3094R Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	2309409-3 TE Connectivity	1	Small Outline (SO), 5.2 mm [.205 in] Stack Height, Right Angle Module Orientation, 260 Position, .5 mm [.02 in] Centerline, DDR4 DIMM, SO DIMM Sockets	Other	2309409-3	3D model available Symbol and footprint available 3	1 Download Model
	2309409-2 TE Connectivity	1	Body Features: Module Key Type Offset Left \| Ejector Type Locking \| Connector Profile Low \| Retention Post Location Both Ends \| Ejector Location Both Ends \| Latch Material High Temperature Thermoplastic \| Configuration Features: Number of Keys 1 \| Module Orientation Right Angle \| Number of Rows 2 \| Number of Positions 260 \| Contact Features: Contact Mating Area Plating Material Gold \| Contact Mating Area Plating Material Thickness 5 MICIN \| Memory Socket Type Memory Card \| Contact Current Rating (Max) .5 AM	Other	2309409-2	3D model available Symbol and footprint available 3	1 Download Model
	2309409-1 TE Connectivity	1	Small Outline (SO), Stack Height 5.2 mm [.205 in], Right Angle Module Orientation, 260 Position, DDR4 DIMM, SO DIMM Sockets	Other	2309409-1	3D model available Symbol and footprint available 3	1 Download Model
	2309407-3 TE Connectivity	1	Small Outline (SO), 4 mm [.157 in] Stack Height, Right Angle Module Orientation, 260 Position, .5 mm [.02 in] Centerline, DDR4 DIMM, SO DIMM Sockets	Other	2309407-3	3D model available Symbol and footprint available 3	1 Download Model

	2309409-5 TE Connectivity	1	Body Features: Latch Material High Temperature Thermoplastic \| Retention Post Location Both Ends \| Ejector Type Locking \| Ejector Location Both Ends \| Module Key Type Offset Left \| Connector Profile Low \| Configuration Features: Number of Positions 260 \| Number of Keys 1 \| Number of Rows 2 \| Module Orientation Right Angle \| Contact Features: Contact Base Material Copper Alloy \| Memory Socket Type Memory Card \| Contact Mating Area Plating Material Thickness 30 MICIN \| PCB Contact Termination Area Plating Mat	Other	2309409-5	3D model available Symbol and footprint available 3	1 Download Model
	2309408-1 TE Connectivity	1	Body Features: Latch Material High Temperature Thermoplastic \| Connector Profile Low \| Ejector Type Locking \| Retention Post Location Both Ends \| Ejector Location Both Ends \| Configuration Features: Number of Rows 2 \| Number of Keys 1 \| Module Orientation Right Angle \| Number of Positions 260 \| Contact Features: Memory Socket Type Memory Card \| PCB Contact Termination Area Plating Material Gold Flash \| Contact Base Material Copper Alloy \| Contact Mating Area Plating Material Gold Flash \| Contact Current Rat	Other	2309408-1	3D model available Symbol and footprint available 3	1 Download Model
	53309-4070 Molex	1	Molex 53309, 0.8mm Pitch, 40 Way, 2 Row PCB Header, Surface Mount	Other	53309-4070	3D model available Symbol and footprint available 3	1 Download Model
	2309407-1 TE Connectivity	1	Small Outline (SO), Stack Height 4 mm [.157 in], Right Angle Module Orientation, 260 Position, DDR4 DIMM, SO DIMM Sockets	Other	2309407-1	3D model available Symbol and footprint available 3	1 Download Model
	AEM30940-QFN E-PEAS	1	Power Management Specialized - PMIC RF or Vibration Harvesting PMIC	Quad Flat No-Lead	AEM30940-QFN	3D model available Symbol and footprint available 3	1 Download Model
	2309407-2 TE Connectivity	1	Body Features: Latch Material High Temperature Thermoplastic \| Ejector Type Locking \| Ejector Location Both Ends \| Module Key Type Offset Left \| Retention Post Location Both Ends \| Connector Profile Low \| Configuration Features: Number of Keys 1 \| Module Orientation Right Angle \| Number of Positions 260 \| Number of Rows 2 \| Contact Features: Contact Mating Area Plating Material Thickness .127 MICM \| Memory Socket Type Memory Card \| Contact Current Rating (Max) .5 AMP \| Contact Base Material Copper Alloy \| C	Other	2309407-2	3D model available Symbol and footprint available 3	1 Download Model
	EHH1100ETTTS-39.309406M-G Ecliptek Corporation	1	CMOS Output Clock Oscillator, 39.309406MHz Nom		EHH1100ETTTS-39.309406M-G	3D model not available Symbol and footprint not available 0	0 Build or Request
	EPH1100TSL-39.309406M Ecliptek Corporation	1	TTL Output Clock Oscillator, 39.309406MHz Nom		EPH1100TSL-39.309406M	3D model not available Symbol and footprint not available 0	0 Build or Request
	EMS21GHA-39.309406MTR Ecliptek Corporation	1	CMOS Output Clock Oscillator, 39.309406MHz Nom		EMS21GHA-39.309406MTR	3D model not available Symbol and footprint not available 0	0 Build or Request
	M39003/094054C KEMET Corporation	1	Tantalum Capacitor, Polarized, Tantalum (dry/solid), 35V, 10% +Tol, 10% -Tol, 22uF, Through Hole Mount		M39003/094054C	3D model not available Symbol and footprint not available 0	0 Build or Request
	72309-4040B Amphenol Communications Solutions	1	USB Connector, 4+4 Contact(s), Female, Right Angle, Solder Terminal, Receptacle		72309-4040B	3D model not available Symbol and footprint not available 0	0 Build or Request

	E2UMA30-9.409MTR Ecliptek Corporation	1	Parallel - Fundamental Quartz Crystal, 9.409MHz Nom		E2UMA30-9.409MTR	3D model not available Symbol and footprint not available 0	0 Build or Request
	19309-4080 Molex	1	Wire Terminal		19309-4080	3D model not available Symbol and footprint not available 0	0 Build or Request
	M39003/094083E KEMET Corporation	1	Tantalum Capacitor, Polarized, Tantalum (dry/solid), 50V, 5% +Tol, 5% -Tol, 22uF, Through Hole Mount		M39003/094083E	3D model not available Symbol and footprint not available 0	0 Build or Request
	EMK33H2H-39.309406MTR Ecliptek Corporation	1	CMOS Output Clock Oscillator, 39.309406MHz Nom		EMK33H2H-39.309406MTR	3D model not available Symbol and footprint not available 0	0 Build or Request
	EMS13GKF-39.309406MTR Ecliptek Corporation	1	CMOS Output Clock Oscillator, 39.309406MHz Nom		EMS13GKF-39.309406MTR	3D model not available Symbol and footprint not available 0	0 Build or Request
	EH5720TS-39.309406MTR Ecliptek Corporation	1	CMOS Output Clock Oscillator, 39.309406MHz Nom		EH5720TS-39.309406MTR	3D model not available Symbol and footprint not available 0	0 Build or Request
	M39003/09-4049 Vishay Intertechnologies	1	Tantalum Capacitor, Polarized, Tantalum (dry/solid), 20V, 10% +Tol, 10% -Tol, 82uF, Through Hole Mount		M39003/09-4049	3D model not available Symbol and footprint not available 0	0 Build or Request
	M39003/09-4073B/WR Vishay Intertechnologies	1	Tantalum Capacitor, Polarized, Tantalum (dry/solid), 50V, 5% +Tol, 5% -Tol, 10uF, Through Hole Mount		M39003/09-4073B/WR	3D model not available Symbol and footprint not available 0	0 Build or Request
	EMK32G2J-39.309406M Ecliptek Corporation	1	CMOS Output Clock Oscillator, 39.309406MHz Nom		EMK32G2J-39.309406M	3D model not available Symbol and footprint not available 0	0 Build or Request
	MRA0309402RC100PPMTA Arcol	1	Fixed Resistor, Metal Film, 0.5W, 402ohm, 350V, 0.25% +/-Tol, -100,100ppm/Cel,		MRA0309402RC100PPMTA	3D model not available Symbol and footprint not available 0	0 Build or Request
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