27-66 Model Download Search Results
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SLVW10SMD12766G
Fischer Elektronik GmbH & Co. KG
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1 | Male Header, Surface Mount, UL 94 V-0, 66 Position, with locating pin | Other | SLVW10SMD12766G |
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SLVW10SMD12766Z
Fischer Elektronik GmbH & Co. KG
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1 | Male Header, Surface Mount, UL 94 V-0, 66 Position, with locating pin | Other | SLVW10SMD12766Z |
3
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C0402C103K4RAC31127665
Yageo Group
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1 | .010UF 16.0V | Other | C0402C103K4RAC31127665 |
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C0603C224K4RAC31127665
Yageo Group
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1 | Cap Ceramic 0.22uF 16V X7R 10% SMD 0603 125C | Capacitor Chip Non-polarised | C0603C224K4RAC31127665 |
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C0603C102K5RAC31127665
Yageo Group
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1 | Cap Ceramic 0.001uF 50V X7R 10% SMD 0603 125C | Other | C0603C102K5RAC31127665 |
3
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C0603C471J5GAC31127665
Yageo Group
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1 | CERAMIC CHIP CAPACITORS | Capacitor Chip Non-polarised | C0603C471J5GAC31127665 |
3
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ST10F276-6QR3
STMicroelectronics
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1 | 16-bit Microcontrollers - MCU 16-bit MCU 832 Kbyte Flash memory 68 Kbyt | Quad Flat Packages | ST10F276-6QR3 |
3
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2-2227669-1
TE Connectivity
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1 | zQSFP+, Cage Assembly with Integrated Connector, .8mm [.032in] Centerline, Signal, Operating Temperature Range -40 – 85 °C [-40 – 185 °F] | Other | 2-2227669-1 |
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LM2766M6/NOPB
Texas Instruments
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1 | 200kHz switched capacitor voltage converter | SOT23 (6-Pin) | LM2766M6/NOPB |
3
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C0402C180J5GAC31127665
Yageo Group
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1 | 18.0PF 50.0V | Other | C0402C180J5GAC31127665 |
3
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C0402C104K4RAC31127665
Yageo Group
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1 | Cap Ceramic 0.1uF 16V X7R 10% Pad SMD 0402 125°C | Other | C0402C104K4RAC31127665 |
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102766-4
TE Connectivity
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1 | 60 MODII VRT DR OE 100/115 | Other | 102766-4 |
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C0402C220J5GAC31127665
Yageo Group
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1 | Cap Ceramic 22pF 50V C0G 5% Pad SMD 0402 125°C Extreme Low ESR | Other | C0402C220J5GAC31127665 |
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C0603C681K5RAC31127665
Yageo Group
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1 | Cap Ceramic 680pF 50V X7R 10% Pad SMD 0603 125°C | Other | C0603C681K5RAC31127665 |
3
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232-766/047-000
Wago
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1 | THT female header; straight; Pin spacing 7.62 mm; 6-pole; Spacer flange; 0.6 x 1.0 mm solder pin | Other | 232-766/047-000 |
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1827663
Phoenix Contact
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1 | CCA 2,5/15-G-5,08 P26THR - PCB headers, nominal cross section: 2.5 mm2, color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 15, number of rows: 1, number of positions: 15, number of connections: 15, product range: CCA 2,5/..-G, pitch: 5.08 mm, connection method: Plug-in connection, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: | Other | 1827663 |
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TLP2766A
Toshiba
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1 | Photocoupler (photo-IC output), High-speed, 20 Mbps, 5000 Vrms, SO6L | Small Outline Packages | TLP2766A |
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TLP2766A(TP,E
Toshiba
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1 | High Speed Optocouplers High speed Logic output coupler; SO6L; RoHS; T&R | SOT23 (6-Pin) | TLP2766A(TP,E |
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LM2766M6X
Texas Instruments
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1 | IC REG SWITCHD CAP 2VIN SOT23 | SOT23 (6-Pin) | LM2766M6X |
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C0603C150J5GAC31127665
Yageo Group
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1 | Cap Ceramic 15.0pF 50.0V | Capacitor Chip Non-polarised | C0603C150J5GAC31127665 |
3
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227661-1
TE Connectivity
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1 | Body Features: Body Plating Material Nickel | Body Material Zinc | Configuration Features: Number of Coaxial Contacts 1 | Number of Positions 1 | PCB Mount Orientation Right Angle | Contact Features: RF Connector Center Contact Material Phosphor Bronze | RF Connector Center Contact Plating Material Tin | RF Connector Center Contact Underplating Material Nickel | Dimensions: Profile Height from PCB 15.88 MM | Mounting Post Length .137 INCH | RF Connector Mated Outer Diameter (Approximate) 14.53 MM | Profile | Other | 227661-1 |
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1027669
Phoenix Contact
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1 | SACC-DSI-FS-5CON-M16-L180 PP - Device connector rear mounting, 5-position, Socket, straight, M12-Push-pull external locking, A-coding, Wave soldering, this item is expected to be lead-free from Q2 2026 in accordance with RoHS II without exception 6c (Pb < 0.1%), a lead-free alternative is possible on request in advance | Other | 1027669 |
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2227667-2
TE Connectivity
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1 | Configuration Features: Number of Ports 4 | Port Matrix Configuration 2 x 2 | Number of Rear EONs per Port Column 0 | Number of Positions 152 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thickne | Other | 2227667-2 |
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ST10F276-6Q3
STMicroelectronics
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1 | 16-bit MCU with MAC unit, 832 Kbyte Flash memory and 68 Kbyte RAM | Quad Flat Packages | ST10F276-6Q3 |
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SLVW11SMD12766Z
Fischer Elektronik GmbH & Co. KG
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1 | Male Header, Surface Mount, UL 94 V-0 | Other | SLVW11SMD12766Z |
3
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![Part Image](["https://fischer.incony.de/pim/upload/fischerData/image/base/SLVW10SMD12766G.jpg","https://fischer.incony.de/pim/upload/fischerData/image/base/SLVW10SMD12766G.jpg",null])
![Part Image](["https://fischer.incony.de/pim/upload/fischerData/image/base/SLVW10SMD12766Z.jpg","https://fischer.incony.de/pim/upload/fischerData/image/base/SLVW10SMD12766Z.jpg",null])
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![Part Image](["https://componentsearchengine.com/2D/0/20430278.png",null,null])
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![Part Image](["https://toshiba.semicon-storage.com/content/dam/toshiba-ss-v3/master/en/semiconductor/design-development/package-detail/Pkg_img/SO6L.png","https://toshiba.semicon-storage.com/content/dam/toshiba-ss-v3/master/en/semiconductor/design-development/package-detail/Pkg_img/SO6L.png",null])
![Part Image](["https://componentsearchengine.com/Images/1/TLP2766A(TP,E.jpg",null,null])
![Part Image](["https://componentsearchengine.com/Images/9/LM2766M6X.jpg",null,"//content.supplyframe.com/images/process/fit-in/100x100/p/sot23_6.jpg"])
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![Part Image](["https://componentsearchengine.com/Images/1/2227667-2.jpg",null,null])
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![Part Image](["https://fischer.incony.de/pim/upload/fischerData/image/base/SLVW11SMD12766Z.jpg","https://fischer.incony.de/pim/upload/fischerData/image/base/SLVW11SMD12766Z.jpg",null])
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