2-664 Model Download Search Results
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1-2332664-0
TE Connectivity
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1 | 2 Position Cable Assembly Rectangular Socket to Plug | Other | 1-2332664-0 |
3
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26-64-4040
Molex
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1 | MOLEX - 26-64-4040 - WIRE-BOARD CONNECTOR HEADER 4 POSITION, 3.96MM | Other | 26-64-4040 |
3
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502426-6412
Molex
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1 | Conn Stacking RCP 1mm Stack Height 64 POS 0.4mm Solder Tab ST SMD Emboss T/R - Tape and Reel | Other | 502426-6412 |
3
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LTC2664CUH-12#PBF
Analog Devices
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1 | LINEAR TECHNOLOGY - LTC2664CUH-12#PBF - Digital to Analogue Converter, 4-Ch, 12 bit, SPI, 4.5V to 5.5V, ± 4.5V to ± 15.75V, QFN, 32 Pins | Quad Flat No-Lead | LTC2664CUH-12#PBF |
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MAL217266471E3
Vishay
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1 | Aluminum Electrolytic Capacitors Radial Miniature, Low Impedance, Automotive Grade | Capacitor, Polarized Radial Diameter | MAL217266471E3 |
3
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776266-4
TE Connectivity
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1 | PCB Mount Header, Right Angle, Wire-to-Board, 14 Position, 4 mm [.157 in] Centerline, Fully Shrouded, Tin, Through Hole - Solder, Sealable, AMPSEAL | Other | 776266-4 |
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1-2332664-6
TE Connectivity
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1 | Rectangular Power Connectors, Connector Assembly, Plug & Receptacle, Wire-to-Board, 3 Position, 8 mm [.315 in] Centerline, UMP Connector | Other | 1-2332664-6 |
3
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26-64-5040
Molex
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1 | KK 396 Header, Right-Angle, Friction Lock with Press-fit Plastic Peg PCB, 4 Circuits, Tin (Sn) Plating | Other | 26-64-5040 |
3
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MP2664GG-0000-P
Monolithic Power Systems (MPS)
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1 | Battery Management 500mA,5V USB,I2C-Controlled Charger with Power Path Management for 1cell in QFN Package. | Other | MP2664GG-0000-P |
3
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TS02-66-43-BK-260-SCR-D
Same Sky
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0 | Tactile Switches 6 x 6 mm, 4.3 mm Act Height, 260 gf, Black, Short Crimped, Through Hole, SPST, | Other | TS02-66-43-BK-260-SCR-D |
3
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26-64-5072
Molex
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1 | Headers & Wire Housings KK 156 Hdr FrLk RtAn 07 Ckt Tin | Other | 26-64-5072 |
2
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826646-7
TE Connectivity
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1 | Body Features: Primary Product Color Green | Configuration Features: Number of Rows 1 | Connector Contact Load Condition Fully Loaded | Number of Positions 7 | Board-to-Board Configuration Parallel | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness .8 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Mating Square Post Dimension .63 MM | Contact Base Material Phosphor Bronze | PCB Conta | Header, Vertical | 826646-7 |
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MAL217266472E3
Vishay
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1 | Aluminum Electrolytic Capacitors Radial Miniature, Low Impedance, Automotive Grade | Capacitor, Polarized Radial Diameter | MAL217266472E3 |
3
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MAX32664GWEC+
Analog Devices
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1 | Ultra-Low Power Biometric Sensor Hub | BGA | MAX32664GWEC+ |
3
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1-2332664-3
TE Connectivity
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1 | Rectangular Power Connectors, Connector Assembly, Plug & Receptacle, Wire-to-Board, 3 Position, 8 mm [.315 in] Centerline, UMP Connector | Other | 1-2332664-3 |
3
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1-2332664-2
TE Connectivity
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1 | Rectangular Power Connectors, Connector Assembly, Plug & Receptacle, Wire-to-Board, 2 Position, 8 mm [.315 in] Centerline, UMP Connectorn | Other | 1-2332664-2 |
3
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2332664-4
TE Connectivity
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1 | Rectangular Power Connectors, Connector Assembly, Plug & Receptacle, Wire-to-Board, 2 Position, 8 mm [.315 in] Centerline, UMP Connector | Other | 2332664-4 |
3
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826646-2
TE Connectivity
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1 | Body Features: Primary Product Color Green | Configuration Features: Number of Rows 1 | Number of Positions 2 | PCB Mount Orientation Vertical | Board-to-Board Configuration Parallel | Connector Contact Load Condition Fully Loaded | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Mating Square Post Dimension .025 INCH | Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material | Header, Vertical | 826646-2 |
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1-2332664-1
TE Connectivity
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1 | Rectangular Power Connectors, Connector Assembly, Plug & Receptacle, Wire-to-Board, 2 Position, 8 mm [.315 in] Centerline, UMP Connector | Other | 1-2332664-1 |
3
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26640601RP2
NorComp
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1 | Connector Header Through Hole 6 position 0.079" (2.00mm | Header, Vertical | 26640601RP2 |
3
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TNETV2664ACLZWT
Texas Instruments
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1 | Digital Signal Processors & Controllers - DSP, DSC | BGA | TNETV2664ACLZWT |
3
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2626640000
Weidmüller
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1 | OMNIMATE Data - D-SUB connector, male header, Thread-bolt UNC 4-40, Snap-on clip, THT solder connection, Pitch in mm (P): 2.77 mm, Number of poles: 9, 500, PBT glass fibre reinforced UL 94 V-0, black, Tray (manual assembly) | Other | 2626640000 |
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826648-3
TE Connectivity
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1 | Body Features: Primary Product Color Green | Configuration Features: Board-to-Board Configuration Parallel | PCB Mount Orientation Vertical | Number of Positions 3 | Number of Rows 1 | Connector Contact Load Condition Fully Loaded | Contact Features: PCB Contact Termination Area Plating Material Thickness 3 MICM | Mating Square Post Dimension .63 MM | Contact Base Material Phosphor Bronze | Contact Type Pin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area | Header, Vertical | 826648-3 |
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MAX32664GWEB+T
Analog Devices
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1 | Biometric Sensors CORTEX M4F 96MHZ ME11, WLP, ALGO | BGA | MAX32664GWEB+T |
3
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MAX32664GWEA+T
Analog Devices
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1 | Ultra-Low Power Biometric Sensor Hub 16 BUMPS WLP PKG. 0.35 mm PITCH,W161K1+1 | BGA | MAX32664GWEA+T |
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