gold \| Contact Mating Area Plating Material Thickness 30 MICIN \| Contact Current Rating (Max) 3 AMP \| Contact Base Material Beryllium Copper \| Contact Mating Area Plating M	Other	2-5332095-4	3D model available Symbol and footprint available 3	1 Download Model

	RCL1225330K1%100PPM/KE3 Vishay	0	RESISTOR, 1225 330K Ohms ±1% 2 W	Other	RCL1225330K1%100PPM/KE3	3D model not available Symbol and footprint available 2	1 Download Model
	RCL122533K1%100PPM/KE3 Vishay	0	RESISTOR, 1225 33K Ohms ±1% 2 W	Other	RCL122533K1%100PPM/KE3	3D model not available Symbol and footprint available 2	1 Download Model
	RCL1225330R1%100PPM/KE3 Vishay	0	RESISTOR, 1225 330 Ohms ±1% 2 W	Other	RCL1225330R1%100PPM/KE3	3D model not available Symbol and footprint available 2	1 Download Model
	M22-5330705 Harwin	1	Headers & Wire Housings 7 PIN SIL HORIZONTAL GOLD PIN HEADER	Other	M22-5330705	3D model not available Symbol and footprint available 2	1 Download Model
	BDCH-25-33+ Mini-Circuits	1	25 dB SMT Bi-Directional Coupler, 800 - 3000 MHz, 50Ω	Other	BDCH-25-33+	3D model not available Symbol and footprint available 2	1 Download Model
	2533020201601 Würth Elektronik	1	WURTH ELEKTRONIK - 2533020201601 - MEMS Accelerometer, Digital, X, Y, Z, ± 2g, ± 4g, ± 8g, ± 16g, 1.7 V, 3.6 V, LGA	Other	2533020201601	3D model available Symbol and footprint available 3	1 Download Model
	MMZ25333BT1 NXP	1	NXP - MMZ25333BT1 - RF AMPLIFIER, 2700MHZ, HVQFN-24	Quad Flat No-Lead	MMZ25333BT1	3D model available Symbol and footprint available 3	1 Download Model
	MMK22.5334K1000D16L4TRAY KEMET	1	Film Capacitors 1000volts 0.33uF 10% 10% LS 22.5mm	Other	MMK22.5334K1000D16L4TRAY	3D model available Symbol and footprint available 3	1 Download Model
	MSP430G2533IRHB32R Texas Instruments	1	MCU 16-bit MSP430 RISC 16KB Flash 2.5V/3.3V 32-Pin VQFN EP T/R	Quad Flat No-Lead	MSP430G2533IRHB32R	3D model available Symbol and footprint available 3	1 Download Model
	MSP430G2533IPW20 Texas Instruments	1	MSP430G2x33, MSP430G2x03 Mixed Signal Microcontroller	Small Outline Packages	MSP430G2533IPW20	3D model available Symbol and footprint available 3	1 Download Model
	MSP430G2533IPW28R Texas Instruments	1	MSP430G2x33, MSP430G2x03 Mixed Signal Microcontroller	Small Outline Packages	MSP430G2533IPW28R	3D model available Symbol and footprint available 3	1 Download Model

	ESW-125-33-S-D SAMTEC	1	50 Position, .100" Elevated Socket Strip, Double Row	Other	ESW-125-33-S-D	3D model not available Symbol and footprint available 2	1 Download Model
	PTZTFTE253.3B ROHM Semiconductor	1	1W 3.3V, DO-214AC, High Power Zener Diode for Automotive	Other	PTZTFTE253.3B	3D model available Symbol and footprint available 3	1 Download Model
	ESQ-125-33-G-S SAMTEC	1	25 Position, Elevated Socket Strip, 0.100" Pitch	Other	ESQ-125-33-G-S	3D model not available Symbol and footprint available 2	1 Download Model
	PS2533-1-A Renesas Electronics	1	The PS2533-1 and PS2533L-1 are optically coupled isolators containing a GaAs light emitting diode and an NPN silicon darlington connected phototransistor. The PS2533-1 is in a plastic DIP (Dual In-line Package) and the PS2533L-1 is lead bending type (Gull-wing) for surface mount.	Dual-In-Line Packages	PS2533-1-A	3D model available Symbol and footprint available 3	1 Download Model
	M22-5330505R Harwin	1	2.00mm (0.079") Pitch SIL Horizontal SMT Pin Header, 5 contacts (Tape & Reel packing)	Other	M22-5330505R	3D model not available Symbol and footprint available 2	1 Download Model
	CC2533F96RHAR Texas Instruments	1	An Optimized System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 Remote Control Applications	Other	CC2533F96RHAR	3D model available Symbol and footprint available 3	1 Download Model
	HDSP-2533 Avago Technologies	1	HDSP-2533 Broadcom 8 Digit Dot Matrix LED Display, 7 x 5 Dot Matrix Green 7.5 mcd 4.6mm	Other	HDSP-2533	3D model available Symbol and footprint available 3	1 Download Model
	MMK22.5334K1000D16L4TRAY KEMET	1	Film Capacitors 1000volts 0.33uF 10% 10% LS 22.5mm	Other	MMK22.5334K1000D16L4TRAY	3D model available Symbol and footprint available 3	1 Download Model
	78253/35MC-R Murata Electronics	1	Power Transformers Max253TX3.3vinput 5voutD	Small Outline Packages	78253/35MC-R	3D model available Symbol and footprint available 3	1 Download Model
	MMZ25333BT1 NXP	1	NXP - MMZ25333BT1 - RF AMPLIFIER, 2700MHZ, HVQFN-24	Quad Flat No-Lead	MMZ25333BT1	3D model available Symbol and footprint available 3	1 Download Model
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