41.31 Model Download Search Results
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41.31.9.012.0010
FINDER
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1 | SPDT PCB Mount Non-Latching Relay Through Hole, 12V dc | Other | 41.31.9.012.0010 |
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713-1413/105-000
Wago
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1 | THR male header, 2-row; 0.8 x 0.8 mm solder pin; straight; 100% protected against mismating; Pin spacing 3.5 mm; 26-pole | Other | 713-1413/105-000 |
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2624-1311
Wago
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1 | PCB terminal block; 4 mm²; Pin spacing 7.5 mm; 11-pole; Push-in CAGE CLAMP® | Other | 2624-1311 |
3
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2624-1312
Wago
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1 | PCB terminal block; 4 mm²; Pin spacing 7.5 mm; 12-pole; Push-in CAGE CLAMP® | Other | 2624-1312 |
3
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2604-1311
Wago
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1 | PCB terminal block; lever; 4 mm²; Pin spacing 7.5 mm; 11-pole; Push-in CAGE CLAMP® | Other | 2604-1311 |
3
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MKP1841310635
Vishay
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1 | CAP FILM 10000PF 10% 630VDC RAD | Other | MKP1841310635 |
3
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505413-1410
Molex
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0 | Board to Board & Mezzanine Connectors SlimStack Conn .35mm FD19 BTM Cont 32Ckt | Other | 505413-1410 |
3
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105314-1310
Molex
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1 | MOLEX - 105314-1310 - WTB CONN, HEADER, 10POS, 2ROW, 2.5MM | Other | 105314-1310 |
3
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713-1413/117-000
Wago
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1 | THR male header, 2-row; 0.8 x 0.8 mm solder pin; straight; 100% protected against mismating; Threaded flange; Pin spacing 3.5 mm; 26-pole | Other | 713-1413/117-000 |
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1 | THR male header, 2-row; 0.8 x 0.8 mm solder pin; straight; 100% protected against mismating; in tape-and-reel packaging; Pin spacing 3.5 mm; 26-pole | Other | 713-1413/117-000/997-408 |
3
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NJW4131B
Nisshinbo
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1 | Switching Regulator IC for Boost Converter MSOP8(VSP8) | Small Outline Packages | NJW4131B |
2
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MCP4131-502E/P
Microchip
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1 | Potentiometer 5k, 128-step SPI, DIP8 MCP4131-502E/P, Digital Potentiometer 5kΩ 129-Position Linear Serial-SPI 8-Pin PDIP | Dual-In-Line Packages | MCP4131-502E/P |
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MCP4131T-103E/MF
Microchip
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1 | Digital Potentiometer ICs Digital Pot 128 step SPI Sngl Ch | Small Outline No-lead | MCP4131T-103E/MF |
3
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5054131010
Molex
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1 | TOP TAPE PEEL FORCE IS DEFINED BY IEC60286-3.5. MATERIALCARRIER TAPE : POLYSTYRENETOP TAPE : PET , OTH | Other | 5054131010 |
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PUCC14131QDWNQ1
Texas Instruments
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1 | UCC14131-Q1 Automotive 1.5-W, 12-V VIN / 12-VOUT, 15-V VIN / 15-V VOUT, High- Density, > 5-kVRMS, Isolated DC/DC Module | Small Outline Packages | PUCC14131QDWNQ1 |
3
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THS4131IDGN
Texas Instruments
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1 | Fully Differential Input/Output Low Noise Amplifier | Small Outline Packages | THS4131IDGN |
3
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THS4131CDGK
Texas Instruments
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1 | Texas Instruments THS4131CDGK, Differential Amplifier 225MHz 8-Pin MSOP | Small Outline Packages | THS4131CDGK |
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THS4131CDGNRG4
Texas Instruments
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1 | Differential Amplifiers Fully Differential I/O Low Noise Amp | Small Outline Packages | THS4131CDGNRG4 |
3
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THS4131IDGNR
Texas Instruments
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1 | Fully Differential Input/Output Low Noise Amplifier | Small Outline Packages | THS4131IDGNR |
3
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MCP4131-104E/P
Microchip
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1 | Digital POT | Dual-In-Line Packages | MCP4131-104E/P |
3
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LMK04131SQX/NOPB
Texas Instruments
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1 | IC 1.08GHz 1 48-WFQFN Exposed Pad | Quad Flat No-Lead | LMK04131SQX/NOPB |
3
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90584-1310
Molex
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1 | Headers & Wire Housings PICOFLEX IDT REC 10P PF-50 | Other | 90584-1310 |
3
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824-1-3-10-60
W+P Products
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1 | Type 1A (female) Vertical, RA Solder-in Jacks USB | Other | 824-1-3-10-60 |
3
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665104131822
Würth Elektronik
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1 | WR-WTB Wire-to-Board Connectors 1.00 mm SMT Male Horizontal Shrouded Header, 4 pins - Tape & Reel | Other | 665104131822 |
3
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643413-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 3 | Number of Rows 1 | Number of Power Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Pre-Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 12 AMP | Contact Layout Inline | Multiple Contact Types Without | Contact Type Socket | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Matin | Other | 643413-1 |
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