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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	TC264D40F200WBCKXUMA1 Infineon	1	IC MCU 32BIT 2.5MB FLASH 144TQFP	Quad Flat Packages	TC264D40F200WBCKXUMA1	3D model available Symbol and footprint available 3	1 Download Model
	R5F564MGHDBG#V1 Renesas Electronics	1	IC MCU 32BIT 2.5MB FLASH 176BGA	BGA	R5F564MGHDBG#V1	3D model available Symbol and footprint available 3	1 Download Model
	DS25MB200TSQ/NOPB Texas Instruments	1	Dual 2.5 Gbps 2:1/1:2 CML Mux/Buffer with Transmit Pre-Emphasis and Receive Equalization	Quad Flat No-Lead	DS25MB200TSQ/NOPB	3D model available Symbol and footprint available 3	1 Download Model
	DS125MB203SQE/NOPB Texas Instruments	1	12.5Gbps Dual Port MUX and Fanout Buffer	Quad Flat No-Lead	DS125MB203SQE/NOPB	3D model available Symbol and footprint available 3	1 Download Model

	F931V225MBE Kyocera AVX	1	Tantalum Capacitors - Solid SMD 35V 2.2uF 1210 Tol +/-20%	Capacitor Moulded Polarised	F931V225MBE	3D model available Symbol and footprint available 3	1 Download Model
	TC264DA40F200WBCKXUMA1 Infineon	1	32-Bit Microcontroller Tri Core 2.5MB Flash/ 752KB SRAM 200MHz 144-Pin PG-LQFP T/R - Tape and Reel	Quad Flat Packages	TC264DA40F200WBCKXUMA1	3D model available Symbol and footprint available 3	1 Download Model
	F931V225MBA Kyocera AVX	1	Tantalum Capacitors - Solid SMD 35V 2.2uF 20% 1211 ESR= 3.8 Ohms	Capacitor Moulded Polarised	F931V225MBA	3D model available Symbol and footprint available 3	1 Download Model
	DS125MB203SQ/NOPB Texas Instruments	1	12.5Gbps Dual Port MUX and Fanout Buffer	Quad Flat No-Lead	DS125MB203SQ/NOPB	3D model available Symbol and footprint available 3	1 Download Model
	F971E225MBAHT3 Kyocera AVX	1	AVX - F971E225MBAHT3 - CAP, TANT, AEC-Q200, 2.2UF, 25V, CASE B	Capacitor Moulded Polarised	F971E225MBAHT3	3D model available Symbol and footprint available 3	1 Download Model
	25MU225MB23225 Rubycon	1	CAP FILM 2.2UF 20% 25VDC 1210	Capacitor Chip Non-polarised	25MU225MB23225	3D model available Symbol and footprint available 3	1 Download Model
	DS25MB200TSQ Texas Instruments	1	MUX/Buffer	Other	DS25MB200TSQ	3D model available Symbol and footprint available 3	1 Download Model
	F971V225MBAHT3 Kyocera AVX	1	Tantalum Capacitors - Solid SMD 35V 2.2uF 20% 1210 ESR=3.8Ohm AEC-Q200	Capacitor Moulded Polarised	F971V225MBAHT3	3D model available Symbol and footprint available 3	1 Download Model
	SIM-S-IO3-MFF2-2-LP-RESELL_LP_125MB_1Y 1Global	1	Remote SIM provisioning compliant with GSMA M2M and SIMalliance specifications;• Inbuilt bootstrap connectivity profile;• Up to 10 operator profiles on a single eSIM;• Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks;• Network access applications supported: SIM / USIM / ISIM / CSIM;• Power saving features;• Secure element access control (ARF / PKCS#15);• OTA capability over SMS, CAT-TP & HTTPS (including DNS);• Multi-interfaces able to combine eSIM + eSE.	Small Outline No-lead	SIM-S-IO3-MFF2-2-LP-RESELL_LP_125MB_1Y	3D model available Symbol and footprint available 3	1 Download Model
	SPC5744PK1AMMM8 NXP	1	32-bit Microcontrollers - MCU NXP 32-bit MCU, Dual core Power Arch, 2.5MB Flash, 180MHz, -40/+125degC, MAPBGA 257	BGA	SPC5744PK1AMMM8	3D model available Symbol and footprint available 3	1 Download Model
	SPC5744PK1AMLQ5R NXP	1	32-bit Microcontrollers - MCU 2 x e200Z4 cores in LS, 150 MHz, 2.5MB Flash, 384kB SRAM, LQFP 144, 40 C to +125	Quad Flat Packages	SPC5744PK1AMLQ5R	3D model available Symbol and footprint available 3	1 Download Model

	SPC5744PGK1AMMM9 NXP	1	32-bit Microcontrollers - MCU 2 x e200Z4 cores in LS, 200 MHz, 2.5MB Flash, 384kB SRAM, MAPBGA 257, 1 x FlexRay, 1 x Ethernet, 40 C to +125 C	BGA	SPC5744PGK1AMMM9	3D model available Symbol and footprint available 3	1 Download Model
	HCPL-2200-300E Avago Technologies	1	Broadcom Optocoupler HCPL-2200-300E DC Input Logic Gate Output, 8-Pin DIP, Surface Mount	Other	HCPL-2200-300E	3D model available Symbol and footprint available 3	1 Download Model
	TLP2200 Toshiba	1	OPTOCOUPLER, PHOTOTRANSISTOR, 2500V; No. of Channels:1 Channel; Isolation Voltage:2.5kV; Data Rate:2.5Mbaud; Optocoupler Case Style:DIP; No. of Pins:8Pins; Product Range:-; Input Current:5mA; No. of Channels:1Channels RoHS Compliant: Yes	Dual-In-Line Packages	TLP2200	3D model available Symbol and footprint available 3	1 Download Model
	TLP2200(F) Toshiba	1	Toshiba, TLP2200(F) AC Input IC Output Optocoupler, Through Hole, 8-Pin DIP	Dual-In-Line Packages	TLP2200(F)	3D model available Symbol and footprint available 3	1 Download Model
	HCPL-2200-000E Avago Technologies	1	Optocoupler Logic-Out Three State DC-IN 1-CH 8-Pin PDIP Tube	Dual-In-Line Packages	HCPL-2200-000E	3D model available Symbol and footprint available 3	1 Download Model
	HCPL-2219-000E Avago Technologies	1	High Speed Optocouplers 5MBd 3750Vrms	Dual-In-Line Packages	HCPL-2219-000E	3D model available Symbol and footprint available 3	1 Download Model
	2.5MBX11 Lumberg Connect GmbH	1	Board Connector, 11 Contact(s), 1 Row(s), Female, 0.1 inch Pitch, IDC Terminal, Black Insulator, Plug		2.5MBX11	3D model not available Symbol and footprint not available 0	0 Build or Request
	2.5MBPH6 Lumberg Connect GmbH	1	Board Connector		2.5MBPH6	3D model not available Symbol and footprint not available 0	0 Build or Request
	2.5MB14 Lumberg Connect GmbH	1	Board Connector, 14 Contact(s), 1 Row(s), Female, Straight, 0.098 inch Pitch, Solder Terminal, Black Insulator, Plug		2.5MB14	3D model not available Symbol and footprint not available 0	0 Build or Request
	2.5MBX17 Lumberg Connect GmbH	1	Board Connector, 17 Contact(s), 1 Row(s), Female, 0.1 inch Pitch, IDC Terminal, Black Insulator, Plug		2.5MBX17	3D model not available Symbol and footprint not available 0	0 Build or Request
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