21702 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	2170231-2 TE Connectivity	1	Standard Card Edge Connectors Hybrid Card Edge Power Connect	Other	2170231-2	3D model available Symbol and footprint available 3	1 Download Model
	2170286-1 TE Connectivity	1	Configuration Features: Number of Positions 160 \| Number of Ports 8 \| Port Matrix Configuration 2 x 4 \| Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Gold \| Dimensions: PCB Thickness (Recommended) .059 INCH \| PCB Thickness (Recommended) 1.5 MM \| Electrical Characteristics: Data Rate (Max) 4 GBS \| Housing Features: Centerline (Pitch) .8 MM \| Cage Material Nickel Silver \| Centerline	Other	2170286-1	3D model available Symbol and footprint available 3	1 Download Model
	5962-9221702MRA Renesas Electronics	1	The 5962-92217 (equivalent to IDT 54FCT373T) is an octal transparent latch with 3-state outputs and is intended for bus oriented applications. The flip-flops appear transparent to the data when Latch Enable (LE) is high. When LE is low, the data that meets the set-up time is latched. The 5962-92217 operates at -55C to +125C. (For commercial version, see 74FCT373T)	Ceramic Dual-In-Line Packages	5962-9221702MRA	3D model not available Symbol and footprint available 2	1 Download Model
	32.21.7.024.2300 FINDER	1	General Purpose Relay, 32 Series, Power, SPST-NO, 24 VDC, 6 A RoHS Compliant: Yes	Other	32.21.7.024.2300	3D model available Symbol and footprint available 3	1 Download Model

	5962-9221702MRA Texas Instruments	1	Latches Octal Transparent D-Type Latches with 3-State Outputs 20-CDIP -55 to 125	Ceramic Dual-In-Line Packages	5962-9221702MRA	3D model not available Symbol and footprint available 2	1 Download Model
	322170244000 FINDER	1	FINDER 32 Series Subminiature PCB relays 6 A	Other	322170244000	3D model available Symbol and footprint available 3	1 Download Model
	2170249-5 TE Connectivity	1	CONNECTOR ACCESSORY		2170249-5	3D model not available Symbol and footprint not available 0	0 Build or Request
	2170277-1 TE Connectivity	1	SFP+, HEATSINK		2170277-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	2170203 Lapp Group	1	Wire And Cable, 2 Conductor(s), 250V, Flexible Cord And Fixture Wire		2170203	3D model not available Symbol and footprint not available 0	0 Build or Request
	2170227-1 TE Connectivity	1	Body Features: Heat Sink Height Class PCI \| Heat Sink Height 4.2 MM \| Heat Sink Finish Anodized Black \| Heat Sink Style Pin \| Heat Sink Height .165 INCH \| Configuration Features: Port Matrix Configuration 1 x 1 \| Number of Rear EONs per Port Column 2 \| Number of Ports 1 \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Dimensions: PCB Thickness (Recommended) 1.45 MM \| PCB Thickness (Recommended) .057 INCH \| Electrical Characteristics: Data Rate (Max) 14 GBS \| Housing Features: Cage Mat		2170227-1	3D model available Symbol and footprint not available 1	1 Download Model
	2170207 LAPP	1	Wire And Cable,		2170207	3D model not available Symbol and footprint not available 0	0 Build or Request
	2170287-8 TE Connectivity	1	Body Features: Heat Sink Height Class SAN \| Heat Sink Height .256 INCH \| Heat Sink Style Fin \| Heat Sink Finish Anodized Black \| Configuration Features: Number of Rear EONs per Port Column 2 \| Port Matrix Configuration 1 x 4 \| Number of Ports 4 \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Dimensions: PCB Thickness (Recommended) 1.45 MM \| PCB Thickness (Recommended) .057 INCH \| Electrical Characteristics: Data Rate (Max) 14 GBS \| Housing Features: Cage Material Nickel Silver \| Indu		2170287-8	3D model available Symbol and footprint not available 1	1 Download Model
	2170289 LAPP	1	Wire And Cable, 4 Conductor(s), 26AWG, 125V, Communication Cable		2170289	3D model not available Symbol and footprint not available 0	0 Build or Request
	2170288-1 TE Connectivity	1	Configuration Features: Number of Ports 4 \| Number of Rear EONs per Port Column 2 \| Port Matrix Configuration 1 x 4 \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Dimensions: PCB Thickness (Recommended) .057 INCH \| PCB Thickness (Recommended) 1.45 MM \| Housing Features: Cage Material Nickel Silver \| Industry Standards: UL Flammability Rating UL 94V-0 \| Operation/Application: Heat Sink Compatible Yes \| Circuit Application Signal \| Pluggable I/O Applications SFP+ Stacked Belly-to-Bell		2170288-1	3D model available Symbol and footprint not available 1	1 Download Model
	2170256-1 TE Connectivity	1	Configuration Features: Port Matrix Configuration 1 x 1 \| Number of Ports 1 \| Number of Rear EONs per Port Column 5 \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Dimensions: PCB Thickness (Recommended) 1.45 MM \| PCB Thickness (Recommended) .057 INCH \| Housing Features: Cage Material Nickel Silver \| Industry Standards: UL Flammability Rating UL 94V-0 \| Operation/Application: Heat Sink Compatible No \| Circuit Application Signal \| Pluggable I/O Applications EMI Enhanced \| Other: Inclu		2170256-1	3D model available Symbol and footprint not available 1	1 Download Model

	2170269 Lapp Group	1	Wire And Cable, 2 Conductor(s), Communication Cable,		2170269	3D model not available Symbol and footprint not available 0	0 Build or Request
	2170273 Lapp Group	1	Wire And Cable, 4 Conductor(s), 24AWG, 250V, Communication Cable, HALOGEN FREE AND ROHS COMPLIANT		2170273	3D model not available Symbol and footprint not available 0	0 Build or Request
	2170272 Lapp Group	1	Wire And Cable, 2 Conductor(s), 250V, Communication Cable,		2170272	3D model not available Symbol and footprint not available 0	0 Build or Request
	2170217 Lapp Group	1	Wire And Cable,		2170217	3D model not available Symbol and footprint not available 0	0 Build or Request
	2170287-5 TE Connectivity	1	Body Features: Heat Sink Height Class SAN \| Heat Sink Height .256 INCH \| Heat Sink Finish Anodized Black \| Heat Sink Style Fin \| Configuration Features: Port Matrix Configuration 1 x 4 \| Number of Ports 4 \| Number of Rear EONs per Port Column 2 \| Contact Features: PCB Contact Termination Area Plating Material Tin \| Dimensions: PCB Thickness (Recommended) .057 INCH \| PCB Thickness (Recommended) 1.45 MM \| Electrical Characteristics: Data Rate (Max) 14 GBS \| Housing Features: Cage Material Nickel Silver \| Indu		2170287-5	3D model available Symbol and footprint not available 1	1 Download Model
	2170235 Lapp Group	1	Wire And Cable,		2170235	3D model not available Symbol and footprint not available 0	0 Build or Request
	2170298 Lapp Group	1	Wire And Cable,		2170298	3D model not available Symbol and footprint not available 0	0 Build or Request
	2170276 Lapp Group	1	Wire And Cable,		2170276	3D model not available Symbol and footprint not available 0	0 Build or Request
	2170209 Lapp Group	1	Wire And Cable, 6 Conductor(s), 250V, Communication Cable,		2170209	3D model not available Symbol and footprint not available 0	0 Build or Request
	2170264 Lapp Group	1	Wire And Cable, 4 Conductor(s), 22AWG, 250V, Communication Cable, ROHS COMPLIANT		2170264	3D model not available Symbol and footprint not available 0	0 Build or Request
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