21346 Model Download Search Results
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R5F21346UDFP#V0
Renesas Electronics
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1 | The R8C/34U Group is supported only for the customers who have already adopted these products. For new adoption, please consider other products such as RL78/G1C, RL78/L1C Group.The R8C/34P Group, R8C/34R Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumpt | Quad Flat Packages | R5F21346UDFP#V0 |
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R5F21346CDFP
Renesas Electronics
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1 | Renesas Technology R5F21346CDFP, 16/32bit R8C Microcontroller, 20MHz, 32 kB ROM, 48-Pin LQFP | Quad Flat Packages | R5F21346CDFP |
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R5F21346YKFP#U0
Renesas Electronics
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1 | MCU 16-bit R8C CISC 32KB Flash 3.3V/5V Automotive 48-Pin LQFP Tray | Quad Flat Packages | R5F21346YKFP#U0 |
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R5F21346CDFP#U0
Renesas Electronics
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1 | The R8C/34C Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/34C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Quad Flat Packages | R5F21346CDFP#U0 |
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1721346
Phoenix Contact
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1 | MKKDSH 3/ 3 - Printed circuit board terminal, nominal current: 24 A, rated voltage (III/2): 400 V, nominal cross section: 2.5 mm2, number of potentials: 3, number of rows: 1, number of positions per row: 3, product range: MKKDSH 3, pitch: 5 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 5 mm, number of solder pins per potential: 1, | Other | 1721346 |
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R5F21346CNFP#U0
Renesas Electronics
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1 | The R8C/34C Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/34C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Quad Flat Packages | R5F21346CNFP#U0 |
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R5F21346CNFP#50
Renesas Electronics
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1 | The R8C/34C Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/34C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Quad Flat Packages | R5F21346CNFP#50 |
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R5F21346CNFP#30
Renesas Electronics
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1 | The R8C/34C Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/34C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Quad Flat Packages | R5F21346CNFP#30 |
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R5F21346WJFP#U0
Renesas Electronics
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1 | 16-bit Microcontrollers - MCU R8C34W 32+4KB 2.7/5.5V -40TO+85C 48LQFP | Quad Flat Packages | R5F21346WJFP#U0 |
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R5F21346MNFP#V0
Renesas Electronics
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1 | The R8C/34M Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/34M Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supported operating modes allow | Quad Flat Packages | R5F21346MNFP#V0 |
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R5F21346UNFP#V0
Renesas Electronics
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1 | The R8C/34U Group is supported only for the customers who have already adopted these products. For new adoption, please consider other products such as RL78/G1C, RL78/L1C Group.The R8C/34P Group, R8C/34R Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumpt | Quad Flat Packages | R5F21346UNFP#V0 |
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M20-9721346
Harwin
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1 | M20: 13+13 Pos Plug DIL Straight 3mm THT Connector 7mm pin Tin | Other | M20-9721346 |
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R5F21346XJFP#U0
Renesas Electronics
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1 | 16-bit Microcontrollers - MCU R8C34X 32+4+2.5K -40~85C CAN AU 48LQFP | Quad Flat Packages | R5F21346XJFP#U0 |
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M20-7821346
Harwin
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1 | M20: 13 Pos Receptacle SIL Straight 3mm THT Connector 8.5mm high Tin | Other | M20-7821346 |
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21346C
Celestica Inc
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1 | Fast Page DRAM Module, 4MX64, 70ns, CMOS | 21346C |
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213464-000
CommScope Inc
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1 | Splitter/Coupler | 213464-000 |
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2134611-1
TE Connectivity
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1 | Body Features: Header Mating Direction Horizontal | Primary Product Color Natural | Configuration Features: Number of Positions 1 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3 MICM | Contact Fabrication Stamped & Formed | Contact Mating Area Plating Material Thickness 118 MICIN | PCB Contact Termination Area Plating Material Thickness 118.11 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Thickness 3 MICM | Conta | 2134611-1 |
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239072134641L
YAGEO Corporation
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1 | Fixed Resistor, Thin Film, 0.125W, 464ohm, 150V, 0.05% +/-Tol, -15,15ppm/Cel, 0805, | 239072134641L |
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M22-5521346R
Harwin
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1 | Board Connector, 26 Contact(s), 2 Row(s), Male, Straight, 0.079 inch Pitch, Surface Mount Terminal, Locking | M22-5521346R |
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621346254821
Wurth Elektronik
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1 | Board Connector | 621346254821 |
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1213-46-30-A
Singatron Enterprises Co
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1 | Board Connector, 46 Contact(s), 2 Row(s), Female, Straight, 0.079 inch Pitch, Solder Terminal, Plug | 1213-46-30-A |
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PLCS2C4121346
Laser Components USA Inc
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1 | Splitter/Coupler, 2X16 Port, ST/PC Connector, Rack Mount | PLCS2C4121346 |
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P9-221346
OTTO Engineering Inc
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1 | Pushbutton Switch, SPST, Momentary, 5A, 28VDC, 4 PCB Hole Cnt, Solder Terminal, Through Hole-straight | P9-221346 |
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PCF0402-13-464RBT1
TT Electronics Welwyn Components
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1 | Fixed Resistor, Thin Film, 0.063W, 464ohm, 25V, 0.1% +/-Tol, 5ppm/Cel, Surface Mount, 0402 | PCF0402-13-464RBT1 |
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MOX-2-134641FE
Ohmite Mfg Co
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1 | Fixed Resistor, Metal Glaze/thick Film, 3W, 4640ohm, 20000V, 1% +/-Tol, 25ppm/Cel, | MOX-2-134641FE |
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