35043 Model Download Search Results
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350431-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Power Positions 6 | Number of Positions 6 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Mating | Other | 350431-1 |
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350430-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 4 | Number of Positions 4 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness .76 – .91 MICM | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 30 – 36 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating | Other | 350430-4 |
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350430-1
TE Connectivity
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1 | Configuration Features: Number of Power Positions 4 | Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Underplating Material Thickness 50 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Withi | Other | 350430-1 |
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350432-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 3 | Number of Power Positions 9 | Number of Positions 9 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Underplating Material Thickness 1.27 MICM | Contact Underplating Material Thickness 50 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Pre-Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 3.81 – | Other | 350432-1 |
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350434-1
TE Connectivity
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1 | Configuration Features: Number of Power Positions 15 | Number of Rows 3 | Number of Positions 15 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Layout Matrix | Contact Type Pin | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | Contact Underp | Other | 350434-1 |
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103-5043-EV
Mountain Switch
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1 | Slide Switches ON-ON-ON 6 PIN SP4T SMD T/R | Other | 103-5043-EV |
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535043-4
TE Connectivity
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1 | Configuration Features: Number of Rows 3 | Number of Columns 32 | Number of Signal Positions 96 | Rows Loaded A, B, C | PCB Mount Orientation Vertical | Number of Positions 96 | Dimensions: Row-to-Row Spacing 2.54 MM | Row-to-Row Spacing .1 INCH | Housing Features: Centerline (Pitch) 2.54 MM | Centerline (Pitch) .1 INCH | Mechanical Attachment: Connector Mounting Type Board Mount | Operation/Application: Circuit Application Signal | Product Type Features: DIN Size Standard | Connector & Housing Type Recepta | Other | 535043-4 |
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535043-5
TE Connectivity
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1 | TE Connectivity 535043 Series 96 Way 2.54mm Pitch, Type C Class C2, 3 Row a, b, c, Straight DIN 41612 Connector, Socket | Other | 535043-5 |
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55935-0430
Molex
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1 | Headers & Wire Housings 2.0 WtB Plg Hsg Assy Plg Hsg Assy RA 4Ckt | Other | 55935-0430 |
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3435-0-43-80-47-27-04-0
Mill-Max
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1 | Pin Receptacle Connector 0.025" ~ 0.036" (0.64mm ~ 0.91mm) No Tail Solder , -55°C ~ 125°C , 12A , 10 mΩ | Other | 3435-0-43-80-47-27-04-0 |
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5535043-4
TE Connectivity
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1 | Body Features: Primary Product Color Gray | Configuration Features: Number of Columns 32 | Number of Positions 96 | Number of Signal Positions 96 | Rows Loaded A, B, C | Number of Rows 3 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 1.5 AMP | Contact Mating Area Plating Material Thickness 1.27 MICM | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | Contact Type Socket | Dimensions: Row-to-Row Spacing .1 INCH | Row-to-Row Spacing 2.5 | Other | 5535043-4 |
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HI3-5043-5Z
Renesas Electronics
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1 | This family of CMOS analog switches offers low resistance switching performance for analog voltages up to the supply rails and for signal currents up to 80mA. ON resistance is low and stays reasonably constant over the full range of operating signal voltage and current. rON remains exceptionally constant for input voltages between +5V and -5V and currents up to 50mA. Switch impedance also changes very little over temperature, particularly between 0°C and 75°C. rON is nominally 25Ω for HI-5049 and HI-5051 an | Dual-In-Line Packages | HI3-5043-5Z |
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350434-1
TE's AMP
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1 | 15 CONTACT(S), MALE, COMBINATION LINE CONNECTOR, SOLDER, ROHS COMPLIANT | 350434-1 |
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350430-2
TE Connectivity
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1 | 4 CONTACT(S), MALE, COMBINATION LINE CONNECTOR, SOLDER | 350430-2 |
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350431-2
TE Connectivity
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1 | Combination Line Connector, 6 Contact(s), Male, Solder Terminal | 350431-2 |
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350433-1
TE Connectivity
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1 | Configuration Features: Number of Rows 3 | Number of Positions 12 | PCB Mount Orientation Vertical | Number of Power Positions 12 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Layout Matrix | Multiple Contact Types Without | Co | 350433-1 |
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350433-5
TE Connectivity
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1 | Rectangular Power Connector, 12 Contact(s), Male, Solder Terminal, Receptacle | 350433-5 |
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350434-4
TE Connectivity
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1 | Configuration Features: Number of Rows 3 | Number of Power Positions 15 | Number of Positions 15 | PCB Mount Orientation Vertical | Contact Features: Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 – 36 MICIN | Contact Mating Area Plating Material Gold | Contact Underplating Material Thickness 50 MICIN | Multiple Contact Types Without | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Are | 350434-4 |
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350436-2
TE Connectivity
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1 | Body Features: Product Weight .572 G | Configuration Features: Number of Holes 1 | Contact Features: Terminal Plating Material Tin | Contact Base Material Steel | Terminal Orientation Straight | Contact Underplating Material Nickel | Barrel Type Open | Dimensions: Compatible Insulation Diameter Range .105 – .145 INCH | Compatible Insulation Diameter (Min) .105 INCH | Stud Diameter .204 INCH | Wire Size 18 – 14 AWG | Wire Size .8 – 2 MMSQ | Compatible Insulation Diameter Range 2.67 – 3.68 MM | Stud D | 350436-2 |
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350434-4
TE's AMP
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1 | 15 CONTACT(S), MALE, COMBINATION LINE CONNECTOR, SOLDER, ROHS COMPLIANT | 350434-4 |
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350434-2
TE Connectivity
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1 | Combination Line Connector, 15 Contact(s), Male, Solder Terminal | 350434-2 |
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350433-2
TE Connectivity
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1 | Rectangular Power Connector, 12 Contact(s), Male, Solder Terminal | 350433-2 |
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350431-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 6 | Number of Power Positions 6 | Contact Features: Multiple Contact Types Without | Contact Layout Matrix | Contact Mating Area Plating Material Gold | Contact Retention Within Housing Without | Contact Underplating Material Thickness 50 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Underplating Material Thickness 1.27 MICM | PCB Contact Termination Area Plating Material Tin | 350431-4 |
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350433-4
TE Connectivity
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1 | Configuration Features: Number of Rows 3 | PCB Mount Orientation Vertical | Number of Positions 12 | Number of Power Positions 12 | Contact Features: Contact Retention Within Housing Without | Contact Layout Matrix | Contact Type Pin | Contact Mating Area Plating Material Thickness .76 – .91 MICM | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 50 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating | 350433-4 |
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350432-2
TE Connectivity
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1 | 9 CONTACT(S), MALE, COMBINATION LINE CONNECTOR, SOLDER | 350432-2 |
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![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/003/504/311/350431-1-t1.jpg/jcr:content/renditions/product-details.png","https://www.te.com/content/dam/te-com/catalog/part/003/504/311/350431-1-t1.jpg/jcr:content/renditions/product-details.png",null])
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