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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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3-338311-2
TE Connectivity
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1 | Body Features: Shell Plating Material Tin | Primary Product Color Black | Connector Profile Standard | Assembly Process Feature Material Phosphor Bronze | Configuration Features: Number of Rows 2 | Number of Positions 25 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Base Material Phosphor Bronze | Contact Shape & Form Round | Contact Mating Area | Other | 3-338311-2 |
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3-338310-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Connector Profile Standard | Assembly Process Feature Material Phosphor Bronze | Shell Plating Material Tin | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 15 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Shape & Form Round | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 6 AMP | Contact Mating Area Pla | Other | 3-338310-2 |
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3-338313-2
TE Connectivity
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1 | Body Features: Shell Plating Material Tin | Assembly Process Feature Material Phosphor Bronze | Primary Product Color Black | Connector Profile Standard | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 9 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Shape & Form Round | Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact Current R | Other | 3-338313-2 |
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3-338168-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Assembly Process Feature Material Phosphor Bronze | Shell Plating Material Tin | Insert Material Steel | Connector Profile Standard | Configuration Features: Number of Positions 9 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 6 AMP | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Shape & Form | Other | 3-338168-2 |
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3-338309-2
TE Connectivity
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1 | Body Features: Assembly Process Feature Material Phosphor Bronze | Shell Plating Material Tin | Primary Product Color Black | Connector Profile Standard | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 9 | Number of Rows 2 | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Shape & Form Round | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 6 AMP | PCB Contact Termination Area Pla | Other | 3-338309-2 |
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3-338169-2
TE Connectivity
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1 | Body Features: Assembly Process Feature Material Phosphor Bronze | Connector Profile Standard | Insert Material Steel | Shell Plating Material Tin | Primary Product Color Black | Configuration Features: Number of Rows 2 | Number of Positions 15 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Shape & Form Round | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 6 AMP | Contact Underplating Material Palla | Other | 3-338169-2 |
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3-338315-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Assembly Process Feature Material Phosphor Bronze | Connector Profile Standard | Shell Plating Material Tin | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 25 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Tin | Contact Shape & Form Round | Contact Current Rating (Max) 6 AMP | Contact Base Material Phosphor Bronze | Contact Mating Area Pl | Other | 3-338315-2 |
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ADP3338AKCZ-3-RL7
Analog Devices
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1 | Analog Devices ADP3338AKCZ-3-RL7, LDO Voltage Regulator, 1A, 3 V ±1.6%, 2.7 → 8 Vin, 3-Pin SOT-223 | SOT223 (3-Pin) | ADP3338AKCZ-3-RL7 |
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ADP3338AKCZ-3.3-RL
Analog Devices
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1 | LDO Voltage Regulator anyCAP 1A SOT223-3 Analog Devices ADP3338AKCZ-3.3-RL, LDO Voltage Regulator, 1.6A, 3.3 V ±0.8%, 2.7 → 8 Vin, 3 + Tab-Pin SOT-223 | SOT223 (3-Pin) | ADP3338AKCZ-3.3-RL |
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733-338/105-604
Wago
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1 | THR male header; 0.8 x 0.8 mm solder pin; straight; 100% protected against mismating; Pin spacing 2.5 mm; 8-pole | Other | 733-338/105-604 |
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1 | THR male header; 0.8 x 0.8 mm solder pin; straight; 100% protected against mismating; in tape-and-reel packaging; Pin spacing 2.5 mm; 8-pole | Other | 733-338/105-604/997-446 |
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733-338
Wago
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1 | THT male header; 0.8 x 0.8 mm solder pin; straight; 100% protected against mismating; Pin spacing 2.5 mm; 8-pole | Other | 733-338 |
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ADP3338AKCZ-2.5RL7
Analog Devices
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1 | IC REG LINEAR 2.5V 1A SOT223-3 | SOT223 (3-Pin) | ADP3338AKCZ-2.5RL7 |
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ADP3338AKCZ-2.85R7
Analog Devices
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1 | ANALOG DEVICES - ADP3338AKCZ-2.85R7 - LDO, FIXED, 2.85V, 1A, SOT-223-3 | SOT223 (3-Pin) | ADP3338AKCZ-2.85R7 |
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1333822
Phoenix Contact
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1 | LPTA 16/ 5-10,0-ZB - Printed circuit board terminal, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm2, number of potentials: 5, number of rows: 1, number of positions per row: 5, product range: LPTA 16/, pitch: 10 mm, connection method: Lever Push-in connection, mounting: Wave soldering, conductor/PCB connection direction: 30 °, color: green, Pin layout: Zigzag pinning W, Solder pin [P]: 3.6 mm, type of packaging: packed in cardboard | Other | 1333822 |
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ESW-133-38-F-D
SAMTEC
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1 | 66 Position, .100" Elevated Socket Strip, Double Row | Other | ESW-133-38-F-D |
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1333821
Phoenix Contact
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1 | LPTA 16/ 4-10,0-ZB - Printed circuit board terminal, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm2, number of potentials: 4, number of rows: 1, number of positions per row: 4, product range: LPTA 16/, pitch: 10 mm, connection method: Lever Push-in connection, mounting: Wave soldering, conductor/PCB connection direction: 30 °, color: green, Pin layout: Zigzag pinning W, Solder pin [P]: 3.6 mm, type of packaging: packed in cardboard | Other | 1333821 |
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ESW-133-38-E-D
SAMTEC
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1 | 66 Position, .100" Elevated Socket Strip, Double Row | Other | ESW-133-38-E-D |
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B41858C3338M002
TDK
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1 | Single-ended Capacitors, 3300μF/10VDC, 12.5mm dia x 25mm length | Capacitor, Polarized Radial Diameter | B41858C3338M002 |
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SLY11SMD13338Z
Fischer Elektronik GmbH & Co. KG
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1 | Dual Row, SMD, Male, Pitch 1.27mm, 38 Position | Other | SLY11SMD13338Z |
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SLY11SMD13338G
Fischer Elektronik GmbH & Co. KG
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1 | Dual Row, SMD, Male, Pitch 1.27mm, 38 Position | Other | SLY11SMD13338G |
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B43512A3338M080
TDK
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1 | Capacitors with 4-/5-pin Snap-in Terminals and Solder Pins, 3300µF/385V DC, 50mm dia x 95mm length | Other | B43512A3338M080 |
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SLY12SMD13338G
Fischer Elektronik GmbH & Co. KG
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1 | Dual Row, SMD, Male, Suitable for female headers BLY, Pitch 2 x 2mm, 38 Position | Other | SLY12SMD13338G |
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5054333891
Molex
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1 | 1.25mm Pitch, Micro-Lock Plus PCB Header, Dual Row, Vertical, Surface Mount, 0.10µm Gold Plating, Positive Lock, 38 Circuits, with Pick-and-Place Tape, Black | Other | 5054333891 |
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1333817
Phoenix Contact
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1 | LPTA 16/ 2-10,0-ZB - Printed circuit board terminal, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm2, number of potentials: 2, number of rows: 1, number of positions per row: 2, product range: LPTA 16/, pitch: 10 mm, connection method: Lever Push-in connection, mounting: Wave soldering, conductor/PCB connection direction: 30 °, color: green, Pin layout: Zigzag pinning W, Solder pin [P]: 3.6 mm, type of packaging: packed in cardboard | Other | 1333817 |
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