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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image
MP-3030-12ZH-30-80 Luminus Devices Inc.
1 High Power LEDs - White 3000K 80 CRI 30 LUMENS AT 65mA Other MP-3030-12ZH-30-80 1 Download Model
Part Image Part Image 1 Crystal, 20 MHz, SMD, 2.5mm x 2mm, 30 ppm, 8 pF, 30 ppm Other MCSJK-7E-20.00-8-30-80-B-30 1 Download Model
Part Image Part Image 1 Seoul Semicondutor 3030C 4-STEP 3000K 80 CRI R9>0 Other S1W0-3030308003-0000004S-00001 1 Download Model
Part Image Part Image 1 Hirose DF12, 0.5mm Pitch, 80 Way, 2 Row, Straight PCB Header, Surface Mount Other DF12D(3.0)-80DP-0.5V(81) 1 Download Model
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SCT3080ALGC11 ROHM Semiconductor
1 SCT3080ALGC11 SiC N-Channel MOSFET, 30 A, 650 V, 3-Pin TO-247N ROHM Transistor Outline, Vertical SCT3080ALGC11 1 Download Model
Part Image Part Image 1 Hirose DF40 Series 0.4mm Pitch 80 Way 2 Row Straight PCB Socket, Surface Mount, Solder Termination Other DF40HC(3.0)-80DS-0.4V(58) 1 Download Model
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LXZ2-3080-5 Lumileds
1 High Power LEDs - White Warm White, 3000K 5-Step, 80 CRI Other LXZ2-3080-5 1 Download Model
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LXZ1-3080-3 Lumileds
1 High Power LEDs - White Warm White, 3000K 3-Step, 80 CRI Other LXZ1-3080-3 1 Download Model
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30801.5 LITTELFUSE
1 1.5A 24 VAC 30 VDC Fuse Board Mount Surface Mount Fuses Moulded 30801.5 1 Download Model
Part Image Part Image 1 High Power LEDs - White Warm White 3000K 80 CRI Other L130-30800BHV00001 1 Download Model
Part Image Part Image 1 80 Position Connector Header, Outer Shroud Contacts Surface Mount Gold 8.00µin (0.203µm) Pitch 0.50mm Other DF12NB(3.0)-80DP-0.5V(51) 1 Download Model
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3-330808-8 TE Connectivity
1 Body Features: Sleeve Material Copper | Sleeve Plating Material Gold Flash over Nickel | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Base Material Beryllium Copper | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness 30 MICM | Contact Current Rating (Max) 3 AMP | Contact Spring Plating Material Gold | Contact Spring Plating Thickness .762 MICM | Contact Spring Plating Thickness 30 MICIN | Dimensions Other 3-330808-8 1 Download Model
Part Image Part Image 1 80 pins, unmated stacking height: 9.05 mm, for board-to-board distances from 10.8 to 15.4 mm, SMT, pitch 1.27 mm, Performance level 1, Parallel, Perpendicular, SMT, High Density, Rugged Other 404-53080-51 1 Download Model
Part Image Part Image 1 Obsolete - Schottky Power Rectifier, Dual, 30 A, 100 V Transistor Outline, Vertical NTSJ3080CTG 1 Download Model
Part Image Part Image 1 2.00mm Pitch Milli-Grid Header, Vertical, Surface Mount, Dual Row Dual Body, 30 Circuits, 0.025µm Gold (Au) Plating, 10.10mm Stacking Height, Tube, Lead-Free Other 0877623080 1 Download Model
Part Image Part Image 1 LUXEON 5050 High Power LED Emitter Warm White 3000K CCT 80 CRI 6.1 V 585 lm Typ Other L150-3080500600000 1 Download Model
Part Image Part Image 1 Easy-On FFC/FPC Connector, 0.40mm Pitch, FD4P Series, Right-Angle, Bottom Contact, 2.00mm Height, 80 Circuits, Gold over Nickel Plating Other 220363-0800 1 Download Model
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61308021121 Würth Elektronik
1 WR-PHD 2.54 mm Dual Row Pin Header 80 pins, dual Row , straight, gold plating Header, Vertical 61308021121 1 Download Model
Part Image Part Image 1 Easy-On FFC/FPC Connector, 0.40mm Pitch, FD4P Series, Right-Angle, Bottom Contact, 2.00mm Height, 80 Circuits, Gold over Nickel Plating Other 2203630800 1 Download Model
Part Image Part Image 1 Conn Shrouded Header HDR 80 POS 1.27mm Solder ST Top Entry SMD Reel Other 403-53080-51 1 Download Model
Part Image Part Image 1 80 pins, unmated stacking height: 9.05 mm, for board-to-board distances from 10.8 to 15.4 mm, SMT, pitch 1.27 mm, Performance level 1, Parallel, Perpendicular, SMT, High Density, Rugged Other 414-53080-51 1 Download Model
Part Image Part Image 1 80 pins, unmated stacking height: 7.85 mm, SMT, 0.8 mm pitch, Performance level 1, Parallel, SMT, High Density, High Speed, Rugged Other 406-53080-51 1 Download Model
Part Image Part Image 1 80 pins, unmated stacking height: 2.65 mm, SMT, 0.8 mm pitch, Performance level 1, Parallel, SMT, High Density, High Speed, Rugged Other 405-53080-51 1 Download Model
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2-330808-8 TE Connectivity
1 Body Features: Sleeve Material Copper | Sleeve Plating Material Gold Flash over Nickel | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Spring Plating Thickness 30 MICIN | Contact Current Rating (Max) 3 AMP | Contact Spring Plating Thickness .762 MICM | Contact Base Material Beryllium Copper | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Spring Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICM | Dimensions Other 2-330808-8 1 Download Model
Part Image Part Image 1 80 pins, unmated stacking height: 3.25 mm, for board-to-board distances from 9.5 to 18.4 mm, SMT, pitch 1.27 mm, Performance level 1, Parallel, Perpendicular, SMT, Cable-to-Board, High Density, Rugged Other 413-53080-51 1 Download Model
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