3-508 Model Download Search Results
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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SJ3-35083B-TR
Same Sky
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1 | 3.5 mm Stereo Jack, Through Hole, 3 Conductors, 1 Internal Switches, Tape & Reel Packaging | Other | SJ3-35083B-TR |
3
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B43508C5337M062
TDK
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1 | Aluminum Electrolytic Capacitors - Snap In 450VDC 330uF 20% PET 3 Terms 4.5mm | Other | B43508C5337M062 |
3
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MKDS 1.5/ 3-5.08
Phoenix Contact
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1 | Conn PC Terminal Block 3 POS 5.08mm Solder ST Thru-Hole 17.5A | Other | MKDS 1.5/ 3-5.08 |
2
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MV253-5,08-V-B
Altech
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1 | 3 Position Wire to Board Terminal Block Horizontal with Board 0.200" (5.08mm) Through Hole | Other | MV253-5,08-V-B |
2
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SJ3-35083A-TR
Same Sky
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1 | 3.5 mm Stereo Jack, Through Hole, 3 Conductors, 0 Internal Switches, Tape & Reel Packaging | Other | SJ3-35083A-TR |
3
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SJ3-35083C-TR
Same Sky
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1 | 3.5 mm Stereo Jack, Through Hole, 3 Conductors, 1 Internal Switches, Tape & Reel Packaging | Other | SJ3-35083C-TR |
3
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SJ3-35083D-TR
Same Sky
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1 | 3.5 mm Stereo Jack, Through Hole, 3 Conductors, 2 Internal Switches, Tape & Reel Packaging | Other | SJ3-35083D-TR |
3
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350832-1
TE Connectivity
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1 | Configuration Features: Number of Rows 1 | Number of Positions 3 | Number of Power Positions 3 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 12 AMP | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Retention Within Housing Without | Contact Layout Inline | PCB Contact Termination Area Plating Material Pre-Tin | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness 150 | Other | 350832-1 |
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MKDSN 2.5/ 3-5.08
Phoenix Contact
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1 | 3 Position Wire to Board Terminal Block Horizontal with Board 0.200" (5.08mm) Through Hole , 24 A , 400 V , 12-30 AWG | Other | MKDSN 2.5/ 3-5.08 |
2
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350825-4
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 3 Position, 6.35 mm [.25 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Universal MATE-N-LOK | Other | 350825-4 |
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AKZ700/3-5.08-V-GREEN
PTR HARTMANN GmbH
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1 | 3 Position Wire to Board Terminal Block Horizontal with Board 0.200" (5.08mm) Through Hole | Other | AKZ700/3-5.08-V-GREEN |
3
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350828-4
TE Connectivity
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1 | Configuration Features: Number of Positions 9 | PCB Mount Orientation Vertical | Number of Power Positions 9 | Number of Rows 3 | Contact Features: Contact Retention Within Housing Without | Multiple Contact Types Without | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Layout Matrix | Contact Underplating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plati | Other | 350828-4 |
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350825-1
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | Number of Power Positions 3 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 19 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 50 MICIN | C | Header, Shrouded - Straight PTH Box | 350825-1 |
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350835-1
TE Connectivity
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1 | Configuration Features: Number of Power Positions 9 | Number of Positions 9 | Number of Rows 3 | PCB Mount Orientation Vertical | Contact Features: Contact Type Socket | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Layout Matrix | Contact Retention Within Housing W | Other | 350835-1 |
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350830-1
TE Connectivity
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1 | Configuration Features: Number of Positions 15 | PCB Mount Orientation Vertical | Number of Power Positions 15 | Number of Rows 3 | Contact Features: Contact Current Rating (Max) 19 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Matrix | Contact Current Rating (Max) 12 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Mat | Other | 350830-1 |
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233-508
Wago
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1 | PCB terminal block; push-button; 0.5 mm²; Pin spacing 2.54 mm; 8-pole; CAGE CLAMP® | Other | 233-508 |
3
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2624-3508
Wago
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1 | PCB terminal block; 4 mm²; Pin spacing 11.5 mm; 8-pole; Push-in CAGE CLAMP® | Other | 2624-3508 |
3
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831-3508
Wago
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1 | THT female header; straight; Pin spacing 7.62 mm; 8-pole; 100% protected against mismating; 1.0 x 1.2 mm solder pin | Other | 831-3508 |
3
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EPC3508GE-LF
PCA
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1 | EPC3508GE-LF | Small Outline Packages | EPC3508GE-LF |
3
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NE3508M04-A
CEL
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1 | RF JFET Transistors L to S Band Lo Noise Amplifier N-Ch HJFET | Other | NE3508M04-A |
3
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GBPC3508W-G
Comchip Technology
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1 | Bridge Rectifiers GBPCW GPP 35A 800V Rect. Bridge Diode | Other | GBPC3508W-G |
3
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2604-3508
Wago
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1 | PCB terminal block; lever; 4 mm²; Pin spacing 11.5 mm; 8-pole; Push-in CAGE CLAMP® | Other | 2604-3508 |
3
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350-80-110-00-006101
Preci-Dip
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1 | Preci-Dip 350 Series, 2.54mm Pitch 10 Way 1 Row Straight PCB Header, Solder Termination, 3A | Header, Vertical | 350-80-110-00-006101 |
3
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LT3508IUF#PBF
Analog Devices
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1 | LINEAR TECHNOLOGY - LT3508IUF#PBF - DC/DC Switching Regulator, Buck, 2 Output, 3.7 V to 36 V in, 32.4 V/1.4 A out, 2.5 MHz, QFN-24 | Quad Flat No-Lead | LT3508IUF#PBF |
3
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15EGTVC-3.5-08P-14-00AH
Golten
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1 | 8 poles, pitch 3.5mm, height 9.1mm, green color, 300V, 8A, straight, mates with TLPS001 / TLPSZ001 3.5mm solder pin | Other | 15EGTVC-3.5-08P-14-00AH |
3
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