Part Image

THS4503IDGN - Texas Instruments

Description: High-Speed Fully-Differential Amplifiers

Download THS4503IDGN Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
THS4503IDGN - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D
click to zoom
3D Models
THS4503IDGN - Texas Instruments  - 3D model - Small Outline Packages - DGN0008D
click to zoom

THS4503IDGN Details

  • Manufacturer Part Number:

    THS4503IDGN

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    5.2 µA

  • Bandwidth (3dB)-Nom:

    30 MHz

  • Bias Current-Max (IIB) @25C:

    4.6 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    2 µA

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8.25 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.07 mm

  • Slew Rate-Nom:

    2800 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    28 mA

  • Supply Voltage Limit-Max:

    8.25 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    300000

  • Voltage Gain-Min:

    355

  • Wideband:

    YES

  • Width:

    3 mm

THS4503IDGN Frequently Asked Questions (FAQs)

  • A good PCB layout for the THS4503IDGN involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended PCB layout, use a low-ESR output capacitor, and add a series resistor (Rs) in the feedback path. Additionally, the gain and phase margins should be checked to ensure they meet the stability criteria.
  • The maximum power dissipation of the THS4503IDGN is dependent on the ambient temperature and the thermal resistance of the package. The power dissipation can be calculated using the formula: Pd = (Vcc x Icc) + (Vout x Iout). The maximum power dissipation can be found in the datasheet.
  • Yes, the THS4503IDGN can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is matched to the source impedance, and the output impedance is matched to the load impedance. Additionally, the gain bandwidth product should be considered to ensure stability.
  • To filter out high-frequency noise and EMI, it's recommended to use a low-pass filter at the input, such as an RC filter or a ferrite bead. Additionally, a shielded enclosure and a ground plane can help reduce EMI.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

THS4503IDGN Overview

Use the download button to access the THS4503IDGN schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like THS45, or try a keyword search, such as Operational Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to THS4503IDGN

Showing 0 results

THS4503IDGN Alternates

Showing results

Image Part Number Model
Part Image THS4503IDGNRG4 Texas Instruments

Operational Amplifier, 1 Func, 4000uV Offset-Max, BIPolar, PDSO8

Part Image THS4503IDGNG4 Texas Instruments

Operational Amplifier, 1 Func, 4000uV Offset-Max, BICMOS, PDSO8