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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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4-794619-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 12 | Number of Positions 12 | Number of Rows 2 | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating | Other | 4-794619-2 |
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4-794680-6
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 16 | PCB Mount Orientation Vertical | Number of Power Positions 16 | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mati | Other | 4-794680-6 |
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4-794620-2
TE Connectivity
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1 | Configuration Features: Number of Positions 12 | Number of Power Positions 12 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | | Other | 4-794620-2 |
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4-794625-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 10 | Contact Features: Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Gold | | Other | 4-794625-0 |
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4-794633-0
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 10 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Tin, Surface Mount, Power, Black, Micro MATE-N-LOKnr | Other | 4-794633-0 |
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4-794680-4
TE Connectivity
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1 | Configuration Features: Number of Positions 14 | Number of Power Positions 14 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | | Other | 4-794680-4 |
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4-794630-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 16 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Thickn | Other | 4-794630-6 |
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4-794630-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 12 | Number of Power Positions 12 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | | Other | 4-794630-2 |
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4-794681-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 10 | Number of Rows 2 | Number of Signal Positions 0 | Number of Positions 10 | Contact Features: Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Mat | Other | 4-794681-0 |
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4-794618-8
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 18 | PCB Mount Orientation Right Angle | Number of Positions 18 | Contact Features: Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Other | 4-794618-8 |
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4-794680-8
TE Connectivity
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1 | Pin & Socket Connectors 18P MICRO MNL ASSY VRT,THRU LF | Other | 4-794680-8 |
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4-794620-6
TE Connectivity
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1 | Configuration Features: Number of Positions 16 | PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Power Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Retention Within Housing Without | PCB Contact Terminat | Other | 4-794620-6 |
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4-794632-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 16 | Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 16 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Gold | Multiple Contact Types Without | Header, Receptacle - Straight PTH Box | 4-794632-6 |
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4-794682-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | Number of Positions 10 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Multiple Contact Types Without | Contact Type Pin | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 4.81 MICM | Contact Retention Within Housing Without | Contact | Other | 4-794682-0 |
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4-794628-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 12 | PCB Mount Orientation Right Angle | Number of Positions 12 | Number of Rows 2 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Multiple Contact | Other | 4-794628-2 |
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4-794682-8
TE Connectivity
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1 | 18P MICRO MNL ASSY,VRT,THRU,L | Other | 4-794682-8 |
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4-794620-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 14 | Number of Positions 14 | Contact Features: Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | | Other | 4-794620-4 |
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4-794631-4
TE Connectivity
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1 | 14P MICRO MNL ASSY,VRT,HDR LF | Other | 4-794631-4 |
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4-794631-2
TE Connectivity
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1 | Configuration Features: Number of Positions 12 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Power Positions 12 | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Mating Area Plating Material Thickness 15 MICIN | Multiple Contact Types Without | Dimensions: PCB Th | Header, Receptacle - Straight PTH Box | 4-794631-2 |
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4-794680-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 12 | PCB Mount Orientation Vertical | Number of Positions 12 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | | Other | 4-794680-2 |
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4-794677-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 12 | PCB Mount Orientation Right Angle | Number of Positions 12 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | Other | 4-794677-2 |
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4-794618-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 16 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.8 MICM | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Type Pin | Contact Retention Within Ho | Other | 4-794618-6 |
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4-794630-0
TE Connectivity
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1 | Configuration Features: Number of Positions 10 | Number of Rows 2 | Number of Power Positions 10 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Curr | Other | 4-794630-0 |
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4-794680-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | Number of Positions 10 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Ma | Other | 4-794680-0 |
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4-794637-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 10 | Number of Rows 2 | Number of Power Positions 10 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Tin | Contact Type | Other | 4-794637-0 |
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