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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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555-5303F
Dialight
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1 | 555 Series 2 mm Quad Top View CBI G,G,G,G 5 Volt | Other | 555-5303F |
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1755554
Phoenix Contact
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1 | ZFKKDSA 1,5C-5,0-10 - Printed circuit board terminal, nominal current: 16 A, rated voltage (III/2): 400 V, nominal cross section: 1.5 mm2, number of potentials: 20, number of rows: 2, number of positions per row: 10, product range: ZFKKDS(A) 1,5C, pitch: 5 mm, connection method: Spring-cage connection, mounting: Wave soldering, conductor/PCB connection direction: 45 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.7 mm, number of solder pins per potential: 1, type of packaging: pack | Other | 1755554 |
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1755558
Phoenix Contact
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1 | MSTBVA 2,5/ 6-G - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 6, number of rows: 1, number of positions: 6, number of connections: 6, product range: MSTBVA 2,5/..-G, pitch: 5 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.9 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignm | Other | 1755558 |
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555-5007F
Dialight
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1 | LED Circuit Board Indicators 2mm Quad CBI | Other | 555-5007F |
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1N5555
Microsemi Corporation
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1 | TVS DIODE 30.5V 47.5V DO13 | Diodes, Axial Diameter Horizontal Mounting | 1N5555 |
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WCM5555FASV-301-LM
TAI-TECH
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1 | 2 Line Common Mode Choke Surface Mount 300 Ohms @ 100 MHz 4.8A DCR 7.5mOhm | Other | WCM5555FASV-301-LM |
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55556-4
TE Connectivity
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1 | Conn Tab RCP 1 POS Press Fit ST Thru-Hole 10 Terminal 1 Port Bulk | Other | 55556-4 |
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5055558-4
TE Connectivity
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1 | Body Features: Terminal Profile Standard | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 10 | Contact Features: Contact Mating Area Plating Material Thickness 3.04 MICM | Contact Current Rating (Max) 37.8 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness .5 – 3.04 MICM | PCB Contact Termination Area Plating Material Thickness 20 – 120 MICIN | PCB Contact Termination A | Other | 5055558-4 |
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SLG55550V
Renesas Electronics
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1 | The SLG55550 is a USB device that combines high speed USB switches with a USB host charger (dedicated charger) identification circuit. The device supports both the latest USB Battery Charging Specification Revision 1.1 including data contact detection and a set resistor bias for Apple compliant devices as well as legacy USB D+/D- short detection using data line pull-up. | Small Outline No-lead | SLG55550V |
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5555162-1
TE Connectivity
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1 | Body Features: Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Low | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 8 | Connector Contact Density Standard | Number of Loaded Positions 8 | Port Configuration Single Port | Port Matrix Configuration 1 x 1 | Status Light Type Not Illuminated | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 1.27 MICM | Contact Mating Area Plating Materi | Other | 5555162-1 |
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5555163-5
TE Connectivity
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1 | J11 Connectors, Single Port, 1 x 1, Low Profile, RJ Type Jacks & Plugs, Standard Connector Contact Density, Jack, Standard | Other | 5555163-5 |
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5555149-1
TE Connectivity
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1 | Body Features: Shield Plating Material Nickel over Copper | Primary Product Color Black | Shield Plating Finish Bright | Connector Profile Low | Shield Material Zinc | Configuration Features: Number of Positions 50 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 3.5 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material | Other | 5555149-1 |
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FJB5555TM
onsemi
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1 | Bipolar (BJT) Transistor NPN 400V 5A 1.6W Surface Mount TO-263 (D2PAK) , 800mA , -55°C to +150°C | Other | FJB5555TM |
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ISOM5-555-R-L5
Bourns
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1 | IsoMOV 5KA 555Vrms Reel Crimped | Other | ISOM5-555-R-L5 |
3
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5055557-3
TE Connectivity
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1 | Power to the Board 10 POWER TAP ASSY .100 Dual Row | Other | 5055557-3 |
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JAN1N5555
Microsemi Corporation
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1 | ESD Suppressors / TVS Diodes 47.5V 32A Uni-Directional TVS | Diodes, Axial Diameter Horizontal Mounting | JAN1N5555 |
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555-5401F
Dialight
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1 | LED Circuit Board Indicators YELLOW DIFFUSED | Other | 555-5401F |
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5555153-6
TE Connectivity
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1 | Body Features: PCB Ground Tab Location 3.05 MM | PCB Ground Tab Location .12 INCH | Shield Material Copper Alloy | Shield Plating Material Tin | Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Low | Configuration Features: Number of Loaded Positions 8 | Port Configuration Single Port | Connector Contact Density Standard | Number of Positions 8 | PCB Mount Orientation Right Angle | Number of PCB Ground Tabs 2 | Status Light Type Not Illuminated | Port Matrix Configuration 1 x 1 | Con | Other | 5555153-6 |
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5555154-1
TE Connectivity
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1 | Body Features: Shield Material Copper Alloy | Modular Jack Latch Orientation Standard - Latch Down | PCB Ground Tab Location .12 INCH | PCB Ground Tab Location 3.05 MM | Connector Profile Low | Shield Plating Material Tin | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Positions 6 | Connector Contact Density Standard | PCB Mount Orientation Right Angle | Number of PCB Ground Tabs 2 | Port Configuration Single Port | Number of Loaded Positions 6 | Contact Features: Contact Current Ratin | Other | 5555154-1 |
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5555149-3
TE Connectivity
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1 | Body Features: Primary Product Color Black | Shield Plating Finish Bright | Connector Profile Low | Shield Material Die Cast Metal | Shield Plating Material Nickel over Copper | Configuration Features: Number of Positions 50 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 3.5 AMP | Dimensions: Row-to-Row Spacing 4.3 MM | | Other | 5555149-3 |
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SLG55550AV
Renesas Electronics
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1 | The SLG55550A is a USB device that combines high speed USB switches with a USB host charger (dedicated charger) identification circuit. The device supports both the latest USB Battery Charging Specification Revision 1.1 including data contact detection and a set resistor bias for Apple compliant devices as well as legacy USB D+/D- short detection using data line pull-up. | Small Outline No-lead | SLG55550AV |
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5555164-1
TE Connectivity
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1 | Body Features: Connector Profile Low | Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: Port Configuration Single Port | PCB Mount Orientation Right Angle | Port Matrix Configuration 1 x 1 | Number of Loaded Positions 8 | Status Light Type Not Illuminated | Number of Positions 8 | Connector Contact Density Standard | Contact Features: Contact Mating Area Plating Material Thickness 1.27 MICM | Contact Underplating Material Nickel | Contact Current Rating (Max) .2 AMP | Contact M | Other | 5555164-1 |
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5555165-1
TE Connectivity
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1 | Single Port, 1 x 1, Low Profile, RJ Type Jacks & Plugs, Jack, Standard - Latch Down, Right Angle, Cat 3, Through Hole - Solder, RJ25 Connectors | Other | 5555165-1 |
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5555003-1
TE Connectivity
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1 | MJ,R/A,6P,PNL,RH LTCH,GRY | Other | 5555003-1 |
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ISOM5-555-B-L2
Bourns
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1 | IsoMOV 5KA 555Vrms Bulk In-Line 40pF Maximum Clamping Voltage Vc=1400v Ic=100A disc=17mm | Other | ISOM5-555-B-L2 |
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