3539- Model Download Search Results
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BD3539FVM-TR
ROHM Semiconductor
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1 | Power Management Specialized - PMIC MEMORY IC REG | Small Outline Packages | BD3539FVM-TR |
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ESQ-135-39-T-T
SAMTEC
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1 | 105 Position, Elevated Socket Strip, 0.100" Pitch | Other | ESQ-135-39-T-T |
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ESW-135-39-F-D
SAMTEC
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1 | 70 Position, .100" Elevated Socket Strip, Double Row | Other | ESW-135-39-F-D |
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S-35390A-J8T1U
ABLIC Inc.
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1 | Real Time Clock Real Time Clock | Small Outline Packages | S-35390A-J8T1U |
3
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S-35390A-J8T1G
ABLIC Inc.
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1 | Real Time Clock Real Time Clock | Small Outline Packages | S-35390A-J8T1G |
3
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S-35392A-I8T1
Seiko Semiconductors
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0 | 2-WIRE REAL-TIME CLOCK | SO Transistor Flat Lead | S-35392A-I8T1 |
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FH35-39S-0.3SHW(99)
Hirose
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1 | CONN FPC TOP 39POS 0.30MM R/A | Other | FH35-39S-0.3SHW(99) |
3
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LTC3539EDCB#TRMPBF
Analog Devices
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1 | Linear Technology LTC3539EDCB#TRMPBF, Step Up DC-DC Converter, Adjustable, 1.5 → 5.25 V, 8-Pin DFN | Small Outline No-lead | LTC3539EDCB#TRMPBF |
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LTC3539EDCB-2#TRMPBF
Analog Devices
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1 | Switching Voltage Regulators 2A, 2MHz Synchronous Step-Up DC/DC Converter in 2mm x 3mm DFN Package | Small Outline No-lead | LTC3539EDCB-2#TRMPBF |
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ESQ-135-39-S-D
SAMTEC
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1 | 70 Position, Elevated Socket Strip, 0.100" Pitch | Other | ESQ-135-39-S-D |
2
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MAL217235392E3
Vishay
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1 | Aluminum Electrolytic Capacitors Radial Miniature, Low Impedance, Automotive Grade | Capacitor, Polarized Radial Diameter | MAL217235392E3 |
3
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15435394A9050
Würth Elektronik
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1 | WL-SIMW SMT Infrared Ceramic Waterclear 3535, Infrar red Typ.(@1A): 940nm, 650mW, 1.9V, 90° AlGaAs | Other | 15435394A9050 |
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70T3539MS133BCG
Renesas Electronics
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1 | The 70T3539M is a high-speed 512K x 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70T353M can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V. | BGA | 70T3539MS133BCG |
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ESW-135-39-L-D
SAMTEC
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1 | 70 Position, .100" Elevated Socket Strip, Double Row | Other | ESW-135-39-L-D |
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70T3539MS133BCI8
Renesas Electronics
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1 | The 70T3539M is a high-speed 512K x 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70T353M can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V. | BGA | 70T3539MS133BCI8 |
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ESW-135-39-S-D
SAMTEC
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1 | 70 Position, .100" Elevated Socket Strip, Double Row | Other | ESW-135-39-S-D |
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ESQ-135-39-G-D
SAMTEC
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1 | 70 Position, Elevated Socket Strip, 0.100" Pitch | Other | ESQ-135-39-G-D |
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ESQ-135-39-H-T
SAMTEC
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1 | 105 Position, Elevated Socket Strip, 0.100" Pitch | Other | ESQ-135-39-H-T |
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ESQ-135-39-L-S
SAMTEC
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1 | 35 Position, Elevated Socket Strip, 0.100" Pitch | Other | ESQ-135-39-L-S |
2
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ESW-135-39-T-D
SAMTEC
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1 | 70 Position, .100" Elevated Socket Strip, Double Row | Other | ESW-135-39-T-D |
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5353929-1
TE Connectivity
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1 | Body Features: Offset 4 MM | Shell Plating Material Tin over Nickel | Shell Plating Finish Bright | Connector Profile Standard | Configuration Features: Number of Positions 4 | Number of Mounting Legs 2 | Panel Ground Location Right/Left | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness 29.92 MICIN | Other | 5353929-1 |
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1935394
Phoenix Contact
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1 | PT 1,5/10-5,0-V - Printed circuit board terminal, nominal current: 17.5 A, rated voltage (III/2): 400 V, nominal cross section: 1.5 mm2, number of potentials: 10, number of rows: 1, number of positions per row: 10, product range: PT 1,5/..-V, pitch: 5 mm, connection method: Screw connection with wire protector, mounting: Wave soldering, conductor/PCB connection direction: 90 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packag | Other | 1935394 |
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70T3539MS166BCG
Renesas Electronics
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1 | The 70T3539M is a high-speed 512K x 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70T353M can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V. | BGA | 70T3539MS166BCG |
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ESQ-135-39-H-D
SAMTEC
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1 | 70 Position, Elevated Socket Strip, 0.100" Pitch | Other | ESQ-135-39-H-D |
2
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SLY303539G
Fischer Elektronik GmbH & Co. KG
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1 | Single Row, Male, Angled, Pitch 2.00mm, THT, 39 Position | Other | SLY303539G |
3
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![Part Image](["//media.rs-online.com/t_large/Y1717004-01.jpg",null,"//content.supplyframe.com/images/process/fit-in/100x100/p/soic_8.jpg"])
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