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299-93-612-10-002000
Mill-Max
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1 | Conn DIP Socket SKT 12 POS 2.54mm Solder RA Thru-Hole Tube | Other | 299-93-612-10-002000 |
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299-93-308-10-001000
Mill-Max
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1 | Conn DIP Socket SKT 8 POS 2.54mm Solder RA Thru-Hole Tube | Other | 299-93-308-10-001000 |
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299-93-318-10-001000
Mill-Max
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1 | Conn DIP Socket SKT 18 POS 2.54mm Solder RA Thru-Hole Tube | Other | 299-93-318-10-001000 |
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299-91-RC
Xicon
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1 | Carbon Film Resistors - Through Hole 91ohms 5% | Resistors, Axial Diameter Horizontal Mounting | 299-91-RC |
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1829992
Phoenix Contact
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1 | MCD 1,5/ 6-G-3,81 - PCB headers, nominal cross section: 1.5 mm2, color: green, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 12, number of rows: 2, number of positions: 6, number of connections: 12, product range: MCD 1,5/..-G, pitch: 3.81 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.5 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern align | Other | 1829992 |
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DD02-999LF
Skyworks
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1 | LINEAR DETECTOR, 650MHZ MIN, 3000MHZ MAX, 36DBM INPUT POWER-MAX | SOT23 (6-Pin) | DD02-999LF |
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2529990000
Weidmüller
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1 | Hybrid connector (board connection), 7.62 mm, Number of poles: 4, Outgoing elbow: 90° | Other | 2529990000 |
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1722999214
Molex
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1 | Ultra-Fit Vertical Header, 3.50mm Pitch, Dual Row, 14 Circuits, with Solder Clips, 0.38µm Gold (Au) Plating, Natural, Glow-Wire Capable, Embossed Tape on Reel | Other | 1722999214 |
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2299940-6
TE Connectivity
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1 | I/O Connectors ZQSFP+ STACKED REC ASSEMBLY 2X1,HS | Other | 2299940-6 |
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2299924-3
TE Connectivity
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1 | Body Features: Heat Sink Finish Anodized Black | Heat Sink Style Fin | Heat Sink Height Class Custom | Heat Sink Height .265 INCH | Configuration Features: Number of Positions 228 | Number of Rear EONs per Port Column 3 | Port Matrix Configuration 2 x 3 | Number of Ports 6 | Contact Features: Contact Current Rating (Max) .5 AMP | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICM | Contact Mating Area Platin | Other | 2299924-3 |
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1722999114
Molex
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1 | Ultra-Fit Vertical Header, 3.50mm Pitch, Dual Row, 14 Circuits, with Solder Clips, Tin (Sn) Plating, Natural, Glow-Wire Capable, Embossed Tape on Reel | Other | 1722999114 |
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1722999204
Molex
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1 | Ultra-Fit Vertical Header, 3.50mm Pitch, Dual Row, 4 Circuits, with Solder Clips, 0.38µm Gold (Au) Plating, Natural, Glow-Wire Capable, Embossed Tape on Reel | Other | 1722999204 |
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2299940-5
TE Connectivity
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1 | Body Features: Heat Sink Style Fin | Heat Sink Height Class Custom | Heat Sink Height 6.77 MM | Heat Sink Finish Anodized Black | Heat Sink Height .266 INCH | Configuration Features: Number of Ports 2 | Number of Rear EONs per Port Column 3 | Port Matrix Configuration 2 x 1 | Number of Positions 76 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICM | PCB Contact Termination Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICIN | Contact Mating Area Pla | Other | 2299940-5 |
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SIT8008BC-12-18E-29.999250
SiTime
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1 | Low Power Programmable Oscillator | Other | SIT8008BC-12-18E-29.999250 |
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2299940-4
TE Connectivity
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1 | zQSFP+, Cage Assembly with Integrated Connector, .8mm [.032in] Centerline, Signal, Operating Temperature Range -40 – 85 °C [-40 – 185 °F] | Other | 2299940-4 |
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8T49N242-999NLGI#
Renesas Electronics
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1 | Quad Flat No-Lead | 8T49N242-999NLGI# |
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DS89C21TMX/J7002999
Texas Instruments
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1 | DS89C21 Differential CMOS Line Driver and Receiver Pair | Small Outline Packages | DS89C21TMX/J7002999 |
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1722999310
Molex
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1 | Ultra-Fit Vertical Header, 3.50mm Pitch, Dual Row, 10 Circuits, with Solder Clips, 0.76µm Gold (Au) Plating, Natural, Glow-Wire Capable, Embossed Tape on Reel | Other | 1722999310 |
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2086-1229/997-607
Wago
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1 | THR PCB terminal block; push-button; 1.5 mm²; Pin spacing 3.5 mm; 9-pole; Push-in CAGE CLAMP®; in tape-and-reel packaging | Other | 2086-1229/997-607 |
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1722999104
Molex
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1 | Ultra-Fit Vertical Header, 3.50mm Pitch, Dual Row, 4 Circuits, with Solder Clips, Tin (Sn) Plating, Natural, Glow-Wire Capable, Embossed Tape on Reel | Other | 1722999104 |
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1722999304
Molex
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1 | Ultra-Fit Vertical Header, 3.50mm Pitch, Dual Row, 4 Circuits, with Solder Clips, 0.76µm Gold (Au) Plating, Natural, Glow-Wire Capable, Embossed Tape on Reel | Other | 1722999304 |
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1722999314
Molex
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1 | Ultra-Fit Vertical Header, 3.50mm Pitch, Dual Row, 14 Circuits, with Solder Clips, 0.76µm Gold (Au) Plating, Natural, Glow-Wire Capable, Embossed Tape on Reel | Other | 1722999314 |
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SIT8944BM-23-33EA29.997000
SiTime
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1 | 1 – 110 MHz, -55 to 125°C, Endura™ Series Oscillator | Other | SIT8944BM-23-33EA29.997000 |
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2086-1129/997-607
Wago
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1 | THR PCB terminal block; push-button; 1.5 mm²; Pin spacing 3.5 mm; 9-pole; Push-in CAGE CLAMP®; in tape-and-reel packaging | Other | 2086-1129/997-607 |
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1722999210
Molex
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1 | Ultra-Fit Vertical Header, 3.50mm Pitch, Dual Row, 10 Circuits, with Solder Clips, 0.38µm Gold (Au) Plating, Natural, Glow-Wire Capable, Embossed Tape on Reel | Other | 1722999210 |
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