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21324
Molex
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1 | Barrier Strip Terminal Block, 30A, 2 Row(s), 1 Deck(s) | 21324 |
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21324
HELUKABEL
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1 | Wire And Cable, 6 Conductor(s), 24AWG, 500V, Communication Cable | 21324 |
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2132415-6
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 6 | Number of Rows 1 | Connector Contact Load Condition Fully Loaded | Contact Features: Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Mating Pin Diameter .6 MM | PCB Contact Termination Area Plating Material Thickness 2.032 MICM | Mating Pin Diameter .024 INCH | Contact Current Rating (Max) 4.2 AMP | Contact Mating Area Length 3.6 MM | Contact Mating Area | Other | 2132415-6 |
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2132415-4
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: Number of Positions 4 | Connector Contact Load Condition Fully Loaded | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 4.2 AMP | Mating Pin Diameter .024 INCH | Mating Pin Diameter .6 MM | Contact Mating Area Length .142 INCH | Contact Mating Area Plating Material Tin | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 2.032 MICM | Contact Shape & Form Roun | Header, Shrouded - Straight PTH Box | 2132415-4 |
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2132415-9
TE Connectivity
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1 | Headers & Wire Housings EP2.5 Shrouded HDR ASSY 9P VERT wo boss | Other | 2132415-9 |
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2132403-5
TE Connectivity
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1 | Configuration Features: Number of Positions 200 | Number of Ports 10 | Port Matrix Configuration 2 x 5 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Centerline (Pitch) .032 INCH | Centerline (Pitch) .8 MM | Cage | Other | 2132403-5 |
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2132415-8
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 8 | Number of Rows 1 | Connector Contact Load Condition Fully Loaded | Contact Features: PCB Contact Termination Area Plating Material Thickness 80 MICIN | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Base Material Brass | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2 – 5 MICM | Mating Pin Diameter .0 | Other | 2132415-8 |
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2132415-3
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: Number of Positions 3 | Number of Rows 1 | PCB Mount Orientation Vertical | Connector Contact Load Condition Fully Loaded | Contact Features: Contact Mating Area Length .142 INCH | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Finish Bright | Contact Mating Area Length 3.6 MM | Mating Pin Diameter .024 INCH | Contact Mating Area Plating Material Thickness 80 – 200 MICIN | PCB Contact Terminati | Other | 2132415-3 |
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2132415-2
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 2 | Connector Contact Load Condition Fully Loaded | Contact Features: PCB Contact Termination Area Plating Material Thickness 80 MICIN | Mating Pin Diameter .024 INCH | PCB Contact Termination Area Plating Material Thickness 2.032 MICM | Contact Shape & Form Round | Contact Mating Area Length 3.6 MM | Contact Mating Area Plating Material Finish Bright | Mating Pin Di | Other | 2132415-2 |
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2132403-8
TE Connectivity
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1 | SFP+, Cage Assembly with Integrated Connector, .8mm [.032in] Centerline, Signal, Operating Temperature Range -55 – 105 °C [-67 – 221 °F] | Other | 2132403-8 |
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R5F21324CNSP#30
Renesas Electronics
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1 | The R8C/32C Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324CNSP#30 |
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292132-4
TE Connectivity
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1 | Body Features: Primary Product Color Natural | Configuration Features: Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Vertical | Contact Features: Contact Type Pin | Mating Pin Diameter .6 MM | Contact Mating Area Length 4.2 MM | Contact Base Material Brass | PCB Contact Termination Area Plating Material Tin | Contact Shape & Form Round | Contact Mating Area Plating Material Thickness 1 MICM | Contact Mating Area Plating Material Finish Matte | Contact Shape & Form Rounded | Contact Layout | Header, Shrouded - Straight PTH Box | 292132-4 |
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R5F21324DNSP#54
Renesas Electronics
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1 | The R8C/32D Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324DNSP#54 |
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R5F21324DDSP#U0
Renesas Electronics
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1 | The R8C/32D Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324DDSP#U0 |
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R5F21324DDSP#54
Renesas Electronics
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1 | The R8C/32D Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324DDSP#54 |
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R5F21324DNSP#30
Renesas Electronics
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1 | The R8C/32D Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324DNSP#30 |
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R5F21324MNSP#54
Renesas Electronics
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1 | The R8C/32M Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32M Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324MNSP#54 |
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1-2132415-0
TE Connectivity
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1 | Conn Power (4 Sides) HDR 10 POS 2.5mm Solder ST Thru-Hole Bag | Header, Shrouded - Straight PTH Box | 1-2132415-0 |
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R5F21324CNSP#W4
Renesas Electronics
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1 | The R8C/32C Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324CNSP#W4 |
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R5F21324MNSP#30
Renesas Electronics
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1 | The R8C/32M Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32M Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324MNSP#30 |
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R5F21324CDSP
Renesas Electronics
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1 | Renesas Technology R5F21324CDSP, 16/32bit R8C Microcontroller, 20MHz, 16 kB ROM, 20-Pin LSSOP | Small Outline Packages | R5F21324CDSP |
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R5F21324DDSP#30
Renesas Electronics
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1 | The R8C/32D Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324DDSP#30 |
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1-292132-4
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 14 Position, 2 mm [.079 in] Centerline, Partially Shrouded, Tin (Sn), Through Hole - Solder, AMP CT | Other | 1-292132-4 |
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R5F21324CDSP#54
Renesas Electronics
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1 | The R8C/32C Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324CDSP#54 |
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R5F21324CDSP#30
Renesas Electronics
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1 | The R8C/32C Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.The R8C/32C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Small Outline Packages | R5F21324CDSP#30 |
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