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164A12029X
Amphenol CONEC
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1 | 9 Position D-Sub Receptacle, Female Sockets Connector, 7.5A, 125V, 8.00µin (0.203µm), -55°C ~ 125°C | Other | 164A12029X |
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2029150-5
TE Connectivity
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1 | Configuration Features: Number of Positions 5 | PCB Mount Orientation Right Angle | Number of Signal Positions 0 | Number of Power Positions 5 | Number of Rows 1 | Contact Features: Contact Layout Inline | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Dimensions: Compatible Insulation Diameter Range 1.2 – 3.1 MM | Product Length 22.2 MM | PCB Thickness (Recomm | Other | 2029150-5 |
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2029056-5
TE Connectivity
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1 | Configuration Features: Contacts Preloaded Yes | Number of Positions 5 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Type Pin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) .069 INCH | Product Width 5.4 MM | PCB Thickness (Recommended) 1.78 MM | Product Length .874 INCH | Product Length 22.2 MM | Product Width .213 INCH | Con | Other | 2029056-5 |
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2029150-3
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Signal Positions 0 | Number of Power Positions 3 | Contact Features: Contact Retention Within Housing Without | Contact Layout Inline | Contact Current Rating (Max) 9 AMP | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Dimensions: Compatible Insulation Diameter Range .047 – .122 INCH | Compatible Insulation Diameter Range 1.2 â | Other | 2029150-3 |
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2029150-4
TE Connectivity
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1 | Configuration Features: Number of Signal Positions 0 | Number of Power Positions 4 | Number of Positions 4 | PCB Mount Orientation Right Angle | Number of Rows 1 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 9 AMP | Contact Layout Inline | Dimensions: Product Length 18 MM | Compatible Insulation Diameter (Max) 2.39 INCH | PCB Thickness (Recommended) | Other | 2029150-4 |
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2029054-5
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 5 | Number of Signal Positions 0 | Number of Power Positions 5 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Current Rating (Max) 9 AMP | Contact Layout Inline | Other | 2029054-5 |
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2029056-3
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | Number of Power Positions 3 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Type Pin | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Dimensions: | Other | 2029056-3 |
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2029151-3
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 3 | Number of Power Positions 3 | Contact Features: Contact Type Pin | Contact Retention Within Housing Without | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Dimensions: Connector Height 5.4 MM | Product Length .543 INCH | Compatible Insulation Diameter (Max) 2.39 INCH | Compatible Insulation Diamete | Other | 2029151-3 |
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TLIN2029DRBTQ1
Texas Instruments
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1 | LIN Transceivers Fault Protected Local Interconnect Network (LIN) Transceiver With Dominant State Timeout 8-SON -40 to 125 | Small Outline No-lead | TLIN2029DRBTQ1 |
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TLIN2029DQ1
Texas Instruments
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1 | Fault Protected Local Interconnect Network (LIN) Transceiver With Dominant State Timeout | Small Outline Packages | TLIN2029DQ1 |
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MH2029-800Y
Bourns
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1 | nt High resistance to heat and humiditynt Resistance to mechanical shock andt pressurent Accurate dimensions for automatict surface mountingnt Wide impedance rangent RoHS compliant* and halogen free** | Ferrite Bead Chip | MH2029-800Y |
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299-020-299-198
EDAC
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1 | 299 Series ClipZin SMT Card Edge Connector with 2.54mm contact spacing and 20 surface mount contacts. | Other | 299-020-299-198 |
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MH2029-221Y
Bourns
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1 | Ferrite Beads High Current Chip 220Ohm 25% 100MHz 2A 100mOhm DCR 0805 T/R | Ferrite Bead Chip | MH2029-221Y |
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164A12029X
CONEC
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1 | D-Sub Standard Connectors 9P DSUB SOCKET STRT THRU-HOLE | Other | 164A12029X |
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TLIN2029DRBRQ1
Texas Instruments
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1 | Fault Protected Local Interconnect Network (LIN) Transceiver With Dominant State Timeout | Small Outline No-lead | TLIN2029DRBRQ1 |
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MH2029-100Y
Bourns
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1 | BOURNS - MH2029-100Y - FERRITE BEAD, 0.1 OHM, 6A, 0805 | Ferrite Bead Chip | MH2029-100Y |
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MK20298G
Fischer Elektronik GmbH & Co. KG
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1 | male header | Other | MK20298G |
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2029030-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Signal Positions 0 | Number of Positions 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | PCB Contact Termination A | Other | 2029030-2 |
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2029397-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 3 | Number of Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Retention Within Housing Without | Contact Current Rating (Max) 12 AMP | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Layout Inline | PCB Contact Terminatio | Other | 2029397-1 |
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2029076-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 2 | Number of Rows 1 | Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.54 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 MICM | Contact Layout Inline | Contact | Other | 2029076-2 |
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1-2029059-6
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 16 Position, 4.2 mm [.165 in] Centerline, Fully Shrouded, Tin, Through Hole - Solder, Power, Natural, Tray | Other | 1-2029059-6 |
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MH2029-600Y
Bourns
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1 | Ferrite Beads 60 ohms 25% HIGH CURRENT | Ferrite Bead Chip | MH2029-600Y |
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009296002202906
Kyocera AVX
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1 | HORIZONTAL MOUNT POKE HOME CONNECTOR – 2 WAY | Other | 009296002202906 |
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LX2160XN72029B
NXP
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1 | Microprocessors - MPU Layerscape 64-bit Arm Cortex-A72, 16-core, 2.0GHz, -40 to 105C, Security disabled | BGA | LX2160XN72029B |
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009296004202906
Kyocera AVX
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1 | 4 Position Individual Wires Connector White Poke-In 20-26 AWG Surface Mount, Right Angle | Other | 009296004202906 |
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![Part Image](["https://componentsearchengine.com/2D/0T/20546713.1.10.png",null,null])
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