450-3 Model Download Search Results
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450-3704-01-06-00
CAMBION
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1 | Turret Solder / Press Mount Terminal, 1.93 mm, Gold, 5.24 mm, 4.78 mm, 450 | Other | 450-3704-01-06-00 |
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450-3293-01-03-00
CAMBION
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1 | SINGLE POLE SOCKETS - SOLDER MOUNT | Other | 450-3293-01-03-00 |
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450-3326-01-03-00
CAMBION
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1 | Turret Solder / Press Mount Terminal, Non Insulated, 2.59 mm, Gold, 5.41 mm, 4.95 mm | Other | 450-3326-01-03-00 |
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450-3703-01 03-00
CAMBION
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1 | SOCKET, FOR 0.64MM PIN, GOLD, SOLDER | Other | 450-3703-01 03-00 |
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10-84-5030
Molex
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1 | Molex 42002 Series, 6.35mm Pitch 3 Way 1 Row Straight PCB Header, Solder Termination, 20A | Other | 10-84-5030 |
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AST0450304
Metz Connect
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1 | 3 Position Wire to Board Terminal Block 45° (135°) Angle with Board 0.197" (5.00mm) Through Hole | Other | AST0450304 |
3
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CD4503BM
Texas Instruments
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1 | Texas Instruments CD4503BM, Hex, Buffer 3-State, Non-Inverting, 3 → 18 V, 16-Pin SOIC | Small Outline Packages | CD4503BM |
3
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CMT-0945-03-SMT-TR
Same Sky
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1 | CMT-0945-03-SMT-TR - 9 mm, 3 Vo-p, 85 dB, Surface Mount (SMT), Magnetic Audio Transducer Buzzer | Other | CMT-0945-03-SMT-TR |
3
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CD4503BE
Texas Instruments
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1 | CD4503BE, 6-Bit Buffer, Line Driver, 3-State Non-Inverting 3 → 18 V 16-Pin PDIP | Dual-In-Line Packages | CD4503BE |
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7448024503
Würth Elektronik
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1 | WE-CMBNC Common Mode Power Line Choke Size S; L = 3 mH; IR = 4.5 A; RDC = 22 mΩ | Other | 7448024503 |
3
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CD4503BDMSR
Renesas Electronics
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1 | CD4503BMS is a hex noninverting buffer with 3 state outputs that have high sink and source current capability. Two disable controls are provided, one of which controls four buffers and the other controls the remaining two buffers. The CD4503BMS is supplied in these 16-lead outline packages: Braze Seal DIP H4T, Frit Seal DIP H1E, Ceramic Flatpack H6W. | Dual-In-Line Packages | CD4503BDMSR |
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CD4503BKMSR
Renesas Electronics
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1 | CD4503BMS is a hex noninverting buffer with 3 state outputs that have high sink and source current capability. Two disable controls are provided, one of which controls four buffers and the other controls the remaining two buffers. The CD4503BMS is supplied in these 16-lead outline packages: Braze Seal DIP H4T, Frit Seal DIP H1E, Ceramic Flatpack H6W. | Small Outline Packages | CD4503BKMSR |
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234-503
Wago
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1 | PCB terminal block; push-button; 0.5 mm²; Pin spacing 2.54 mm; 3-pole; CAGE CLAMP® | Other | 234-503 |
3
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232-245/031-000
Wago
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1 | THT female header; angled; Pin spacing 5 mm; 15-pole; clamping collar; 0.6 x 1.0 mm solder pin | Other | 232-245/031-000 |
3
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345-036-520-202
EDAC
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1 | Standard Card Edge Connectors 36P .100" x .200" GR EEN | Other | 345-036-520-202 |
3
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201645-0360
Molex
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1 | Headers & Wire Housings Spot-On 1.5 DR HDR VRT 36P W/O NAIL NAT | Other | 201645-0360 |
3
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450301014042-ND
Würth Elektronik
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1 | EMI Gaskets, Sheets, Absorbers & Shielding | Other | 450301014042-ND |
3
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045036008210862+
Kyocera AVX
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1 | Memory Card Connectors 8P 1.27mm 0.5A 5V SIM card | Other | 045036008210862+ |
3
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MC35FS4503CAE
NXP
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1 | Power Management Specialized - PMIC Grade 0 safety CAN Buck/boost DC-DC | Quad Flat Packages | MC35FS4503CAE |
3
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232-145/031-000
Wago
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1 | THT female header; straight; Pin spacing 5 mm; 15-pole; clamping collar; 0.6 x 1.0 mm solder pin | Other | 232-145/031-000 |
3
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HCPL-4503-300E
Avago Technologies
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1 | 1MBd High Speed Optocoupler, DIP8GW Avago HCPL-4503-300E DC Input Photodiode Output Optocoupler, Surface Mount, 8-Pin DIP | Other | HCPL-4503-300E |
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201645-0320
Molex
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1 | Conn Shrouded HDR 32 POS 1.5mm Solder ST SMD Emboss T/R | Other | 201645-0320 |
3
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ET60S-D04-5-03-D04-S-R1-S
SAMTEC
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1 | Power to the Board .100" EXTreme Ten60Power 60 Amp Signal/Power Combo Socket Strip | Other | ET60S-D04-5-03-D04-S-R1-S |
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THS4503MDGNREP
Texas Instruments
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1 | Enhanced Product Wideband Low-Distortion Fully Differential Amplifier | Small Outline Packages | THS4503MDGNREP |
3
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THS4503IDGN
Texas Instruments
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1 | High-Speed Fully-Differential Amplifiers | Small Outline Packages | THS4503IDGN |
3
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